公开(公告)号：US07417327B2

公开(公告)日：2008-08-26

申请号：US11262907

申请日：2005-10-31

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/02 ,  H01L23/12

CPC classification number: H01L23/055 ,  H01L23/10 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An IC (integrated circuit) chip package includes a substrate (2), a chip (3), a plurality of bonding wires (32), and a cover (5). The substrate has a top surface, a bottom surface, a receiving chamber (23) defined therein, a plurality of solder pads (24) arranged around the top surface and the bottom surface, and a plurality of vias (25) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.

Abstract translation: IC（集成电路）芯片封装包括基板（2），芯片（3），多个接合线（32）和盖（5）。 衬底具有顶表面，底表面，限定在其中的接收室（23），围绕顶表面和底表面布置的多个焊盘（24），以及多个通孔（25），其具有导电材料 将顶部焊盘与其中限定的底部焊盘连接。 芯片安装在接收室中，并且具有围绕其顶表面布置的多个芯片焊盘。 接合线分别将衬底的顶部焊盘与芯片焊盘电连接。 盖被固定到基板的顶表面以覆盖开口，并且具有比基板更小的轮廓，从而不覆盖顶表面的周边区域。

公开(公告)号：US20080105819A1

公开(公告)日：2008-05-08

申请号：US11617627

申请日：2006-12-28

Applicant: YING-CHENG WU ,  CHUN-HUNG LIN

Inventor： YING-CHENG WU ,  CHUN-HUNG LIN

IPC: H01L31/0203 ,  H01L31/0232

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L2224/8592

Abstract: An image sensor package (110) includes a base board (111), a supporter (113), an image sensor (112), a plurality of wires (114), a main adhesive (115) and a cover board (116). The supporter includes a through hole and a plurality of top pads (113c) formed around the through hole, and the supporter is mounted on the base board and electrically connected to the base board. The image sensor is mounted on the base board and received in the through hole, and the image sensor includes a sensing portion (112b) and a plurality of contacts (112a). The wires electrically connect the top pads to the contacts. The main adhesive is applied on the image sensor and surrounds the sensing portion. The cover board supported on the main adhesive, and the cover board and the main adhesive cooperatively enclose the sensing portion of the image sensor.

Abstract translation: 图像传感器封装（110）包括基板（111），支撑件（113），图像传感器（112），多根电线（114），主粘合剂（115）和盖板（116）。 支撑体包括通孔和形成在通孔周围的多个顶部焊盘（113c），并且支撑件安装在基板上并电连接到基板。 图像传感器安装在基板上并被容纳在通孔中，图像传感器包括感测部分（112b）和多个触点（112a）。 电线将顶部焊盘电连接到触点。 主要粘合剂被施加在图像传感器上并且围绕感测部分。 支撑在主粘合剂上的盖板，盖板和主粘合剂协同地包围图像传感器的感测部分。

公开(公告)号：US20080095529A1

公开(公告)日：2008-04-24

申请号：US11617070

申请日：2006-12-28

Applicant: PO-CHIH HSU ,  MING-YUAN LIN

Inventor： PO-CHIH HSU ,  MING-YUAN LIN

IPC: G03B17/00

CPC classification number: G03B17/28 ,  H04N5/2251 ,  H04N5/2257

Abstract: A digital camera module package (200) includes a base (20), an image sensor chip package (21) and a lens module (22). The image sensor chip package is mounted on the base. The lens module includes a cavity (257). The cavity fittingly receives the image sensor chip package, and presses against a circumferential wall of the image sensor chip package. The digital cameral module package may precisely align the image sensor chip package with the lens module.

Abstract translation: 数码相机模块封装（200）包括基座（20），图像传感器芯片封装（21）和透镜模块（22）。 图像传感器芯片封装安装在基座上。 透镜模块包括空腔（257）。 空腔适合接收图像传感器芯片封装，并且压靠图像传感器芯片封装的圆周壁。 数码相机模块包可以将图像传感器芯片封装与透镜模块精确对准。

公开(公告)号：US20080095528A1

公开(公告)日：2008-04-24

申请号：US11617059

申请日：2006-12-28

Applicant: CHING-LUNG JAO ,  CHIEN-CHIH LIU

Inventor： CHING-LUNG JAO ,  CHIEN-CHIH LIU

IPC: G03B9/00

CPC classification number: H04N5/2257 ,  G03B9/02 ,  G03B11/045 ,  G03B17/28 ,  H04N5/2254

Abstract: A portable electronic device (200) includes a housing (20) and a digital camera module (30). The housing is configured for containing electronic components, and has an aperture (21) defined therethrough for allowing light to be transmitted therethrough. The aperture has a diameter which grows smaller from an outer side of the housing to an inner side of the housing. The digital camera module is mounted inside the inner side of the housing, and receives light transmitted from the aperture.

Abstract translation: 便携式电子设备（200）包括壳体（20）和数字照相机模块（30）。 壳体构造成用于容纳电子部件，并且具有限定在其中的孔（21），以允许光透过。 该孔具有从外壳的外侧至壳体内侧的较小的直径。 数码相机模块安装在壳体的内侧内部，并且接收从孔径传播的光。

公开(公告)号：US20080054447A1

公开(公告)日：2008-03-06

申请号：US11616838

申请日：2006-12-27

Applicant: CHIH-CHENG WU ,  CHANG-KUO YANG ,  MING LEE

Inventor： CHIH-CHENG WU ,  CHANG-KUO YANG ,  MING LEE

IPC: H01L23/12

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A digital camera module (200) includes a chip package (20) and a lens module (50) mounted to the chip package. The package includes a carrier (21), a chip (23), a plurality of wires (24), a supporting member (25), an adhesive (26), and a cover (28). The carrier has a top surface (211), and a plurality of top contacts (215) arranged on the top surface. The chip is mounted to the top surface of the carrier, and includes an active area (231) and a plurality of pads (233). The wires electrically respectively connect one of the pads to a corresponding top contact. The adhesive is applied to a peripheral circumference of the top surface of the chip. The cover is adhered to the adhesive, and closes the active area of the chip. The supporting member is disposed between the carrier and the cover to support the cover.

Abstract translation: 数字照相机模块（200）包括芯片封装（20）和安装到芯片封装的透镜模块（50）。 包装包括载体（21），芯片（23），多个电线（24），支撑部件（25），粘合剂（26）和盖子（28）。 载体具有顶表面（211）和布置在顶表面上的多个顶部接触（215）。 芯片安装到载体的顶表面，并且包括有源区（231）和多个焊盘（233）。 电线将电极中的一个电连接到相应的顶部触点。 粘合剂被施加到芯片的顶表面的周边。 盖子粘附到粘合剂上，并关闭芯片的有效区域。 支撑构件设置在托架和盖之间以支撑盖。

公开(公告)号：US20070237519A1

公开(公告)日：2007-10-11

申请号：US11669373

申请日：2007-01-31

Applicant: CHING-LUNG JAO

Inventor： CHING-LUNG JAO

IPC: G03B17/00

CPC classification number: G03B17/28 ,  G02B7/02 ,  G02B13/001 ,  H04N5/2251 ,  H04N5/2257

Abstract: An exemplary camera mechanism (8) includes a lens module (10), an image sensor module (20), an electronic module (30), and a transmission module (40). The image sensor module is mounted under the lens module. The electronic module is mounted to at least one of the lens module and the image sensor module. The transmission module has a main body (41), a first electronic connection end (43) and a second electronic connection end (45). The lens module and the image sensor module are mounted on the main body. The first electronic connection end is formed at a top end of the main body. The second electronic connection end is formed at a bottom end of the main body. The first electronic connection end is electrically connected to the electronic module and to the second electronic connection end, and the second electronic connection end is capable of being electrically connected to a mother board (50).

Abstract translation: 示例性相机机构（8）包括透镜模块（10），图像传感器模块（20），电子模块（30）和传输模块（40）。 图像传感器模块安装在镜头模块下方。 电子模块安装在透镜模块和图像传感器模块中的至少一个上。 传动模块具有主体（41），第一电子连接端（43）和第二电子连接端（45）。 透镜模块和图像传感器模块安装在主体上。 第一电子连接端形成在主体的顶端。 第二电子连接端形成在主体的底端。 第一电子连接端电连接到电子模块和第二电子连接端，并且第二电子连接端能够电连接到母板（50）。

公开(公告)号：US20070173084A1

公开(公告)日：2007-07-26

申请号：US11309754

申请日：2006-09-22

Applicant: YUAN-PO WANG

Inventor： YUAN-PO WANG

IPC: H05K1/00

CPC classification number: H05K3/3442 ,  H04N5/2251 ,  H04N5/2257 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09781 ,  H05K2201/10727 ,  Y02P70/611 ,  Y02P70/613

Abstract: A board-to-board connecting structure (100) includes a flexible circuit board (10) and a substrate (210) fixed to the flexible circuit board (10). The substrate (210) has a plurality of first pads (212) and a plurality of first connecting sheets (214) disposed thereon, and the flexible circuit board has a plurality of second pads (112) and a plurality of second connecting pads (114) disposed thereon. The first pads are fixed to the second pads, and the first connecting sheets are fixed to the second connecting sheets.

Abstract translation: 板对板连接结构（100）包括柔性电路板（10）和固定到柔性电路板（10）的基板（210）。 基板（210）具有多个第一焊盘（212）和设置在其上的多个第一连接片（214），柔性电路板具有多个第二焊盘（112）和多个第二连接焊盘（114） ）。 第一焊盘固定到第二焊盘，并且第一连接片固定到第二连接片。

公开(公告)号：US20070146486A1

公开(公告)日：2007-06-28

申请号：US11592768

申请日：2006-11-03

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Yuan-Po Wang

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Yuan-Po Wang

IPC: H04N17/00

CPC classification number: H04N17/002

Abstract: A testing system (200) for digital camera modules (100) includes a first testing module (50), an assembling mechanism (60), a focusing module (62), a second testing module (70), a carrying mechanism (80), and a main processor (90). The carrying mechanism supports and transports subassemblies of the digital camera modules and the digital camera modules between the first testing module, the assembling mechanism, the focusing module and the second testing module. The first testing module, the assembling mechanism, the focusing module, the carrying mechanism, and the second testing module are all electronically connected with the main processor.

Abstract translation: 一种用于数字照相机模块（100）的测试系统（200）包括第一测试模块（50），组装机构（60），聚焦模块（62），第二测试模块（70） ，以及主处理器（90）。 携带机构在第一测试模块，组装机构，聚焦模块和第二测试模块之间支撑和传送数字照相机模块和数字照相机模块的子组件。 第一测试模块，组装机构，聚焦模块，承载机构和第二测试模块都与主处理器电连接。

公开(公告)号：US20070126081A1

公开(公告)日：2007-06-07

申请号：US11525447

申请日：2006-09-22

Applicant: Steven Webster ,  Ying-Cheng Wu

Inventor： Steven Webster ,  Ying-Cheng Wu

IPC: H01L27/082

CPC classification number: H01L27/14618 ,  H01L24/73 ,  H01L27/14625 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15311 ,  H04N5/2257 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A digital camera module (200) includes a carrier (20), an image sensor chip (30), a number of wires (50), a holder (60), and a lens module (70). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a number of conductive leads (233) spaced from each other. Each lead has a first terminal portion (235), a second terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301). The wires electrically connect the chip and the leadframe. The holder is mounted to the carrier to close the cavity. The lens module is received in the holder and guides light to the active area of the chip.

Abstract translation: 数字照相机模块（200）包括载体（20），图像传感器芯片（30），多个电线（50），保持器（60）和透镜模块（70）。 载体包括嵌入基座中的基座（21）和引线框架（23）。 基座包括板（211），侧壁（213）和空腔（24）。 引线框架包括彼此间隔开的多个导电引线（233）。 每个引线具有连接第一和第二端子部分的第一端子部分（235），第二端子部分（236）和互连部分（237）。 芯片安装在载体上，并具有有效区域（301）。 导线将芯片和引线框架电连接。 保持器安装到载体以封闭空腔。 透镜模块被容纳在保持器中并将光引导到芯片的有效区域。

公开(公告)号：US20060097405A1

公开(公告)日：2006-05-11

申请号：US11262907

申请日：2005-10-31

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/12

CPC classification number: H01L23/055 ,  H01L23/10 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An IC (integrated circuit) chip package includes a substrate (2), a chip (3), a plurality of bonding wires (32), and a cover (5). The substrate has a top surface, a bottom surface, a receiving chamber (23) defined therein, a plurality of solder pads (24) arranged around the top surface and the bottom surface, and a plurality of vias (25) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.

Abstract translation: IC（集成电路）芯片封装包括基板（2），芯片（3），多个接合线（32）和盖（5）。 衬底具有顶表面，底表面，限定在其中的接收室（23），围绕顶表面和底表面布置的多个焊盘（24），以及多个通孔（25），其具有导电材料 将顶部焊盘与其中限定的底部焊盘连接。 芯片安装在接收室中，并且具有围绕其顶表面布置的多个芯片焊盘。 接合线分别将衬底的顶部焊盘与芯片焊盘电连接。 盖被固定到基板的顶表面以覆盖开口，并且具有比基板更小的轮廓，从而不覆盖顶表面的周边区域。