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    Delay filter module
    31.
    发明授权
    Delay filter module 有权
    延时滤波模块

    公开(公告)号：US07928816B2

    公开(公告)日：2011-04-19

    申请号：US12069763

    申请日：2008-02-13

    Applicant: Reddy R. Vangala

    Inventor： Reddy R. Vangala

    IPC: H01P9/00 ,  H01P1/201

    CPC classification number: H01P1/2056 ,  H01P1/205 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09336 ,  H05K2201/1006 ,  H05K2201/10969

    Abstract: A delay filter module comprising at least one dielectric boneblack ceramic band pass filter and a circuit for compensating/equalizing the signal delay produced by the delay filter. In one embodiment, the circuit is defined by a hybrid coupler defining at least two ports coupled to a dielectric ceramic reactive termination block defining at least a pair of reactive termination resonators and coupling capacitors. The delay can be adjusted by tuning the dielectric boneblack band pass filter and/or the reactive termination resonators and/or the coupling capacitors defined by the dielectric ceramic reactive termination block.

    Abstract translation: 延迟滤波器模块，包括至少一个介质整体陶瓷带通滤波器和用于补偿/均衡由延迟滤波器产生的信号延迟的电路。 在一个实施例中，电路由限定了至少两个端口的混合耦合器限定，该至少两个端口耦合到限定至少一对电抗端接谐振器和耦合电容器的电介质陶瓷反应性端接块。 可以通过调谐电介质单块带通滤波器和/或由电介质陶瓷反应性端接块限定的反应性端接谐振器和/或耦合电容器来调节延迟。

    Z-Directed Filter Components for Printed Circuit Boards
    32.
    发明申请
    Z-Directed Filter Components for Printed Circuit Boards 有权
    用于印刷电路板的Z导向滤波器组件

    公开(公告)号：US20110019376A1

    公开(公告)日：2011-01-27

    申请号：US12508199

    申请日：2009-07-23

    Applicant: Keith Bryan Hardin ,  Paul Kevin Hall ,  Robert Aaron Oglesbee

    Inventor： Keith Bryan Hardin ,  Paul Kevin Hall ,  Robert Aaron Oglesbee

    IPC: H05K1/18

    CPC classification number: H05K1/184 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0248 ,  H05K1/0251 ,  H05K1/0298 ,  H05K3/4046 ,  H05K2201/09645 ,  H05K2201/1006 ,  H05K2201/10984

    Abstract: A Z-directed filter component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed filter component is mounted within the thickness of the PCB allowing other components to be mounted over it. The filter may be T-filter or a Pi-filter within the body of the Z-directed component. The body may also contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

    Abstract translation: 用于插入印刷电路板的Z向滤波器组件，同时允许电连接到与PCB一起包含的内部导电平面。 在一个实施例中，Z导向的滤波器部件安装在PCB的厚度内，允许其它部件安装在其上。 滤波器可以是Z-导向分量的体内的T滤波器或Pi滤波器。 主体还可以包含一个或多个导体，并且可以包括沿主体长度的至少一部分延伸的一个或多个表面通道或孔。 还提供了用于安装Z向定向部件的方法。

    Integrated electromagnetic interference filters and feedthroughs
    33.
    发明授权
    Integrated electromagnetic interference filters and feedthroughs 有权
    集成电磁干扰滤波器和馈通

    公开(公告)号：US07719854B2

    公开(公告)日：2010-05-18

    申请号：US10632138

    申请日：2003-07-31

    Applicant: Nick A. Youker ,  Lawrence D. Swanson ,  John E. Hansen ,  William J. Linder

    Inventor： Nick A. Youker ,  Lawrence D. Swanson ,  John E. Hansen ,  William J. Linder

    IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

    CPC classification number: H05K1/0231 ,  A61N1/05 ,  A61N1/3754 ,  H05K1/0243 ,  H05K1/18 ,  H05K2201/1006 ,  H05K2201/10371 ,  H05K2203/1147

    Abstract: An assembly integrating commercially available capacitors into filtered feedthroughs. A feedthrough assembly comprises a plurality of Input/Output (I/O) conductors, wherein the I/O conductors pass through a hermetic seal such that a first end of the I/O conductors reside on a non-hermetic side of the hermetic seal and a second end of the I/O conductors reside on a hermetic side of the hermetic seal, a printed circuit interconnect substrate residing on the hermetic side of the hermetic seal, and a plurality of ceramic chip capacitors mounted on the printed circuit interconnect substrate, wherein a first end of each capacitor is connected via the interconnect to the second end of an I/O conductor and a second end of each capacitor is connected via the interconnect to a constant voltage level.

    Abstract translation: 将市售的电容器集成到滤波的馈通中的组件。 馈通组件包括多个输入/输出（I / O）导体，其中I / O导体穿过气密密封，使得I / O导体的第一端位于气密密封件的非密封侧 I / O导体的第二端位于气密密封件的密封侧，位于气密密封件密封侧的印刷电路互连基板和安装在印刷电路互连基板上的多个陶瓷芯片电容器， 其中每个电容器的第一端经由互连件连接到I / O导体的第二端，并且每个电容器的第二端经由互连件连接到恒定电压电平。

    Electrical Module
    34.
    发明申请
    Electrical Module 有权
    电气模块

    公开(公告)号：US20090174497A1

    公开(公告)日：2009-07-09

    申请号：US12352730

    申请日：2009-01-13

    Applicant: Christian Korden

    Inventor： Christian Korden

    IPC: H01P5/12

    CPC classification number: H05K1/0243 ,  H01L23/552 ,  H01L23/66 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H03H9/0571 ,  H03H9/0576 ,  H03H9/542 ,  H03H9/706 ,  H03H9/72 ,  H03H9/725 ,  H05K1/0298 ,  H05K2201/1006 ,  H05K2201/10727 ,  H05K2201/10734 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    Abstract: An electrical module with a first substrate, and a component mounted on the first substrate is specified. The component includes a second substrate and a chip arranged on the second substrate. In the module, a filter circuit is realized that includes shunt arms connected to ground each with at least one parallel resonator. The parallel resonators are arranged on the chip. The ground-side connection of at least two of the shunt arms to each other is realized outside the chip and the second substrate. The ground-side connection of the shunt arms is advantageously realized in the first substrate or on a circuit board on which the first substrate is arranged.

    Abstract translation: 规定了具有第一基板的电气模块和安装在第一基板上的部件。 该组件包括布置在第二基板上的第二基板和芯片。 在该模块中，实现了一种滤波电路，其包括连接到每个具有至少一个并联谐振器的接地的并联臂。 并联谐振器布置在芯片上。 在芯片和第二基板的外部实现至少两个分流臂彼此的接地侧连接。 分路臂的接地侧连接有利地在第一基板或布置有第一基板的电路板上实现。

    MICROPROCESSOR COMMON-MODE EMISSIONS REDUCTION CIRCUIT
    36.
    发明申请
    MICROPROCESSOR COMMON-MODE EMISSIONS REDUCTION CIRCUIT 审中-公开
    微处理器通用模式排放减少电路

    公开(公告)号：US20090058559A1

    公开(公告)日：2009-03-05

    申请号：US11848793

    申请日：2007-08-31

    Applicant: William F. Pakkala

    Inventor： William F. Pakkala

    IPC: H03H1/00

    CPC classification number: H03H7/427 ,  H03H1/0007 ,  H05K1/0231 ,  H05K1/0233 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/10689

    Abstract: An apparatus with reduced common-mode (CM) emissions from of a microprocessor includes a circuit board, first and second capacitors and a common-mode (CM) choke. The circuit board has a connector configured for connection to an external wire harness, which may act as an antenna generating CM RF emissions. The microprocessor includes a power pin (VCC), a ground pin (VSS), and at least one high impedance input pin. The first capacitor is connected across the power and ground pins. The second capacitor is connected across the high impedance input pin and the ground pin. The common-mode (CM) choke is electrically intermediate the power and ground pins, on the one hand, and the corresponding power and ground terminals of the connector on the other hand. The CM choke is disposed a preselected distance from the microprocessor. The preselected distance, which may be as close as possible, is configured to achieve an effective amount of common-mode emissions attenuation. The power and ground terminals are coupled to electrically conductive first traces on the circuit board, while the power and ground pins are coupled to electrically conductive second traces on the circuit board. The first traces are located outside a predefined isolation zone surrounding the second traces. The isolation zone is configured in size and shape so as to substantially minimize capacitive coupling between the second traces and the first traces.

    Abstract translation: 具有来自微处理器的共模（CM）发射减小的装置包括电路板，第一和第二电容器以及共模（CM）扼流圈。 电路板具有被配置为连接到外部线束的连接器，其可以用作产生CM RF发射的天线。 微处理器包括电源引脚（VCC），接地引脚（VSS）和至少一个高阻抗输入引脚。 第一个电容连接在电源和接地引脚之间。 第二个电容器连接在高阻抗输入引脚和接地引脚上。 另一方面，共模（CM）扼流圈在电源和接地引脚之间以及连接器的相应电源和接地端子之间是电中间的。 CM扼流器与微处理器相距预设的距离。 可能尽可能接近的预选距离被配置成实现有效量的共模辐射衰减。 电源和接地端子耦合到电路板上的导电第一迹线，而电源和接地引脚耦合到电路板上的导电第二迹线。 第一迹线位于围绕第二迹线的预定隔离区之外。 隔离区被配置为尺寸和形状，以便基本上最小化第二迹线和第一迹线之间的电容耦合。

    Integrated connector apparatus and methods
    38.
    发明申请
    Integrated connector apparatus and methods 有权
    集成连接器装置和方法

    公开(公告)号：US20080233803A1

    公开(公告)日：2008-09-25

    申请号：US12074112

    申请日：2008-02-28

    Applicant: Victor H. Renteria ,  Aurelio J. Gutierrez ,  William Mahlerbe ,  Gary L. Hurd ,  Russell L. Machado

    Inventor： Victor H. Renteria ,  Aurelio J. Gutierrez ,  William Mahlerbe ,  Gary L. Hurd ,  Russell L. Machado

    IPC: H01R13/66

    CPC classification number: H01R13/66 ,  H01R12/70 ,  H01R13/6658 ,  H01R13/719 ,  H01R13/7193 ,  H01R24/64 ,  H05K1/0233 ,  H05K1/18 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10568 ,  H05K2201/2036

    Abstract: An electrical connector mountable on a printed circuit board. In one embodiment, the electrical connector comprises an insulative housing comprising one or more electronic components, a plurality of electrical conductors in signal communication with the electronic components and adapted to interface with a plug and a plurality of terminals in signal communication with the one or more electronic components. In one aspect, the plurality of terminals are adapted to interface with one or more externally mounted electronic components on the printed circuit board thereby filtering signals passing between the electrical conductors and the printed circuit board, with the externally mounted electronic components mounted within the footprint of the electrical connector. Methods of manufacture for the aforementioned electrical connector and business methods are also disclosed.

    Abstract translation: 可安装在印刷电路板上的电连接器。 在一个实施例中，电连接器包括绝缘壳体，该绝缘壳体包括一个或多个电子部件，与电子部件信号通信的多个电导体，并且适于与插头和多个终端进行信号通信，该多个终端与一个或多个 电子元器件。 在一个方面，多个端子适于与印刷电路板上的一个或多个外部安装的电子部件接合，从而过滤在电导体和印刷电路板之间通过的信号，其中外部安装的电子部件安装在 电连接器。 还公开了上述电连接器的制造方法和业务方法。

    EMBEDDED ANTENNA AND FILTER APPARATUS AND METHODOLOGY
    40.
    发明申请
    EMBEDDED ANTENNA AND FILTER APPARATUS AND METHODOLOGY 审中-公开
    嵌入天线和滤波器装置和方法

    公开(公告)号：US20080129420A1

    公开(公告)日：2008-06-05

    申请号：US12015738

    申请日：2008-01-17

    Applicant: Vladimir Borisov ,  Philippe Chiummiento ,  Semyon Lapushin ,  Sudhir Thumaty

    Inventor： Vladimir Borisov ,  Philippe Chiummiento ,  Semyon Lapushin ,  Sudhir Thumaty

    IPC: H01P1/20

    CPC classification number: H01P1/2039 ,  H01P1/203 ,  H01P3/081 ,  H01Q1/2233 ,  H01Q1/38 ,  H01Q1/52 ,  H01Q1/528 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/16 ,  H05K2201/1006

    Abstract: Apparatus and methodology are disclosed for providing effective transmission of data to and/or from an electricity meter by providing embedded radio frequency components. An antenna and stripline or microline filter arrangement are provided as embedded components in association with a transmitter or transceiver portion of the electricity meter's metrology circuitry so as to provide control of out of band harmonic radiation and to provide enhanced signal transmission to and/or from the electricity meter, to accomplish automated meter reading communications or similar. The antenna element is configured and mounted such that, once the electricity meter is fully assembled, the meter case itself can be used as part of a radiating element. An overall resulting integrated design can achieve greater economy utilizing printed circuit board approaches with no additional parts, and with less uncontrolled surface radiation because of the otherwise buried or embedded structure.

    Abstract translation: 公开了用于通过提供嵌入式射频分量来向电表提供数据和/或从电表的有效传输的装置和方法。 天线和带状线或微线滤波器布置被提供为与电表的测量电路的发射器或收发器部分相关联的嵌入式部件，以便提供带外谐波辐射的控制，并提供对和/或从 电表，完成自动抄表通讯或类似。 天线元件被构造和安装成使得一旦电表完全组装，仪表壳体本身可以用作辐射元件的一部分。 总体结果集成设计可以通过使用不带附加部件的印刷电路板方法实现更大的经济性，并且由于其它的掩埋或嵌入式结构而具有更少的不受控制的表面辐射。

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