摘要:
A method for manufacturing a compound semiconductor epitaxial substrate with few concave defects is provided. The method for manufacturing a compound semiconductor epitaxial substrate comprises a step of epitaxially growing an InGaAs layer on an InP single crystal substrate or on an epitaxial layer lattice-matched to the InP single crystal substrate under conditions of ratio of V/: 10-100, growth temperature: 630° C.-700° C., and growth rate: 0.6 μm/h-2 μm/h.
摘要:
A method for manufacturing a group III-V compound semiconductor represented by the general formula InxGayAlzN (where x+y+z=1, 0≦x≦1, 0≦y≦1, and 0≦z≦1) by metalorganic vapor phase epitaxy method is provided. The group III-V compound semiconductor has a semiconductor layer consisting of a p-type dopant-nondoped layer, and a semiconductor layer including a p-type dopant-doped layer. In the method, a reactor for growing the semiconductor layer consisting of a p-type dopant-nondoped layer and a reactor for doping a p-type dopant are mutually different.
摘要翻译:一种用通式InxGayAlzN(其中x + y + z =1,0,0≤x≤1,0<= y <= 1,0≤z≤1)表示的III-V族化合物半导体的制造方法, 1)通过金属有机气相外延法提供。 III-V族化合物半导体具有由p型掺杂剂非掺杂层构成的半导体层和包含p型掺杂剂掺杂层的半导体层。 在该方法中,用于生长由p型掺杂剂非掺杂层组成的半导体层的反应器和用于掺杂p型掺杂剂的反应器是相互不同的。
摘要:
A process for producing a Group III--V compound semiconductor represented by the general formula In.sub.x Ga.sub.y Al.sub.z N (provided that x+y+z=1, 0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1, and 0.ltoreq.z.ltoreq.1) employs a support member for forming the semiconductor, wherein the member constitutes SiC which is obtained by converting a graphite base material into SiC. In another embodiment, the member comprises a graphite-SiC composite wherein at least a surface layer part of a graphite substrate is converted into SiC. The member of the invention has superior chemical and mechanical stability, thereby making it useful in high-productivity production devices for making compound semiconductors.
摘要翻译:一种制备由通式In x Ga y Al z N表示的III-V族化合物半导体的方法(假定x + y + z =1,0,0≤x≤1,0,0≤y≤1,0 使用用于形成半导体的支撑构件,其中所述构件构成通过将石墨基底材料转化为SiC而获得的SiC。 在另一个实施方案中,所述构件包括石墨-SiC复合材料,其中至少石墨基底的表面层部分转化为SiC。 本发明的成员具有优异的化学和机械稳定性,从而使其在制备化合物半导体的高生产率生产装置中是有用的。
摘要:
Data is transmitted by using continuous frames each of which includes a variable-length part having a length that varies depending on an input period and a fixed-length part containing data of one input period. The transmitted continuous frames are received, a frame period is detected, and data is reproduced based on the detected frame period.
摘要:
An image-capturing element that receives light of a subject image entering within a camera body through an interchangeable photographic lens is packaged and is mounted at the camera body via a holder. A camera-side mounting surface and a holder-side mounting surface are machined in advance and formed respectively relative to the mounting surface for the photographic lens formed at the camera body and the light-receiving surface of the image-capturing element. By mounting the image-capturing apparatus with the camera-side mounting surface and the holder-side mounting surface placed in contact with each other at the camera body using screws, the light-receiving surface is aligned with the image-forming position of the photographic lens.
摘要:
Data is transmitted by using continuous frames each of which includes a variable-length part having a length that varies depending on an input period and a fixed-length part containing data of one input period. The transmitted continuous frames are received, a frame period is detected, and data is reproduced based on the detected frame period.
摘要:
A thin-film semiconductor epitaxial substrate comprising a substrate and a sub-collector layer, a collector layer, a base layer and an emitter layer(s) which are formed as thin-film semiconductor epitaxial layers on said substrate, wherein boron (B) added is present in at least a part of a layer portion comprising said sub-collector layer and said collector layer.
摘要:
An image-capturing element that receives light of a subject image entering within a camera body through an interchangeable photographic lens is packaged and is mounted at the camera body via a holder. A camera-side mounting surface and a holder-side mounting surface are machined in advance and formed respectively relative to the mounting surface for the photographic lens formed at the camera body and the light-receiving surface of the image-capturing element. By mounting the image-capturing apparatus with the camera-side mounting surface and the holder-side mounting surface placed in contact with each other at the camera body using screws, the light-receiving surface is aligned with the image-forming position of the photographic lens.
摘要:
Disclosed is an electrode material for Group III-V compound semiconductor represented by the general formula In.sub.x Ga.sub.y Al.sub.z N (provided that x+y+z=1, 0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1, and 0.ltoreq.z.ltoreq.1) doped with a p-type impurity which is capable of obtaining good ohmic contact, and an electrode using the same, thereby making it possible to reduce a driving voltage of a device using the compound semiconductor. The electrode material is a metal comprising at least Ca and a noble metal, wherein the total amount of the weight of Ca and the noble metal is not less than 50% by weight and not more than 100% by weight based on the weight of the whole electrode material.
摘要翻译:公开了由通式In x Ga y Al z N表示的用于III-V族化合物半导体的电极材料(假定x + y + z =1,0,0≤x≤1,0≤y≤1,和 掺杂有能够获得良好的欧姆接触的p型杂质,以及使用其的电极,从而可以降低使用化合物半导体的器件的驱动电压。 电极材料是至少包含Ca和贵金属的金属,其中Ca和贵金属的重量总量不小于50重量%且不大于100重量%,基于 整个电极材料。
摘要:
A digital camera includes: a mirror box that defines a space in which a light flux from a photographic lens is guided to an imaging unit; a mirror unit that is arranged inside the mirror box and is configured to rotate between a viewing position in which the mirror unit is inserted in a photographic light path from the photographic lens to the imaging unit to reflect the light flux and a photographing position in which the mirror unit is retracted from the photographic light path; and an opening section that discharges from the mirror box air that is moved when the mirror unit is rotated.