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公开(公告)号：US11811192B2
公开(公告)日：2023-11-07
申请号：US17254612
申请日：2019-06-18
发明人： Stephan Strohmaier , Arne-Heike Meissner-Schenk , Gerald Urban , Gerd Hansen , Christian Carstens
IPC分类号： H01S5/024
CPC分类号： H01S5/024 , H01S5/02415 , H01S5/02469
摘要： A diode laser arrangement includes a diode laser device, first and second cooling elements and at least one spacing device. The laser device and spacing device are mutually spaced apart between the first and second cooling elements. The laser device and the spacing device are disposed on respective first and second outer surfaces of respective cooling elements. The first and second cooling elements cool the laser device. The laser device has first and second diode main surfaces. The first diode main surface is on the first outer surface in a first front region and/or the second diode main surface is on the second outer surface in a second front region. The spacing device places the first outer surface in the first front region parallel to the first diode main surface, and/or the second outer surface in the second front region parallel to the second diode main surface.
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公开(公告)号：US11805599B2
公开(公告)日：2023-10-31
申请号：US17638075
申请日：2020-06-29
申请人： KYOCERA Corporation
发明人： Yoshio Kuramoto
IPC分类号： H05K1/03 , H01S5/02315 , H01S5/02 , H01S5/02208 , H01L33/48 , H01S5/024
CPC分类号： H05K1/0306 , H01S5/0206 , H01S5/02208 , H01S5/02315 , H01L33/486 , H01S5/02469
摘要： An electronic device (1, and 1A to 1E) according to the present disclosure include a substrate (10, and 10F) made of a ceramic and a housing part (21) including a recessed portion (210) accommodating the substrate. The recessed portion includes a plurality of side wall portions (211) arranged around the substrate along a circumferential direction and respectively facing a plurality of sides (111) of the substrate in a plan view when viewing the substrate from a direction perpendicular to a circuit forming surface (110) of the substrate, and a plurality of gaps (212) each located between two of the plurality of side wall portions adjacent to each other in the circumferential direction. The substrate includes a plurality of corner portions (112) curved toward an inner side of the circuit forming surface in a plan view.
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公开(公告)号：US20230344196A1
公开(公告)日：2023-10-26
申请号：US18338467
申请日：2023-06-21
申请人： NICHIA CORPORATION
发明人： Hideyuki FUJIMOTO
IPC分类号： H01S5/02355 , H01S5/024 , H01S5/02345
CPC分类号： H01S5/02355 , H01S5/02469 , H01S5/02345 , H01S5/02212
摘要： A semiconductor laser device includes: a housing including: a first upper upward-facing surface, a mounting surface below the first upper upward-facing surface, inner lateral surfaces including a first inner lateral surface and a second inner lateral surface facing the first inner lateral surface, wherein the first upper upward-facing surface and the mounting surface are formed inward of the inner lateral surfaces, and a first wiring part disposed on the first upper upward-facing surface; a semiconductor laser element including: a light output surface, a first lateral surface extending from the light output surface and facing the first inner lateral surface, and a second lateral surface extending from the light output surface and opposite to the first lateral surface; and a first wire connected to the first wiring part for electrical connection of the semiconductor laser element.
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公开(公告)号：US20230305245A1
公开(公告)日：2023-09-28
申请号：US18321380
申请日：2023-05-22
申请人： AEVA, INC.
CPC分类号： G02B6/4271 , H01S5/02415 , H01L33/645 , G02B6/43
摘要： A method of cooling an optical sub-assembly includes operating a diode mounted to a diode submount structure and cooling the diode with a thermoelectric cooler (TEC) in thermal contact with the diode, wherein the diode is positioned between the diode submount structure and the TEC.
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公开(公告)号：US20230283043A1
公开(公告)日：2023-09-07
申请号：US18115615
申请日：2023-02-28
CPC分类号： H01S5/02469 , H01S5/005 , H01S5/4031
摘要： A laser diode apparatus includes a laser diode array having an emission surface and a mounting surface. A heatsink is in thermal communication with the laser diode array at the mounting surface. The heatsink extends perpendicularly away from at least one edge of the emission surface. Positive and negative electrical terminal blocks are in mechanical communication with the heatsink opposite the laser diode array. Electrical foils are in electrical communication with the laser diode array and the positive and negative terminals. The electrical foils extend perpendicularly away from the emission surface. The positive and negative electrical terminal blocks are electrically isolated from the heatsink. A cross-sectional footprint of the heatsink, positive and negative electrical terminal blocks, and electrical foils is not larger than 120% of a cross-sectional footprint of the laser diode array.
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公开(公告)号：US20230283042A1
公开(公告)日：2023-09-07
申请号：US18005386
申请日：2021-07-14
发明人： Masaya NAGATA
IPC分类号： H01S5/0237 , H01S5/024 , H01S5/02253
CPC分类号： H01S5/0237 , H01S5/02469 , H01S5/02253 , H01S5/183
摘要： Problems when a first pad on a first substrate for outputting a drive signal for driving a light-emitting element is bonded to a second pad on a second substrate having the light-emitting element are prevented. A light-emitting device includes a first substrate that outputs a drive signal for a light-emitting element, and a second substrate that is laminated on the first substrate and includes the light-emitting element. A first surface side of the first substrate includes a first pad that supplies the drive signal to the light-emitting element, a first conductive layer disposed on the first pad, and a bonding layer disposed on the first conductive layer, and a second surface side of the second substrate facing the first surface of the first substrate includes the light-emitting element having a mesa shape, and a second pad that is disposed on the light-emitting element and bonded to the first pad.
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公开(公告)号：US20230274955A1
公开(公告)日：2023-08-31
申请号：US18008103
申请日：2020-09-23
申请人： Viatron Co., Ltd.
发明人： Hyoung June Kim , Byung Kuk Kim , Wang Jun Park , Tae Hyeong Kim , Bo Ram Lee
IPC分类号： H01L21/67 , H01S5/42 , H01L21/687 , H01S5/024
CPC分类号： H01L21/67115 , H01S5/423 , H01L21/68764 , H01S5/02423
摘要： The present disclosure discloses a substrate heat-treatment apparatus using a VCSEL element, the substrate heat-treatment apparatus comprising: a process chamber in which a flat plate substrate to be heat-treated is mounted; and an irradiation module for irradiating a laser beam onto the flat plate substrate, the irradiation module including a sub-irradiation module which includes an element array plate, an element area which is mounted on an upper surface of the element array plate and on which the VCSEL element is mounted, and a terminal area on which an electrode terminal is mounted and which is located at the front or rear side of the element area, wherein, in the irradiation module, the element area and the terminal area are respectively arranged in the x-axis direction, and the element area and the terminal area are alternately arranged along the y-axis direction perpendicular to the x-axis direction.
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公开(公告)号：US11740419B2
公开(公告)日：2023-08-29
申请号：US17038076
申请日：2020-09-30
发明人： Daisuke Noguchi , Hiroshi Yamamoto
IPC分类号： H05K1/02 , H05K1/18 , G02B6/42 , H01S5/024 , H04Q11/00 , H01S5/02212 , H01S5/02345
CPC分类号： G02B6/428 , G02B6/4246 , G02B6/4263 , G02B6/4271 , H01S5/02212 , H01S5/02345 , H01S5/02415 , H04Q11/0005 , H04Q2011/0041
摘要： Provided is an optical subassembly, which is compact, is easy to manufacture, and has satisfactory high-frequency characteristics. The optical subassembly includes: an eyelet including a first surface, a second surface and a plurality of through-holes; a plurality of lead terminals; a relay substrate including a lead connection surface and a first bonding surface and having first and second conductor patterns formed across the lead connection surface and the first bonding surface; a device mounting unit including a second bonding surface having formed thereon third and fourth conductor patterns; and an optical device configured to convert one of an optical signal and the differential electrical signals into the other. The first and second conductor patterns on the first bonding surface are connected to the third and fourth conductor patterns by bonding wires, respectively, and the first and second bonding surfaces have normal directions in the same direction.
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公开(公告)号：US20230268720A1
公开(公告)日：2023-08-24
申请号：US18171432
申请日：2023-02-20
申请人： NICHIA CORPORATION
发明人： Tetsushi TAKANO , Masanori OKADA
CPC分类号： H01S5/143 , H01S5/1053 , H01S5/34346 , H01S5/041 , H01S5/02469 , H01S5/34333 , H01S5/028
摘要： The laser device includes a first mirror and a second mirror forming a resonator, a gain medium disposed between the first mirror and the second mirror and having a light emitting surface, an antireflection film provided on the light emitting surface of the gain medium, at least one optical element disposed between the gain medium and the second mirror, and a diffraction grating disposed between the optical element and the second mirror. The gain medium is a semiconductor layered body including an active layer and having a varying gain distribution in at least a first direction within the light emitting surface, and includes no waveguide.
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公开(公告)号：US11728618B2
公开(公告)日：2023-08-15
申请号：US17456827
申请日：2021-11-29
IPC分类号： H01S5/024 , H01S5/40 , H01S5/02325 , H01S5/02355 , H01S5/02218 , H01S5/02253
CPC分类号： H01S5/02469 , H01S5/02218 , H01S5/02325 , H01S5/02355 , H01S5/4025 , H01S5/02253
摘要： An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a sub-mount, one or more micro-devices attached to the sub-mount, and a lid attached to the sub-mount. The lid includes a dispense channel and a gel groove which allows for a thermal gel to be dispensed between the lid and the micro-device in a manner that mitigates the thermal gel dispersing and/or flowing onto components of the micro-devices.
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