公开(公告)号：US11061336B2

公开(公告)日：2021-07-13

申请号：US16493835

申请日：2018-03-28

Applicant: ASML NETHERLANDS B.V.

Inventor： Hubertus Johannes Gertrudus Simons ,  Everhardus Cornelis Mos ,  Xiuhong Wei ,  Reza Mahmoodi Baram ,  Hadi Yagubizade ,  Yichen Zhang

IPC: G03B27/68 ,  G03F7/20

Abstract: A device manufacturing method includes: exposing a first substrate using a lithographic apparatus to form a patterned layer having first features; processing the first substrate to transfer the first features into the first substrate; determining displacements of the first features from their nominal positions in the first substrate; determining a correction to at least partly compensate for the displacements; and exposing a second substrate using a lithographic apparatus to form a patterned layer having the first features, wherein the correction is applied for or during the exposing the second substrate.

公开(公告)号：US20210208511A1

公开(公告)日：2021-07-08

申请号：US16468304

申请日：2017-11-22

Applicant: ASML NETHERLANDS B.V.

Inventor： Wim Tjibbo TEL ,  Hans Erik KATTOUW ,  Valerio ALTINI ,  Bearrach MOEST

IPC: G03F7/20 ,  G03F9/00

Abstract: A lithographic apparatus and associated method of controlling a lithographic process. The lithographic apparatus has a controller configured to define a control grid associated with positioning of a substrate within the lithographic apparatus. The control grid is based on a device layout, associated with a patterning device, defining a device pattern which is to be, and/or has been, applied to the substrate in a lithographic process.

公开(公告)号：US20210208500A1

公开(公告)日：2021-07-08

申请号：US17206649

申请日：2021-03-19

Applicant: ASML NETHERLANDS B.V. ,  ASML HOLDING N.V.

Inventor： David Ferdinand VLES ,  Erik Achilles ABEGG ,  Aage BENDIKSEN ,  Derk Servatius Gertruda BROUNS ,  Pradeep K. GOVIL ,  Paul JANSSEN ,  Maxim Aleksandrovich NASALEVICH ,  Arnoud Willem NOTENBOOM ,  Mária PÉTER ,  Marcus Adrianus VAN DE KERKHOF ,  Willem Joan VAN DER ZANDE ,  Pieter-Jan VAN ZWOL ,  Johannes Petrus Martinus Bernardus VERMEULEN ,  Willem-Pieter VOORTHUIJZEN ,  James Norman WILEY

IPC: G03F1/64 ,  G03F1/22 ,  G03F7/20 ,  G03F1/62

Abstract: A pellicle suitable for use with a patterning device for a lithographic apparatus. The pellicle comprising at least one breakage region which is configured to preferentially break, during normal use in a lithographic apparatus, prior to breakage of remaining regions of the pellicle. At least one breakage region comprises a region of the pellicle which has a reduced thickness when compared to surrounding regions of the pellicle.

公开(公告)号：US11056311B2

公开(公告)日：2021-07-06

申请号：US16552991

申请日：2019-08-27

Applicant: ASML Netherlands B.V.

Inventor： Chih-Yu Jen ,  Long Ma ,  Yongjun Wang ,  Jun Jiang

IPC: H01J37/147 ,  H01J37/26 ,  H01J37/30 ,  G01N21/95 ,  G01N21/88 ,  H01J37/153 ,  H01J37/18

Abstract: An improved charged particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus for detecting a thin device structure defect is disclosed. An improved charged particle beam inspection apparatus may include a charged particle beam source to direct charged particles to a location of a wafer under inspection over a time sequence. The improved charged particle beam apparatus may further include a controller configured to sample multiple images of the area of the wafer at difference times over the time sequence. The multiple images may be compared to detect a voltage contrast difference or changes to identify a thin device structure defect.

公开(公告)号：US11050213B2

公开(公告)日：2021-06-29

申请号：US16910846

申请日：2020-06-24

Applicant: Cymer, LLC ,  ASML Netherlands B.V.

Inventor： Joshua Jon Thornes ,  Tanuj Aggarwal ,  Kevin Michael O'Brien ,  Frank Everts ,  Herman Philip Godfried ,  Russell Allen Burdt

IPC: G03F7/20 ,  H01S3/13 ,  H01S3/036 ,  H01S3/23 ,  H01S3/097 ,  H01S3/038 ,  H01S3/137 ,  G01J1/02 ,  H01S3/225 ,  H01S3/1055 ,  G01J1/42

Abstract: Online calibration of laser performance as a function of the repetition rate at which the laser is operated is disclosed. The calibration can be periodic and carried out during a scheduled during a non-exposure period. Various criteria can be used to automatically select the repetition rates that result in reliable in-spec performance. The reliable values of repetition rates are then made available to the scanner as allowed values and the laser/scanner system is then permitted to use those allowed repetition rates.

公开(公告)号：US11049689B2

公开(公告)日：2021-06-29

申请号：US16559459

申请日：2019-09-03

Applicant: ASML Netherlands B.V.

Inventor： Ehud Shaked ,  Martinus Maassen

IPC: H01J37/26 ,  H01J37/28 ,  H01J37/24 ,  H01J37/14 ,  H01J37/04 ,  H01J37/244 ,  H01J37/147

Abstract: Systems and methods for conducting charged particle beam modulation are disclosed. According to certain embodiments, a charged particle beam apparatus generates a plurality of charged particle beams. A modulator may be configured to receive the plurality of charged particle beams and generate a plurality of modulated charged particle beams. A detector may be configured to receive the plurality of modulated charged particle beams.

公开(公告)号：US20210193537A1

公开(公告)日：2021-06-24

申请号：US17097063

申请日：2020-11-13

Applicant: ASML Netherlands B.V.

Inventor： Chien-Hung CHOU ,  Wen-Tin TAI

IPC: H01L21/66 ,  G05B19/418 ,  G01N21/95

Abstract: Method and machine utilizes the real-time recipe to perform weak point inspection on a series of wafers during the fabrication of integrated circuits. Each real-time recipe essentially corresponds to a practical fabrication history of a wafer to be examined and/or the examination results of at least one examined wafer of same “lot”. Therefore, different wafers can be examined by using different recipes where each recipe corresponds to a specific condition of a wafer to be examined, even these wafers are received by a machine for examining at the same time.

公开(公告)号：US20210191280A1

公开(公告)日：2021-06-24

申请号：US17135527

申请日：2020-12-28

Applicant: ASML NETHERLANDS B.V.

Inventor： Mariya Vyacheslavivna Medvedyeva ,  Maria Isabel De La Fuente Valentin ,  Martijn Jongen ,  Giulio Bottegal ,  Thomai Zacharopoulou

IPC: G03F7/20

Abstract: A recipe selection method includes obtaining measurements from metrology targets, metrology targets positioned on a semiconductor substrate, obtaining measurements from in-device targets, in-device targets positioned on the semiconductor substrate, and determining a recipe for accurate metrology using both metrology target measurements and in-device metrology measurements.

公开(公告)号：US20210175041A1

公开(公告)日：2021-06-10

申请号：US17140699

申请日：2021-01-04

Applicant: ASML Netherlands B.V.

Inventor： Ronald VAN DER WILK

IPC: H01J5/46 ,  C03C27/04 ,  H01J5/36 ,  H01J9/28

Abstract: A feedthrough for providing an electrical connection is provided. The feedthrough comprises a conductor and a quartz or a glass structure configured to surround at least a portion of the conductor and provide isolation to the conductor. The conductor and the quartz or glass structure may be coaxially arranged. The feedthrough can provide an electrical connection between an inside and outside of a vacuum chamber that contains a sample.

公开(公告)号：US11029609B2

公开(公告)日：2021-06-08

申请号：US16467675

申请日：2017-12-06

Applicant: ASML NETHERLANDS B.V.

Inventor： Te-Sheng Wang

IPC: G03F7/20

Abstract: A method including: simulating an image or characteristics thereof, using characteristics of a design layout and of a patterning process, determining deviations between the image or characteristics thereof and the design layout or characteristics thereof; aligning a metrology image obtained from a patterned substrate and the design layout based on the deviations, wherein the patterned substrate includes a pattern produced from the design layout using the patterning process; and determining a parameter of a patterned substrate from the metrology image aligned with the design layout.