摘要:
A FET has a shallow source/drain region, a deep channel region, a gate stack and a back gate that is surrounded by dielectric. The FET structure also includes halo or pocket implants that extend through the entire depth of the channel region. Because a portion of the halo and well doping of the channel is deeper than the source/drain depth, better threshold voltage and process control is achieved. A back-gated FET structure is also provided having a first dielectric layer in this structure that runs under the shallow source/drain region between the channel region and the back gate. This first dielectric layer extends from under the source/drain regions on either side of the back gate and is in contact with a second dielectric such that the back gate is bounded on each side or isolated by dielectric.
摘要:
A semiconductor structure that may be a discrete capacitor, a Silicon On Insulator (SOI) Integrated Circuit (IC) including circuits with discrete such capacitors and/or decoupled by such discrete capacitors and an on-chip decoupling capacitor (decap). One capacitor plate may be a well (N-well or P-well) in a silicon bulk layer or a thickened portion of a surface silicon layer. The other capacitor plate may be doped polysilicon and separated from the first capacitor plate by capacitor dielectric, e.g., CVD or thermal oxide. Contacts to each of the capacitor plates directly connect and extend from the respective plates, such that direct contact is available from both plates.
摘要:
An ESD protection method and apparatus are provided for an IC chip having an I/O pad and I/O circuitry coupled to the I/O pad. A low threshold voltage FET is coupled to the I/O pad in parallel with the I/O circuitry for protecting the IC chip from an ESD event on the I/O pad. The FET also is coupled to a first voltage terminal of the I/O circuitry for providing a shunting path for the ESD event, thereby effectuating the protecting of the IC chip from the ESD event on the I/O pad. A first control circuit is coupled to a gate of the FET for maintaining the gate at a voltage level below a threshold voltage of the FET, thereby maintaining the FET in an off state during normal operation of the IC chip. Preferably a second control circuit is coupled between the FET and the first voltage terminal and operates in conjunction with the first control circuit for maintaining the FET in an off state during normal operation of the IC chip. The first control circuit preferably comprises a short circuit between the gate of the FET and the first voltage terminal, an inverter coupled between the gate of the FET and a second voltage terminal or a negative bias generator coupled to the gate of the FET. The second control circuit preferably comprises a short circuit between the FET and the first voltage terminal or a diode coupled between the FET and the first voltage terminal.
摘要:
A nonvolatile memory cell comprises a conductive cantilever beam having a free end in a first charge state, a first FET having a conductive gate in a second charge state and a pull-in electrode adapted to bring the cantilever beam into electrical contact with the gate to effect a charge state change in the gate. A pull-in electrode input is connected to the electrode, a cantilever input is connected to the cantilever, a column select input is connected to the first FET and a row select input is connected to the first FET. The nonvolatile memory cell is selected by signals applied to the row select input and the column select input. The cell also includes a second FET connected between the cantilever beam and the cantilever input for controlling the passage of signals from the cantilever input to the cantilever beam and a third FET connected between the pull-in electrode and the pull-in electrode input for controlling the passage of signals from the pull-in electrode input to the electrode. The second FET and third FET have gates connected to the row select input. The row select input turns on the second FET and the third FET to allow the passage of signals from the pull-in electrode input to the pull-in electrode and from the cantilever input to the cantilever beam when the nonvolatile memory cell is selected.
摘要:
The disclosure relates to the analysis of compensated layout shapes. A method in accordance with an embodiment includes: analyzing a semiconductor layout using a bucket structure, the layout including a semiconductor device; and applying a pattern template to a content of the bucket structure to identify a shape adjacent to the semiconductor device; wherein the pattern template is derived from layout groundrules.
摘要:
A layout of a semiconductor circuit is analyzed to calculate layout-dependant parameters that can include a mobility shift and a threshold voltage shift. Layout-dependant effects that affect the layout dependant parameters may include stress effects, rapid thermal anneal (RTA) effects, and lithographic effects. Intrinsic functions that do not reflect the layout-dependant effects are calculated, followed by calculation of scaling modifiers based on the layout-dependant parameters. A model output function that reflects the layout-dependant effects is obtained by multiplication of each of the intrinsic functions with a corresponding scaling parameter.
摘要:
Gate electrodes are formed on a semiconducting carbon nanotube, followed by deposition and patterning of a hole-inducing material layer and an electron inducing material layer on the carbon nanotube according to the pattern of a one dimensional circuit layout. Electrical isolation may be provided by cutting a portion of the carbon nanotube, forming a reverse biased junction of a hole-induced region and an electron-induced region of the carbon nanotube, or electrically biasing a region through a dielectric layer between two device regions of the carbon nanotube. The carbon nanotubes may be arranged such that hole-inducing material layer and electron-inducing material layer may be assigned to each carbon nanotube to form periodic structures such as a static random access memory (SRAM) array.
摘要:
A method of forming a transistor patterns a semiconductor fin on a substrate, such that the fin extends from the substrate. Then, the method forms a gate conductor over a central portion of the fin, leaving end portions of the fin exposed. Next, the end portions of the fin are doped with at least one impurity to leave the central portion of the fin as a semiconductor and form the end portions of the fin as conductors. The end portions of the fin are undercut to disconnect the end portions of the fin from the substrate, such that the fin is connected to the substrate along a central portion and is disconnected from the substrate along the end portions and that the end portions are free to move and the central portion is not free to move. A straining layer is formed on a first side of the fin and the straining layer imparts physical pressure on the fin such that the end portions are permanently moved away from a straight-line orientation with the central portion after the forming of the straining layer. Thus, the undercutting in combination with the forming of the straining layer curves the fin such that, when viewed from a top of the substrate, the fin is bowed and has a curved shape.
摘要:
A FET structure is provided in which at least one stressor element provided at or near one corner of an active semiconductor region applies a stress in a first direction to one side of a channel region of the FET to apply a torsional stress to the channel region of the FET. In a particular embodiment, a second stressor element is provided at or near an opposite corner of the active semiconductor region to apply a stress in a second direction to an opposite side of a channel region of the FET, the second direction being opposite to the first direction. In this way, the first and second stressor elements cooperate together in applying a torsional stress to the channel region of the FET.