公开(公告)号：US09126825B2

公开(公告)日：2015-09-08

申请号：US11860250

申请日：2007-09-24

Applicant: Renzo Dal Molin ,  Alain Ripart

Inventor： Renzo Dal Molin ,  Alain Ripart

IPC: B81B7/00

CPC classification number: B81B7/007 ,  B81B2201/06

Abstract: An implantable biocompatible component (10) integrating an active element of the type of a sensor for the measurement of a physiologic parameter, a micro-electromechanical system and an integrated electronic circuit. This component (10) has a substrate (12) and a lid (22) in silicon or quartz. The substrate (12) integrates the active element (14) and biocompatible metallic pads (16), electrically connected to the active element. The lid (22) encompasses and peripherally closes the substrate in a hermetic manner, level with the face integrating the active element. This component is void of metallic case for insulation between the active element and outside environment, and of insulative feedthrough for electrical connection to the active element. The substrate and lid can be directly welded to each other through their faces in vis-à-vis, or by interpositioning a sealing ring made of a biocompatible material.

Abstract translation: 整合了用于测量生理参数的传感器类型的有源元件，微机电系统和集成电子电路的可植入生物相容性部件（10）。 该组件（10）具有硅或石英的基板（12）和盖（22）。 基板（12）将有源元件（14）和与活性元件电连接的生物相容性金属焊盘（16）集成。 盖（22）以密封的方式包围并周边地封闭基板，与集成有源元件的面平齐。 该元件在有源元件和外部环境之间绝缘的金属外壳以及用于与有源元件电连接的绝缘馈通无效。 基板和盖子可以相对于彼此直接地彼此焊接，或者通过插入由生物相容性材料制成的密封环。

公开(公告)号：US20150082901A1

公开(公告)日：2015-03-26

申请号：US14476200

申请日：2014-09-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yoshihiko Fuji ,  Hideaki Fukuzawa ,  Shiori Kaji

IPC: G01L1/12 ,  H04R23/00 ,  B81B3/00

CPC classification number: A61B5/02141 ,  B81B3/0078 ,  B81B2201/0257 ,  B81B2201/06 ,  G01L1/125 ,  G01L9/0041 ,  G01L9/16 ,  G06F3/0414 ,  H04R3/00 ,  H04R19/04 ,  H04R23/00 ,  H04R23/006 ,  H04R31/006 ,  H04R2201/003 ,  H04R2410/03 ,  H04R2420/07 ,  H04R2499/11

Abstract: According to one embodiment, a strain sensing element provided on a deformable substrate includes: a first magnetic layer; a second magnetic layer; a spacer layer; and a bias layer. Magnetization of the second magnetic layer changes according to deformation of the substrate. The spacer layer is provided between the first magnetic layer and the second magnetic layer. The second magnetic layer is provided between the spacer layer and the bias layer. The bias layer is configured to apply a bias to the second magnetic layer.

Abstract translation: 根据一个实施例，设置在可变形基板上的应变感测元件包括：第一磁性层; 第二磁性层; 间隔层; 和偏置层。 第二磁性层的磁化根据基板的变形而变化。 间隔层设置在第一磁性层和第二磁性层之间。 第二磁性层设置在间隔层和偏置层之间。 偏置层被配置为向第二磁性层施加偏压。

公开(公告)号：US08828246B2

公开(公告)日：2014-09-09

申请号：US12707731

申请日：2010-02-18

Applicant: Chris Yu

Inventor： Chris Yu

IPC: H01B13/00

CPC classification number: A61M37/0015 ,  A61M2037/0023 ,  A61M2037/0053 ,  B01L3/502707 ,  B81B7/008 ,  B81B2201/058 ,  B81B2201/06 ,  B81C1/00119 ,  B81C1/00246 ,  B81C1/00341 ,  B82Y5/00 ,  Y10T29/49124

Abstract: A new and novel method utilizing current nano-technological processes for fabricating a range of micro-devices with significantly expanded capabilities, unique functionalities at microscopic levels, enhanced degree of flexibilities, reduced costs and improved performance in the fields of bioscience and medicine is disclosed in the within patent application. Micro-devices fabricated using the disclosed nano-technological techniques have significant improvements in many areas over the existing, conventional methods. Such improvements include, but are not limited to reduced overall costs, early disease detection, targeted drug delivery, targeted disease treatment and reduced degree of invasiveness in treatment. Compared with existing, conventional approaches, the said inventive approach disclosed in this patent application is much more microscopic, sensitive, accurate, precise, flexible and effective. This novel approach is able to deliver a superior level of performance in medical treatments over the existing modalities.While microelectronic processes have been used for fabricating integrated circuit (“IC”) devices such as microprocessors, digital signal processors (“DSP”) and memory chips for the past two to three decades, their use has not been extended to most areas of bioscience and medicine. While there have been some application of micro-chips used in the area of laboratory diagnostic tests such as gene/DNA mapping and potential tests for diseases, their meaningful application in the areas of in-vivo diagnosis, drug delivery and disease treatments have not been utilized and are basically non-existent in the current state of the art. The disclosure herein utilizes these techniques to manufacture micro-devices for use in biological and medical applications as a microscopic way of treating disease.

Abstract translation: 一种新的和新颖的方法利用当前的纳米技术工艺来制造具有显着扩展能力的微量器件的范围，显微镜级别的独特功能，增强的柔性程度，降低的成本以及在生物科学和医学领域中改进的性能。 在专利申请内。 使用公开的纳米技术技术制造的微器件在现有的常规方法中在许多领域具有显着的改进。 这些改进包括但不限于降低总体成本，早期疾病检测，靶向药物递送，靶向疾病治疗和治疗入侵程度降低。 与现有的常规方法相比，本专利申请中公开的所述发明方法更微观，灵敏，准确，精确，灵活和有效。 这种新颖的方法能够在医疗治疗中提供比现有模式更高水平的表现。 虽然微电子工艺已经用于制造过去二三十年的微处理器，数字信号处理器（“DSP”）和存储器芯片等集成电路（“IC”）器件，但它们的使用并没有扩展到生物科学的大多数领域 和药。 虽然在实验室诊断测试领域中使用了微芯片，例如基因/ DNA图谱和潜在的疾病测试，但是在体内诊断，药物传播和疾病治疗领域的有意义的应用尚未得到应用 在现有技术水平基本上不存在。 本文的公开内容利用这些技术来制造用于生物和医学应用的微型装置，作为治疗疾病的微观方式。

公开(公告)号：US08809982B2

公开(公告)日：2014-08-19

申请号：US13121268

申请日：2009-09-24

Applicant: Freddy Roozeboom ,  Martijn Goossens ,  Willem Frederik Adrianus Besling ,  Nynke Verhaegh

Inventor： Freddy Roozeboom ,  Martijn Goossens ,  Willem Frederik Adrianus Besling ,  Nynke Verhaegh

IPC: H01L27/14 ,  B81B3/00 ,  B81C1/00 ,  H01L29/41 ,  H01L49/02

CPC classification number: H01L29/41 ,  B81B3/007 ,  B81B2201/06 ,  B81C1/00619 ,  B81C2201/0112 ,  B81C2201/0132 ,  H01L28/91

Abstract: The invention relates to an semi-conductor device comprising a first surface and neighboring first and second electric elements arranged on the first surface, in which each of the first and second elements extends from the first surface in a first direction, the first element having a cross section substantially perpendicular to the first direction and a sidewall surface extending at least partially in the first direction, wherein the sidewall surface comprises a first section and a second section adjoining the first section along a line extending substantially parallel to the first direction, wherein the first and second sections are placed at an angle with respect to each other for providing an inner corner wherein the sidewall surface at the inner corner is, at least partially, arranged at a constant distance R from a facing part of the second element for providing a mechanical reinforcement structure at the inner corner.

Abstract translation: 本发明涉及一种半导体器件，其包括第一表面和布置在第一表面上的相邻的第一和第二电气元件，其中第一和第二元件中的每一个元件在第一方向上从第一表面延伸，第一元件具有 基本上垂直于第一方向的横截面和至少部分地沿第一方向延伸的侧壁表面，其中侧壁表面包括沿着基本上平行于第一方向延伸的线邻接第一部分的第一部分和第二部分，其中， 第一和第二部分相对于彼此以一定角度放置以提供内角，其中内角处的侧壁表面至少部分地布置成距离第二元件的面对部分恒定的距离R，以提供 机械加强结构在内角。

公开(公告)号：US20140106095A1

公开(公告)日：2014-04-17

申请号：US14124946

申请日：2012-06-07

Applicant: Francois Bianchi

Inventor： Francois Bianchi

IPC: B81C3/00 ,  B81B1/00

CPC classification number: B81C3/001 ,  A61M5/14276 ,  B81B1/00 ,  B81B2201/058 ,  B81B2201/06 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/031 ,  Y10T428/1317

Abstract: The invention relates to a device comprising a wafer comprising a silicon area and a wafer comprising a glass area fastened to each other, the fastening zone thus formed between the wafers defining a multilayer structure comprising a first layer protecting the silicon from physical changes caused by attack of the surface, which layer covers the silicon area, and a second layer protecting the glass from physical changes caused by attack of the surface, which layer covers the glass area; said multilayer structure furthermore comprising at least one additional layer enabling anodic bonding between the two protective layers; said device containing at least one fluid channel protected by said protective layers and able to contain a solution temporarily.

Abstract translation: 本发明涉及一种包括晶片的装置，其包括硅区域和包括彼此紧固的玻璃区域的晶片，由此形成在晶片之间的紧固区域限定了多层结构，该多层结构包括保护硅免受由攻击造成的物理变化的第一层 的表面，该层覆盖硅区域，以及第二层，保护玻璃免受由表面的侵蚀引起的物理变化，该层覆盖玻璃区域; 所述多层结构还包括至少一个能够在两个保护层之间进行阳极接合的附加层; 所述装置包含至少一个由所述保护层保护的流体通道并且能够临时容纳溶液。

公开(公告)号：US20120241216A1

公开(公告)日：2012-09-27

申请号：US13488355

申请日：2012-06-04

Applicant: Jonathan R. Coppeta ,  Kurt Shelton ,  Norman F. Sheppard, JR. ,  Douglas Snell ,  Catherine M.B. Santini

Inventor： Jonathan R. Coppeta ,  Kurt Shelton ,  Norman F. Sheppard, JR. ,  Douglas Snell ,  Catherine M.B. Santini

IPC: F16B11/00 ,  B23K20/00 ,  H01R4/02

CPC classification number: B81C1/00269 ,  A61K9/0097 ,  A61M5/14276 ,  A61M2205/0244 ,  A61M2207/00 ,  B23K20/02 ,  B33Y80/00 ,  B81B2201/06 ,  B81C1/00047 ,  B81C1/00095 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/038 ,  F16B4/004 ,  F16B5/08 ,  F16B11/004 ,  H01L23/10 ,  H01L23/3142 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/16237 ,  H01L2224/81193 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16315 ,  Y10T403/477 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.

Abstract translation: 提供压缩冷焊方法，接头结构和密封的密封装置。 该方法包括提供具有至少一个第一接头结构的第一基底，该第一接合结构包括第一接合表面，该表面包括第一金属; 提供具有至少一个第二接头结构的第二基底，所述第二接头结构包括第二接合表面，所述表面包括第二金属; 以及将所述至少一个第一接合结构和所述至少一个第二接头结构压在一起，以在一个或多个界面上局部变形和剪切所述接合表面，所述接合面有效地在所述第一金属和所述第二接头结构之间形成金属与金属之间的接合 金属的接合面。 在接合表面上的重叠有效地移动表面污染物并促进接合表面之间的紧密接触而不需要热量输入。 密封装置可以包含药物制剂，生物传感器或MEMS装置。

公开(公告)号：US20110200948A1

公开(公告)日：2011-08-18

申请号：US12707731

申请日：2010-02-18

Applicant: Chris Yu

Inventor： Chris Yu

IPC: G03F7/20 ,  C23F1/00 ,  G01N1/28

CPC classification number: A61M37/0015 ,  A61M2037/0023 ,  A61M2037/0053 ,  B01L3/502707 ,  B81B7/008 ,  B81B2201/058 ,  B81B2201/06 ,  B81C1/00119 ,  B81C1/00246 ,  B81C1/00341 ,  B82Y5/00 ,  Y10T29/49124

Abstract: A new and novel method utilizing current nano-technological processes for fabricating a range of micro-devices with significantly expanded capabilities, unique functionalities at microscopic levels, enhanced degree of flexibilities, reduced costs and improved performance in the fields of bioscience and medicine is disclosed in the within patent application. Micro-devices fabricated using the disclosed nano-technological techniques have significant improvements in many areas over the existing, conventional methods. Such improvements include, but are not limited to reduced overall costs, early disease detection, targeted drug delivery, targeted disease treatment and reduced degree of invasiveness in treatment. Compared with existing, conventional approaches, the said inventive approach disclosed in this patent application is much more microscopic, sensitive, accurate, precise, flexible and effective. This novel approach is able to deliver a superior level of performance in medical treatments over the existing modalities.While microelectronic processes have been used for fabricating integrated circuit (“IC”) devices such as microprocessors, digital signal processors (“DSP”) and memory chips for the past two to three decades, their use has not been extended to most areas of bioscience and medicine. While there have been some application of micro-chips used in the area of laboratory diagnostic tests such as gene/DNA mapping and potential tests for diseases, their meaningful application in the areas of in-vivo diagnosis, drug delivery and disease treatments have not been utilized and are basically non-existent in the current state of the art. The disclosure herein utilizes these techniques to manufacture micro-devices for use in biological and medical applications as a microscopic way of treating disease.

Abstract translation: 一种新的和新颖的方法利用当前的纳米技术工艺来制造具有显着扩展能力的微量器件的范围，显微镜级别的独特功能，增强的柔性程度，降低的成本以及在生物科学和医学领域中改进的性能。 在专利申请内。 使用公开的纳米技术技术制造的微器件在现有的常规方法中在许多领域具有显着的改进。 这些改进包括但不限于降低总体成本，早期疾病检测，靶向药物递送，靶向疾病治疗和治疗入侵程度降低。 与现有的常规方法相比，本专利申请中公开的所述发明方法更微观，灵敏，准确，精确，灵活和有效。 这种新颖的方法能够在医疗治疗中提供比现有模式更高水平的表现。 虽然微电子工艺已经用于制造过去二三十年的微处理器，数字信号处理器（“DSP”）和存储器芯片等集成电路（“IC”）器件，但它们的使用并没有扩展到生物科学的大多数领域 和药。 虽然在实验室诊断测试领域中使用了微芯片，例如基因/ DNA图谱和潜在的疾病测试，但是在体内诊断，药物传播和疾病治疗领域的有意义的应用尚未得到应用 在现有技术水平基本上不存在。 本文的公开内容利用这些技术来制造用于生物和医学应用的微型装置，作为治疗疾病的微观方式。

公开(公告)号：US07867915B2

公开(公告)日：2011-01-11

申请号：US11424643

申请日：2006-06-16

Applicant: Christina L Cole ,  Lloyd J Whitman

Inventor： Christina L Cole ,  Lloyd J Whitman

IPC: H01L21/469

CPC classification number: B81C1/00206 ,  B81B2201/06

Abstract: Provided is a method for controllably activating a surface for stable amine-reactive chemistries. A surface containing nitride is exposed to a plasma having a reactive species containing hydrogen for a period of time sufficient to activate the substrate for amine-reactive chemistries. Amine-reactive chemical processes can then be applied to the activated surface to reliably and controllably bond molecules directly to said surface. The method is designed to create stable primary amines on the nitride substrate, so that any subsequent amine-reactive chemistry may proceed in a controlled manner that is directly proportional to the density of surface amines so created.

Abstract translation: 提供了一种用于可控地激活用于稳定的胺反应性化学物质的表面的方法。 将含有氮化物的表面暴露于具有含氢活性物质的等离子体一段足以激活胺反应性化学物质的底物的时间。 然后可以将胺反应性化学过程施加到活化表面，以可靠和可控地将分子直接结合到所述表面。 该方法被设计成在氮化物衬底上产生稳定的伯胺，使得任何随后的胺反应性化学物质可以以如此产生的表面胺的密度成正比的受控方式进行。

公开(公告)号：US07799656B2

公开(公告)日：2010-09-21

申请号：US12045853

申请日：2008-03-11

Applicant: Luc Ouellet ,  Patrick Wright

Inventor： Luc Ouellet ,  Patrick Wright

IPC: H01L21/46 ,  H01L21/31

CPC classification number: B81C1/00071 ,  B81B2201/06 ,  B81C2201/0191

Abstract: A method is disclosed for making a MEMS device wherein anhydrous HF exposed silicon nitride is used as a temporary adhesion layer allowing the transfer of a layer from a Carrier Wafer to a Device Wafer.

Abstract translation: 公开了一种用于制造MEMS器件的方法，其中使用无水HF暴露的氮化硅作为允许将层从载体晶片转移到器件晶片的临时粘合层。

公开(公告)号：US07764004B2

公开(公告)日：2010-07-27

申请号：US11773534

申请日：2007-07-05

Applicant: Joanna Aizenberg ,  Thomas N. Krupenkin ,  Oleksandr Sydorenko ,  Joseph A. Taylor

Inventor： Joanna Aizenberg ,  Thomas N. Krupenkin ,  Oleksandr Sydorenko ,  Joseph A. Taylor

IPC: B01L3/00 ,  B32B3/00 ,  A01K1/015

CPC classification number: B81B3/0032 ,  B01L3/502761 ,  B01L2300/0896 ,  B81B2201/047 ,  B81B2201/058 ,  B81B2201/06 ,  B81B2203/0361 ,  B81B2203/058 ,  B82Y30/00 ,  G02B5/1828 ,  Y10S310/80 ,  Y10T156/10 ,  Y10T428/24182 ,  Y10T428/24479

Abstract: Provided is an apparatus. In one embodiment, this apparatus includes a substrate having a surface, and a plurality of nanostructures each having a first end and a second end, wherein the first end of each of the plurality of nanostructures is attached to the surface. At least a portion of the second ends of the plurality of nanostructures, in this embodiment, are bent toward one another to form two or more similarly configured clumps each including two or more nanostructures.

Abstract translation: 提供了一种装置。 在一个实施例中，该装置包括具有表面的基板和多个纳米结构，每个纳米结构具有第一端和第二端，其中多个纳米结构中的每一个的第一端附接到该表面。 在该实施例中，多个纳米结构的第二端的至少一部分彼此弯曲以形成两个或更多个类似配置的团块，每个组合包括两个或多个纳米结构。