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公开(公告)号：US20240207978A1
公开(公告)日：2024-06-27
申请号：US18288613
申请日：2022-01-25
发明人： Takafumi OGIWARA , Hayate JOAN
IPC分类号： B23K26/53 , B23K26/073
CPC分类号： B23K26/53 , B23K26/073
摘要： A laser processing device includes: a laser irradiation unit; and a control unit. The control unit is configured to execute a first control to control the laser irradiation unit to form modified regions for division along each of lines extending in an X direction and cracks extending from the modified regions in a direction of a surface, a second control to control the laser irradiation unit to form modified regions for division along each of a plurality of lines in a Y direction and cracks extending from the modified regions in the direction of the surface, and a third control to control the laser irradiation unit to form cracks extending from a plurality of modified regions for suppressing warpage before the second control, the cracks being formed to reach a back surface and not to be continuous with the cracks extending from the modified regions for division.
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公开(公告)号：US12021104B2
公开(公告)日：2024-06-25
申请号：US17046924
申请日：2019-04-11
发明人： Tomoya Taguchi , Yuki Yoshida , Katsumi Shibayama
IPC分类号： H01L27/146
CPC分类号： H01L27/1464 , H01L27/14649
摘要： A semiconductor substrate includes a first main surface and a second main surface opposing each other. The semiconductor substrate includes a first semiconductor region of a first conductivity type, and a plurality of second semiconductor regions constituting pn junctions with the first semiconductor region. The semiconductor substrate includes the plurality of second semiconductor in a side of the second main surface. Each of the plurality of second semiconductor regions includes a first region including a textured surface, and a second region including no textured surface. A thickness of the first region at a deepest position of recesses of the textured surface is smaller than a distance between a surface of the second region and the deepest position in a thickness direction of the semiconductor substrate. The first main surface is a light incident surface of the semiconductor substrate.
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公开(公告)号：US20240204119A1
公开(公告)日：2024-06-20
申请号：US18287072
申请日：2022-03-10
发明人： Kenta SUZUKI , Katsuya ISHIKAWA
IPC分类号： H01L31/024 , H01L31/02
CPC分类号： H01L31/024 , H01L31/02016
摘要： A light detecting device includes: a light detector; a heat exchanger thermally connected to the light detector; a coolant flow channel configured to be connected to the heat exchanger and allow a coolant for cooling the light detector to flow; a pump configured to cause the coolant to flow in the coolant flow channel; and a control unit that controls the pump. The control unit performs control such that a first drive power is supplied to the pump during a detection period in which the light detector performs light detection, and a second drive power is supplied to the pump during a standby period in which the light detector stands by without performing light detection, and the first drive power is smaller than the second drive power.
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公开(公告)号：US20240192139A1
公开(公告)日：2024-06-13
申请号：US18285298
申请日：2022-02-09
发明人： Kengo SUZUKI , Kenichiro IKEMURA , Kazuya IGUCHI
CPC分类号： G01N21/6489 , G01N21/6456 , G01N21/9505
摘要： A measurement device includes: an excitation optical system; an illumination optical system, and an image capturing unit. The illumination optical system includes a light transmission member having a central region that has a first color and a peripheral region that has a second color and surrounds the central region, and the excitation optical system and the illumination optical system are optically connected to each other such that in a field of view of the image capturing unit, an irradiation spot of the excitation light on the subject to be measured is included in a central spot region of the illumination light that has passed through the central region and is surrounded by a peripheral spot region of the illumination light that has passed through the peripheral region.
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公开(公告)号：US20240188408A1
公开(公告)日：2024-06-06
申请号：US18387127
申请日：2023-11-06
发明人： Kosuke HIRONAKA , Shigeo HARA
摘要： A method for manufacturing an organic semiconductor element includes a process of forming a first terminal on a main surface of a substrate, a process of forming a first electrode on the main surface, a process of forming an organic semiconductor layer on the first electrode, a process of forming a second electrode on the organic semiconductor layer, a process of forming a sacrificial layer in a predetermined region on the main surface, a process of forming a barrier layer on the main surface by an ALD method to cover the first terminal, the first electrode, the second electrode, the organic semiconductor layer, and the sacrificial layer, and a process of removing the sacrificial layer and a portion of the barrier layer that covers the sacrificial layer. The organic semiconductor layer and the sacrificial layer are apart from each other after the process of forming the barrier layer.
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公开(公告)号：US20240184090A1
公开(公告)日：2024-06-06
申请号：US18285528
申请日：2022-03-17
发明人： Satoshi YAMAMOTO
CPC分类号： G02B21/0032 , G02B21/0036 , G02B21/008 , G02B21/361 , G02B21/365 , H04N23/10 , H04N23/56
摘要： A sample observation device includes an irradiation optical system that emits planar light and having different wavelengths so as to pass through cross sections at different positions of the sample, a scanning unit that scans the sample with respect to the irradiation surfaces and, an imaging optical system that has an observation axis inclined with respect to the irradiation surfaces and images each of light images of observation light, an image acquiring unit that acquires each of first image data and second image data during scanning of the sample by the scanning unit, and an image generating unit that generates observation image data and the sample on the basis of the first image data and the second image data.
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公开(公告)号：US20240178249A1
公开(公告)日：2024-05-30
申请号：US18432122
申请日：2024-02-05
发明人： Nao INOUE , Ryosuke Koike , Haruyuki Nakayama
IPC分类号： H01L27/146 , H01L23/00
CPC分类号： H01L27/14623 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/1464 , H01L27/14643 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/13109 , H01L2224/16145 , H01L2224/2919 , H01L2224/32145 , H01L2224/73204
摘要： A light detection device includes: a back-illuminated light receiving element; a circuit element; a connection member; an underfill; and a light shielding mask. The light shielding mask includes a frame having an opening and a light shielding layer formed on an inner surface of the opening. A first opening edge on the side of the circuit element in the opening is located at the outside of an outer edge of the light receiving element. A second opening edge opposite to the circuit element in the opening is located at the inside of the outer edge of the light receiving element. The opening is narrowed from the first opening edge toward the second opening edge. A width of the frame increases from the first opening edge toward the second opening edge. The underfill reaches a gap between the light receiving element and the light shielding layer.
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公开(公告)号：US11996434B2
公开(公告)日：2024-05-28
申请号：US17283102
申请日：2019-10-09
发明人： Ryuji Kyushima , Kazuki Fujita , Junichi Sawada , Takao Aritake , Minoru Ichikawa , Haruyoshi Okada , Seiji Fukamizu , Shuhei Namba
IPC分类号： H01L27/146 , A61B6/00 , A61B6/42 , H04N25/70
CPC分类号： H01L27/14658 , A61B6/42 , A61B6/44 , H01L27/14603 , H04N25/70
摘要： A radiation imaging device according to one embodiment includes a radiation detection panel having a first surface on which a detection region is formed and an electrode pad is formed outside the detection region, and a second surface on a side opposite to the first surface, a base substrate having a support surface configured to face the second surface of the radiation detection panel and configured to support the radiation detection panel, and a flexible circuit substrate connected to the electrode pad via a connecting member, wherein an end portion of the base substrate is located further inward than an inner end portion of the connection region in which the electrode pad, the connecting member, and the flexible circuit substrate overlap each other when seen in an Z direction orthogonal to the support surface.
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公开(公告)号：US20240165746A1
公开(公告)日：2024-05-23
申请号：US18279270
申请日：2022-02-28
发明人： Atsushi TANAKA , Hadi SENA
IPC分类号： B23K26/53 , B23K26/00 , B23K26/03 , B23K26/06 , B23K26/0622 , B23K26/082 , B23K103/00 , B28D5/00
CPC分类号： B23K26/53 , B23K26/0006 , B23K26/03 , B23K26/0617 , B23K26/0622 , B23K26/082 , B23K2103/56 , B28D5/0011
摘要： A substrate manufacturing apparatus includes a stage on which a semiconductor substrate is disposed. The substrate manufacturing apparatus includes an irradiation unit that irradiates the semiconductor substrate disposed on the stage with a pulsed laser of a predetermined pulse period. The substrate manufacturing apparatus includes a controller that controls a relative position between the stage and the irradiation unit. The irradiation unit generates a plurality of converging points arranged on a straight line at a predetermined pitch. The controller moves the relative position between the stage and the irradiation unit at a predetermined speed in parallel to the straight line on which the plurality of converging points are arranged. The predetermined speed is a speed at which a moving distance of the plurality of converging points in one period of the predetermined pulse period is the same as the predetermined pitch.
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公开(公告)号：US11987493B2
公开(公告)日：2024-05-21
申请号：US17288250
申请日：2019-10-30
发明人： Daiki Suzuki , Nao Inoue , Katsumi Shibayama
CPC分类号： B81B3/0072 , B81C1/00666 , G02B26/0833 , B81B2201/042 , B81B2207/07 , B81C2201/0104 , B81C2201/0181
摘要： The damascene wiring structure includes a base including a main surface provided with a groove, an insulating layer including a first portion provided on an inner surface of the groove and a second portion provided on the main surface, a metal layer provided on the first portion, a wiring portion embedded in the groove, and a cap layer provided to cover the second portion, an end portion of the metal layer, and the wiring portion. A surface of a boundary part between the first portion and the second portion includes an inclined surface inclined with respect to a direction perpendicular to the main surface. The end portion of the metal layer enters between the cap layer and the inclined surface, and in the end portion, a first surface along the cap layer and a second surface along the inclined surface form an acute angle.
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