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    Diffusion barrier coated substrates and methods of making the same
    43.
    发明授权
    Diffusion barrier coated substrates and methods of making the same 有权
    扩散阻挡涂层基材及其制备方法

    公开(公告)号：US09299845B2

    公开(公告)日：2016-03-29

    申请号：US12790627

    申请日：2010-05-28

    Applicant: Arvind Kamath ,  Michael Kocsis ,  Kevin McCarthy ,  Gloria Man Ting Wong

    Inventor： Arvind Kamath ,  Michael Kocsis ,  Kevin McCarthy ,  Gloria Man Ting Wong

    IPC: H01L29/786 ,  H01L27/12

    CPC classification number: H01L29/78603 ,  H01L27/1218 ,  H01L29/78681 ,  H01L29/7869

    Abstract: Semiconductor devices on a diffusion barrier coated metal substrates, and methods of making the same are disclosed. The semiconductor devices include a metal substrate, a diffusion barrier layer on the metal substrate, an insulator layer on the diffusion barrier layer, and a semiconductor layer on the insulator layer. The method includes forming a diffusion barrier layer on the metal substrate, forming an insulator layer on the diffusion barrier layer; and forming a semiconductor layer on the insulator layer. Such diffusion barrier coated substrates prevent diffusion of metal atoms from the metal substrate into a semiconductor device formed thereon.

    Abstract translation: 公开了扩散阻挡涂层金属基板上的半导体器件及其制造方法。 半导体器件包括金属衬底，金属衬底上的扩散阻挡层，扩散阻挡层上的绝缘体层以及绝缘体层上的半导体层。 该方法包括在金属基板上形成扩散阻挡层，在扩散阻挡层上形成绝缘体层; 以及在所述绝缘体层上形成半导体层。 这种扩散阻挡涂层的基板防止金属原子从金属基板扩散到形成在其上的半导体器件中。

    Methods for Manufacturing RFID Tags and Structures Formed Therefrom
    44.
    发明申请
    Methods for Manufacturing RFID Tags and Structures Formed Therefrom 审中-公开
    制造RFID标签和结构的方法

    公开(公告)号：US20160035762A1

    公开(公告)日：2016-02-04

    申请号：US14847999

    申请日：2015-09-08

    Applicant: James Montague CLEEVES ,  J. Devin MACKENZIE ,  Arvind KAMATH

    Inventor： James Montague CLEEVES ,  J. Devin MACKENZIE ,  Arvind KAMATH

    IPC: H01L27/12 ,  H01L29/872 ,  H01L49/02 ,  G06K19/073 ,  H01L23/13 ,  H01L23/66 ,  H01L29/66 ,  G06K19/077 ,  H01L29/786 ,  H01L23/14

    CPC classification number: H01L27/1255 ,  G06K19/073 ,  G06K19/07749 ,  H01F17/0006 ,  H01L23/13 ,  H01L23/142 ,  H01L23/66 ,  H01L27/127 ,  H01L27/1292 ,  H01L28/60 ,  H01L29/66143 ,  H01L29/66742 ,  H01L29/78696 ,  H01L29/872 ,  H01L2223/6611 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Radio frequency identification (RFID) tags and processes for manufacturing the same. The RFID device generally includes (1) a metal antenna and/or inductor; (2) a dielectric layer thereon, to support and insulate integrated circuitry from the metal antenna and/or inductor; (3) a plurality of diodes and a plurality of transistors on the dielectric layer, the diodes having at least one layer in common with the transistors; and (4) a plurality of capacitors in electrical communication with the metal antenna and/or inductor and at least some of the diodes, the plurality of capacitors having at least one layer in common with the plurality of diodes and/or with contacts to the diodes and transistors. The method preferably integrates liquid silicon-containing ink deposition into a cost effective, integrated manufacturing process for the manufacture of RFID circuits. Furthermore, the present RFID tags generally provide higher performance (e.g., improved electrical characteristics) as compared to tags containing organic electronic devices.

    Abstract translation: 射频识别（RFID）标签及其制造方法。 RFID设备通常包括（1）金属天线和/或电感器; （2）其上的介电层，用于支撑和绝缘来自金属天线和/或电感器的集成电路; （3）介电层上的多个二极管和多个晶体管，二极管具有至少一个与晶体管共同的层; 和（4）与金属天线和/或电感器以及至少一些二极管电连通的多个电容器，所述多个电容器具有与所述多个二极管共同的至少一个层和/或与所述多个二极管的触点 二极管和晶体管。 该方法优选将液态含硅油墨沉积物集成到用于制造RFID电路的成本有效的集成制造工艺中。 此外，与包含有机电子器件的标签相比，本发明的RFID标签通常提供更高的性能（例如，改进的电气特性）。

    Printed non-volatile memory
    48.
    发明授权
    Printed non-volatile memory 有权
    打印的非易失性存储器

    公开(公告)号：US07709307B2

    公开(公告)日：2010-05-04

    申请号：US11842884

    申请日：2007-08-21

    Applicant: Arvind Kamath ,  Patrick Smith ,  James Montague Cleeves

    Inventor： Arvind Kamath ,  Patrick Smith ,  James Montague Cleeves

    IPC: H01L21/00 ,  H01L21/84 ,  H01L21/336

    CPC classification number: H01L21/28518 ,  H01L21/288 ,  H01L21/76801 ,  H01L21/76895 ,  H01L27/115 ,  H01L27/11558 ,  H01L27/1292 ,  H01L29/66757 ,  H01L29/66825 ,  H01L29/7881

    Abstract: A nonvolatile memory cell is disclosed, having first and second semiconductor islands at the same horizontal level and spaced a predetermined distance apart, the first semiconductor island providing a control gate and the second semiconductor island providing source and drain terminals; a gate dielectric layer on at least part of the first semiconductor island; a tunneling dielectric layer on at least part of the second semiconductor island; a floating gate on at least part of the gate dielectric layer and the tunneling dielectric layer; and a metal layer in electrical contact with the control gate and the source and drain terminals. In one advantageous embodiment, the nonvolatile memory cell may be manufactured using an “all-printed” process technology.

    Abstract translation: 公开了一种非易失性存储单元，其具有位于相同水平位置并且间隔开预定距离的第一和第二半岛，所述第一半岛具有提供控制栅极和所述第二半岛岛提供源极和漏极端子; 在所述第一半导体岛的至少一部分上的栅介质层; 在所述第二半导体岛的至少一部分上的隧道介电层; 至少部分栅极电介质层和隧道电介质层上的浮栅; 以及与控制栅极以及源极和漏极端子电接触的金属层。 在一个有利的实施例中，可以使用“全印刷”工艺技术来制造非易失性存储单元。

    Printed dopant layers
    49.
    发明授权
    Printed dopant layers 有权
    印刷掺杂剂层

    公开(公告)号：US07701011B2

    公开(公告)日：2010-04-20

    申请号：US11888942

    申请日：2007-08-03

    Applicant: Arvind Kamath ,  James Montague Cleeves ,  Joerg Rockenberger ,  Patrick Smith ,  Fabio Zürcher

    Inventor： Arvind Kamath ,  James Montague Cleeves ,  Joerg Rockenberger ,  Patrick Smith ,  Fabio Zürcher

    IPC: H01L21/00 ,  H01L21/84

    CPC classification number: H01L27/12 ,  H01L27/1292 ,  H01L29/78618

    Abstract: An electronic device, including a substrate, a plurality of first semiconductor islands on the substrate, a plurality of second semiconductor islands on the substrate, a first dielectric film on the first subset of the semiconductor islands, second dielectric film on the second semiconductor islands, and a metal layer in electrical contact with the first and second semiconductor islands. The first semiconductor islands and the first dielectric film contain a first diffusible dopant, and the second semiconductor islands and the second dielectric layer film contain a second diffusible dopant different from the first diffusible dopant. The present electronic device can be manufactured using printing technologies, thereby enabling high-throughput, low-cost manufacturing of electrical circuits on a wide variety of substrates.

    Abstract translation: 一种电子器件，包括衬底，衬底上的多个第一半导体岛，衬底上的多个第二半导体岛，半导体岛的第一子集上的第一电介质膜，第二半导体岛上的第二电介质膜， 以及与第一和第二半导体岛电接触的金属层。 第一半导体岛和第一介电膜包含第一可扩散掺杂剂，第二半导体岛和第二介电层膜含有不同于第一可扩散掺杂剂的第二可扩散掺杂物。 本电子装置可以使用印刷技术制造，从而能够在各种基板上实现高通量，低成本的电路制造。

    Print Processing for Patterned Conductor, Semiconductor and Dielectric Materials
    50.
    发明申请
    Print Processing for Patterned Conductor, Semiconductor and Dielectric Materials 有权
    图案导体，半导体和电介质材料的印刷加工

    公开(公告)号：US20090065776A1

    公开(公告)日：2009-03-12

    申请号：US12114741

    申请日：2008-05-02

    Applicant: Erik SCHER ,  Steven Molesa ,  Joerg Rockenberger ,  Arvind Kamath ,  Ikuo Mori

    Inventor： Erik SCHER ,  Steven Molesa ,  Joerg Rockenberger ,  Arvind Kamath ,  Ikuo Mori

    IPC: H01L29/04 ,  C08L83/00 ,  H01L29/06 ,  H01L29/16 ,  H01L21/208

    CPC classification number: C09D5/24 ,  C09D11/101 ,  C09D11/322 ,  C09D11/36 ,  C09D11/54 ,  H01B3/02 ,  H01L21/02532 ,  H01L21/02601 ,  H01L21/02628 ,  H01L21/28008 ,  H01L27/1292 ,  H01L29/6675 ,  H01L29/78696 ,  Y10T428/24802

    Abstract: Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.

    Abstract translation: 实施例涉及从含有材​​料前体的油墨印刷特征。 在一些实施例中，材料包括电活性材料，例如半导体，金属或其组合。 在另一个实施例中，该材料包括电介质。 这些实施例提供改进的印刷工艺条件，其允许更精确地控制印刷线或其它特征的形状，轮廓和尺寸。 组合物和/或方法通过增加油墨中组分的粘度和质量负载来改善对钉扎的控制。 因此，示例性方法包括在基板上以图案印刷包含材料前体和溶剂的油墨; 以图案沉淀前体以形成钉扎线; 基本上蒸发溶剂以形成由钉扎线限定的材料前体的特征; 并将材料前体转化成图案化材料。

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