Abstract:
The present invention ensures the hermetic bonding of a support body which is interposed between a face substrate and a back substrate and is formed of a plurality of members thus easily realizing the large-sizing of a screen of a display image and, at the same time, enhancing a hermetic property holding function of the image display device. A support body is interposed between a face substrate and a back substrate while surrounding a display region and hermetically seals both substrates using a sealing material. The support body is formed by hermetically bonding a plurality of support body members each other using a bonding material which has a softening point higher than a softening point of the sealing material.
Abstract:
A printing screen, printing process and method for improving side-bottom ratio are provided. The printing screen mainly comprises a plurality of printing units, wherein each of the printing units comprises a body and a protrusion structure. The body has an ink aperture, and the protrusion structure extends from a surface of the body into the ink aperture. The printing process of a fluorescent layer in a plasma display panel utilizing the said printing screen can enhance the uneven film thickness of the fluorescent layer on the bottom of a discharge chamber, and further improve the side-bottom ratio of the fluorescent layer in a plasma display panel.
Abstract:
Provided are a gas discharge display device capable of implementing high resolution and a method of fabricating the same. The gas discharge display device includes a substrate. A silicon member is attached to the substrate. The silicon member has a groove formed on at least a portion of an inner surface of the silicon member and forms a discharge space in cooperation with the substrate. A discharge electrode is disposed on the substrate. Discharge gas is contained in the discharge space.
Abstract:
A protective plate for a plasma display comprises conductive substrate for protecting a plasma display and an electrode in electrical contact with the conductive substrate.
Abstract:
The present invention provides a plasma display panel without any injection tip and a method of manufacturing the same. The plasma display panel without any injection tip has a structure capable of directly injecting gas for electric discharge into the plasma display panel through an injection hole of a lower glass substrate using a vacuum apparatus while manufacturing the plasma display panel, thus sealing the plasma display panel in the vacuum. Therefore, the plasma display panel without any injection tip reduces a thickness thereof, thus reducing a space required to install the plasma display panel. Furthermore, the plasma display panel without any injection tip avoids damages, caused by an injection tip of conventional plasma display panels, during a process of transporting or installing the plasma display panel.
Abstract:
A microstructured assembly including a barrier portions and land portions is described. The microstructures have alternating barrier portions and land portions that have barrier surfaces and land surfaces, respectively. Each barrier surface and land surface is connected by curved surface, which is part of a curved portion. The curved surface and the land surface are substantially continuous.
Abstract:
A method of manufacturing an image display apparatus is provided and includes the steps of bringing panel members that constitute a display panel of the image display apparatus into a bake processing chamber, subjecting to bake processing the display panel members, lowering a temperature of the display panel members, and bringing the display panel members into a seal-bonding processing chamber. Seal-bonding processing is conducted by local heating to a seal-bonding portion.
Abstract:
A bonding method using a bonding agent is provided, which has the steps of forming an underlayer on a first member, providing a bonding agent on the underlayer, forming a contact member, different from the bonding agent, on a second member, bringing the bonding agent into contact with the contact member so that the first member and the second member are bonded to each other. In the method described above, the wettability of the bonding agent to the underlayer is superior to that of the bonding agent to a surface of the first member before the underlayer is formed thereon, and the bondability of the bonding agent to the contact member is superior to that of the bonding agent to a surface of the second member before the contact member is formed thereon.
Abstract:
An embodiment of an electron emission device includes first and second substrates facing each other, unit pixels being defined on the first and the second substrates, an electron emission unit on the first substrate, phosphor layers on a surface of the second substrate facing the first substrate, each phosphor layer corresponding to at least one unit pixel, non-light emission regions between the phosphor layers, and spacers interposed between the first and the second substrates and arranged in the non-light emission regions, wherein the non-light emission regions comprise spacer loading regions loaded with the spacers, wherein a width of a spacer loading region and a pitch of the unit pixels satisfies the following condition: A/B≧about 0.2, where A indicates the width of the spacer loading region and B indicates the pitch of the unit pixels located along the width of the spacer loading region.
Abstract:
A method for manufacturing a light-emitting panel sandwiches a plurality of micro-components between two flexible substrates in a web configuration. Each micro-component contains a gas or gas-mixture capable of ionization when a sufficiently large voltage is supplied across the micro-component via at least two electrodes. The micro-components are disposed in sockets formed at pre-determined locations in a first dielectric substrate so that they are adjacent to electrodes imprinted in the first substrate. Dielectric layers and the conductors for acting as electrodes are formed using liquid processes or combined liquid and sheet processes, where liquid materials are applied to the surface of the underlying layer, then cured to complete the formation of layers. The assembled layers are coated with a protective coating and may include an RF shield. In one embodiment, patterning of the conductors is achieved by applying conductive ink using an ink jet process. In another embodiment, the conductors may be patterned photolithographically using a leaky optical waveguide as a contact mask.