Abstract:
In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.
Abstract:
A plurality of semiconductor integrated circuits and a plurality of TEG circuits are aligned and provided on a substrate. In the TEG circuit, a built-in test circuit is provided in a region which faces a semiconductor integrated circuit across a dicing line region. The built-in test circuit and the semiconductor integrated circuit are connected by an interconnection which is provided on the dicing line region. The interconnection is cut for isolation into chips.
Abstract:
A monitor circuit for monitoring external potential EXTVDD and variable delay circuit determine the time interval in which signal ZODACT is being at the L level according to the potential level of external potential EXTVDD, and thus the supplying time of external potential EXTVDD can be dynamically changed. When external potential EXTVDD is at the upper limit of specification of product, the supplying time is short, thereby preventing overcharge of memory cells or bit lines. When external potential EXTVDD is at the lower limit of specification of product, the supplying time becomes longer, thereby ensuring a sufficient over-driving time interval. It is possible to ensure the reliability of the memory cells and perform the reading operation throughout the entire range of the specification of product of external potential EXTVDD. Therefore, it is possible to provide a semiconductor memory device capable of performing a reading operation at high speeds while ensuring the reliability.
Abstract:
In a solid electrolytic capacitor, an anode terminal (27 in FIG. 3) has a T-shaped section in which two plate pieces intersect at right angles. One of the two plate pieces is exposed to the mounting surface of the solid electrolytic capacitor, while the other is perpendicularly erected to an anode lead (11). The two plate pieces are made of a series of continuous members.
Abstract:
An amplifier circuit (R/A) conducts the first stage of ordering of whether to output data of four data bus pairs at the first half (first or second) or at the last half (third or fourth) based on the value of a signal EZORG1 reflecting the value of the least significant second bit of an externally applied column address. A switch circuit conducts the second stage of ordering to determine which is to be the first and the second of the two data output as the first half and to determine which is to be the third and the fourth of the two data output as the last half based on the value of a signal EZORG0 reflecting the value of the least significant bit in the externally applied column address.
Abstract:
An insulated gate type field effect transistor in a memory cell array is a transistor having a gate insulating film which is thicker than a gate insulating film of an insulated gate type field effect transistor in an array peripheral circuit. DRAM (Dynamic Random Access Memory) cell-based semiconductor memory device can be implemented which allows a burn-in test to be accurately performed without degrading sensing operation characteristics even under a low power supply voltage.
Abstract:
A semiconductor device includes a signal line and two adjacent wirings formed on a first substrate layer, an adjacent wiring formed on a second substrate layer, and an adjacent wiring formed on a third substrate layer. A logical level on the signal line is set constant, a first line capacitance is formed between the signal line and one of the adjacent wirings on the first substrate layer, and a second line capacitance is formed between the signal line and the other of adjacent wirings on the first substrate layer. Also, a signal is supplied to the adjacent wiring on the second substrate layer and the adjacent wiring on the third substrate layer. As a result, noise from the other adjacent wirings to the signal line can be reduced.
Abstract:
A semiconductor memory device has a half Vdds generating circuit. The half Vdds generating circuit includes reference voltage generating circuits, a selecting circuit, and a driver circuit. In a normal mode, the driver circuit receives voltages Vnd1 and Vpd1 obtained by dividing an array operation voltage Vdds from the reference voltage generating circuit and outputs a precharge voltage Vb1 from an output node. In a test mode, the driver circuit receives voltages Vnd2 and Vpd2 obtained by dividing the voltage Vddp from the reference-voltage generating circuit, and outputs a precharge voltage Vb1 from the output node. As a result, a voltage as a reference used to generate an intermediate voltage can be switched between the normal mode and the test mode.
Abstract:
A decoupling capacitor is coupled to a sense power supply line with respect to a sense amplifier circuit group, and the sense power supply line is selectively coupled with a power supply node in response to an operation mode of a sense amplifier. In a sensing operation, the potential of a bit line is determined by redistribution of charges between the decoupling capacitor and a load capacitor of the bit line. Refresh characteristics is improved without increasing a sense current and showing down the sensing operation.
Abstract:
Change in internal voltage on an internal voltage line is detected as discharging current of a capacitance element via an MOS transistor to change a charged voltage of the capacitance element. According to the charged voltage of the capacitance element, a current drive transistor is driven to supply a current to the internal voltage line. The internal voltage is stably generated with low current consumption and small occupation area.