公开(公告)号：US5118385A

公开(公告)日：1992-06-02

申请号：US705843

申请日：1991-05-28

Applicant: Nalin Kumar ,  Charles W. C. Lin

Inventor： Nalin Kumar ,  Charles W. C. Lin

IPC: H01L21/48 ,  H01L23/498 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01L21/4857 ,  H01L23/49866 ,  H05K3/422 ,  H05K3/467 ,  H01L2924/00013 ,  H01L2924/0002

Abstract: Method for making a multilayer electrical interconnect with stacked pillars between layers using a minimal number of conventional process steps. The method includes sputtering a chromium/copper/titanium trilayer on a dielectric base, depositing a patterned mask on the trilayer, etching the exposed trilayer, removing the mask, depositing a layer of polyimide over the unetched copper, forming a via in the polyimide above the copper, electrolessly plating nickel into the via, and polishing the interconnect to form a planar top surface.

Abstract translation: 使用最少数量的常规工艺步骤在层之间制造具有堆叠柱的多层电互连的方法。 该方法包括在电介质基底上溅射铬/铜/钛三叠层，在三层上沉积图案化掩模，蚀刻暴露的三层，去除掩模，在未蚀刻的铜上沉积聚酰亚胺层，在上述聚酰亚胺中形成通孔 铜，无电镀镍到通孔中，并且研磨互连以形成平坦的顶表面。

公开(公告)号：US5077100A

公开(公告)日：1991-12-31

申请号：US422939

申请日：1989-10-17

Applicant: Robert F. Miracky

Inventor： Robert F. Miracky

IPC: H01L21/48 ,  H05K3/14

CPC classification number: H01L21/4846 ,  H05K3/146

Abstract: A method for forming connections between copper conductors disposed on a substrate includes the steps of coating the copper conductors with a layer of nickel, exposing the coated copper conductors to a gas which includes a tungsten-bearing compound, and irradiating the substrate with a laser beam to deposit the tungsten between the copper conductors. A system for forming connections between copper conductors disposed on a substrate, includes means for coating the copper conductors with a layer of nickel, means for exposing the coated copper conductors to a gas which includes a tungsten-bearing compound, and means for irradiating the substrate with a laser beam to deposit the tungsten between the copper conductors.

Abstract translation: 用于形成布置在基板上的铜导体之间的连接方法包括以下步骤：用镍层涂覆铜导体，将涂覆的铜导体暴露于包含含钨化合物的气体中，并用激光束 以将钨沉积在铜导体之间。 一种用于形成布置在基板上的铜导体之间的连接的系统，包括用镍层涂覆铜导体的装置，用于将涂覆的铜导体暴露于包含含钨化合物的气体的装置，以及用于照射基板 用激光束在铜导体之间沉积钨。

公开(公告)号：US5065504A

公开(公告)日：1991-11-19

申请号：US608769

申请日：1990-11-05

Applicant: Michael A. Olla

Inventor： Michael A. Olla

IPC: H01L21/00 ,  H01L21/60 ,  H01L23/498

CPC classification number: H01L24/86 ,  H01L21/67144 ,  H01L23/4985 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49121 ,  Y10T29/49213 ,  Y10T29/5193

Abstract: Slide forming tape-automated-bonded leads extending from an integrated circuit chip with a support ring on the leads between the outer periphery of the chip and the outer lead ends. After the leads are formed the support ring remains attached to the vertical portion of the leads opposite the chip. The present invention is well suited for minimizing and footprint on relatively long TAB leads which fan out and require a support ring to maintain proper lead pitch.

Abstract translation: 滑动成型带 - 自动粘合引线，从具有支撑环的集成电路芯片延伸到芯片外周和引线外引线之间。 在引线形成之后，支撑环保持附接到与芯片相对的引线的垂直部分。 本发明非常适合于在相对长的TAB引线上进行最小化和占用，该TAB引线扇出并需要支撑环来保持适当的引线间距。

公开(公告)号：US5056706A

公开(公告)日：1991-10-15

申请号：US438563

申请日：1989-11-20

Applicant: Thomas P. Dolbear ,  Colin A. Mackay ,  Richard D. Nelson

Inventor： Thomas P. Dolbear ,  Colin A. Mackay ,  Richard D. Nelson

IPC: B23K31/02 ,  B23K35/26 ,  H05K3/34

CPC classification number: B23K35/26 ,  B23K31/02 ,  H05K3/3463 ,  H05K3/3484

Abstract: A thermally and electrically conductive paste and its method of use for making a detachable and compliant thermal conductive connection between two surfaces or making an electrical connection between first and second electrical components. The paste is comprised of a liquid metal and particulate solid constituents which is non-solidifying, conformable, compliant, is removable, provides containment to impulsive loading, and is simple to apply.

Abstract translation: 一种导热和导电的糊剂及其用于在两个表面之间制造可拆卸和柔性导热连接或在第一和第二电气部件之间形成电连接的方法。 该糊状物由液体金属和非固化，顺应性，顺应性，可移除的颗粒状固体组分组成，提供了脉冲加载的容纳物，并且易于使用。

公开(公告)号：US5008512A

公开(公告)日：1991-04-16

申请号：US405377

申请日：1989-09-08

Applicant: Phillip J. Spletter ,  Colin A. MacKay

Inventor： Phillip J. Spletter ,  Colin A. MacKay

IPC: B23K26/18 ,  B23K26/32 ,  H01L21/60

CPC classification number: H01L24/86 ,  B23K26/18 ,  H01L24/80 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14

Abstract: A method is disclosed for laser bonding two highly reflective electrical members. The first electrical member is coated with a material that is well absorbent of laser energy at the laser beam wavelength, has a lower melting point than either the first or second electrical members, and has a low solubility in a solid alloy of the electrical members. The laser characteristics are selected so that as bonding occurs an alloy of the electrical members solidifies and a solidification front drives the molten coating and molten compounds containing the coating away from the bond interface towards the exterior periphery of the bond, and substantially all of the solidified bond interface consists of an alloy of the first and second members. The coating can also aid in wetting the bond interface. In one example a copper electrical member coated with tin is bonded to a gold electrical member using a pulsed YAG laser with a beam diameter of 0.002 inches, a wavelength of 1.064 microns, an energy output of 1/4 to 1/2 joule, and a pulse time of 1 millisecond. Substantially all of the resulting bond interface consists of a copper/gold alloy without any tin intermetallics.

Abstract translation: 公开了用于激光焊接两个高反射电气部件的方法。 第一电气部件被涂覆有在激光束波长处具有良好吸收激光能量的材料，具有比第一或第二电气部件更低的熔点，并且在电气部件的固体合金中具有低溶解度。 选择激光特性，使得当电气部件的合金固化时，凝固前驱体将熔融涂层和包含涂层的熔融化合物远离粘合界面朝向粘合剂的外周边，并且基本上全部固化 键合界面由第一和第二构件的合金构成。 涂层还可以帮助润湿粘合界面。 在一个实例中，涂覆有锡的铜电子部件使用波长为0.002英寸，波长为1.064微米，能量输出为1/4至1/2焦耳的脉冲YAG激光器结合到金电气部件，以及 脉冲时间为1毫秒。 基本上所有的结合界面均由不含锡金属间化合物的铜/金合金构成。

公开(公告)号：US5002123A

公开(公告)日：1991-03-26

申请号：US511163

申请日：1990-04-19

Applicant: Richard D. Nelson ,  Dennis J. Herrell

Inventor： Richard D. Nelson ,  Dennis J. Herrell

IPC: F28F3/02 ,  H01L23/473

CPC classification number: F28F3/02 ,  H01L23/473 ,  H01L2924/0002

Abstract: A fluid heat exchanger for cooling an electronic component having a housing for receiving heat from the electronic component in which the housing has a fluid inlet and an outlet at opposite ends of the housing. The cross-sectional area of the housing for conveying fluid from the inlet to the outlet decreases from the inlet to the outlet thereby reducing pressure drop without sacrificing thermal performance. The cross-sectional area may be decreased by tilting a top of the housing relative to a bottom, or providing a plurality of fins separated by channels in which the cross-sectional area of the channels decreases from the inlet to the outlet.

Abstract translation: 一种用于冷却电子部件的流体热交换器，所述电子部件具有用于从所述电子部件接收热量的壳体，其中所述壳体具有流体入口和在所述壳体的相对端处的出口。 用于将流体从入口输送到出口的壳体的横截面面积从入口到出口减小，从而在不牺牲热性能的情况下降低压降。 可以通过使壳体的顶部相对于底部倾斜来减小横截面面积，或者提供由通道分离的多个翅片，在该通道中通道的横截面积从入口到出口减小。

公开(公告)号：US4995551A

公开(公告)日：1991-02-26

申请号：US513504

申请日：1990-04-24

Applicant: Colin A. MacKay

Inventor： Colin A. MacKay

IPC: H01L21/60 ,  H01L23/532 ,  H05K3/10 ,  H05K3/32

CPC classification number: H01L24/12 ,  H01L23/5328 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H05K3/321 ,  H01L2224/13099 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29411 ,  H01L2224/29444 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/10681 ,  H05K3/102

Abstract: Bonding a plurality of TAB tape leads to electrical pads in and aligned with the surface of a die by covering the pads with a plurality of electrically conductive particles, aligning the electrical leads with the particles and the pads, and simultaneously bonding the particles to the pads and the electrical leads to the particles. Preferably the particles are solid spheres and may be applied in various ways such as covering the entire surface with the spheres, covering the pads with an adhesive material prior to the spheres, or covering the pads with a mixture of adhesive and spheres. The method is particularly well suited for flip chip bonding.

Abstract translation: 通过用多个导电颗粒覆盖焊盘，将多个TAB带引线连接到电极垫中并与芯片的表面对准，使电引线与颗粒和焊盘对准，同时将颗粒粘合到焊盘 并且电导致颗粒。 优选地，颗粒是固体球体，并且可以以各种方式施加，例如用球体覆盖整个表面，在球体之前用粘合剂材料覆盖垫，或者用粘合剂和球体的混合物覆盖垫片。 该方法特别适用于倒装芯片接合。

公开(公告)号：US4993482A

公开(公告)日：1991-02-19

申请号：US462688

申请日：1990-01-09

Applicant: Thomas P. Dolbear ,  Richard D. Nelson ,  David A. Gibson ,  Omkarnath R. Gupta

Inventor： Thomas P. Dolbear ,  Richard D. Nelson ,  David A. Gibson ,  Omkarnath R. Gupta

IPC: F28F1/12 ,  F28F13/00 ,  H01L23/367

CPC classification number: F28F1/122 ,  F28F13/00 ,  H01L23/3677 ,  H01L2224/16225

Abstract: A thermally conductive coiled spring laid on its side provides a compliant, high conductive, low force thermal path between a heat source and a heat sink. Each spring contact provides two parallel heat conduction paths via each coil in the spring. The spring can be canted to permit slidable contact with a surface. In one embodiment a plurality of copper springs arranged in parallel can provide a thermal path between an electronic component and a heat sink in close proximity. The springs may be permanently attached to at least one surface at the points of contact.

Abstract translation: 布置在其侧面上的导热螺旋弹簧在热源和散热器之间提供顺从的，高导电的低力热路径。 每个弹簧触点通过弹簧中的每个线圈提供两个平行的热传导路径。 弹簧可以倾斜以允许与表面滑动接触。 在一个实施例中，平行布置的多个铜弹簧可以在电子部件和靠近的散热器之间提供热路径。 弹簧可以在接触点处永久地附接到至少一个表面。

公开(公告)号：US4981715A

公开(公告)日：1991-01-01

申请号：US494897

申请日：1990-03-13

Applicant: Tom J. Hirsch ,  Charles W. C. Lin

Inventor： Tom J. Hirsch ,  Charles W. C. Lin

IPC: C23C18/16 ,  H05K3/18

CPC classification number: H05K3/185 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/2066 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/2006 ,  H05K2203/107

Abstract: A method is described for patterning electroless plated metal on a polymer substrate. A substrate is first coated with a polymer suitable for complexing noble metal compounds. The substrate is then complexed with a noble metal compound, such as containing palladium, selectively irradiated to form the desired conductor pattern, and then etched so that the desired pattern remains. The substrate is subsequently placed in an electroless plating bath to form a metal pattern. Alternatively, before applying the noble metal compound, a substrate immersed in a polymer solution suitable for complexing a noble metal compound can be selectively irradiated to selectively deposit polymer on the substrate, followed by applying a noble metal compound and an electroless plating bath.

Abstract translation: 描述了一种在聚合物基底上构图化学镀金属的方法。 首先用适合于络合贵金属化合物的聚合物涂覆基材。 然后将衬底与贵金属化合物（例如含有钯）复合，选择性地照射以形成所需的导体图案，然后蚀刻，使得所需图案保留。 然后将衬底放置在化学镀浴中以形成金属图案。 或者，在应用贵金属化合物之前，可以选择性地照射浸渍在适于配合贵金属化合物的聚合物溶液中的基板，以选择性地将聚合物沉积在基板上，然后涂覆贵金属化合物和化学镀浴。

公开(公告)号：US4945954A

公开(公告)日：1990-08-07

申请号：US414549

申请日：1989-09-28

Applicant: James D. Wehrly, Jr. ,  Michael J. Bertram

Inventor： James D. Wehrly, Jr. ,  Michael J. Bertram

IPC: B21D28/00 ,  B21D28/04 ,  B21D28/34 ,  B26F1/14 ,  H01L21/00 ,  H01L21/60 ,  H01L23/50

CPC classification number: H01L21/67144 ,  B26F1/14 ,  B26F2210/08 ,  Y10T83/8855

Abstract: A method and apparatus for aligning two mating tools is provided by a plurality of alignment members extending upward from the surface of one mating tool so that the alignment members engage in slidable contact with alignment tracks formed in the edges of the second mating tool. The alignment members and tracks can be formed in the four corners of rectangular mating tools, and the alignment members can be cylindrical rods with dome shaped tops. The alignment is useful both for tooling set-up as well as tooling usage. The alignment means can be used on a punch and lead form anvil for forming the outer leads of an integrated circuit bonded to a TAB tape.

Abstract translation: 用于对准两个配对工具的方法和装置由从一个配合工具的表面向上延伸的多个对准构件提供，使得对准构件与形成在第二配合工具的边缘中的对准轨道滑动接触。 对准构件和轨道可以形成在矩形配合工具的四个角中，并且对准构件可以是具有圆顶形顶部的圆柱形杆。 校准对于加工设置以及加工使用都很有用。 对准装置可用于冲头和导线砧上，用于形成结合到TAB带的集成电路的外引线。