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公开(公告)号：US09343716B2
公开(公告)日：2016-05-17
申请号：US13339733
申请日：2011-12-29
Applicant: Fletcher Rothkopf , David A. Pakula , Daniel W. Jarvis , John Raff , Jeremy C. Franklin
Inventor： Fletcher Rothkopf , David A. Pakula , Daniel W. Jarvis , John Raff , Jeremy C. Franklin
IPC: H01M2/10 , H01M2/02 , H01L31/048 , H01M10/04 , H01M10/42 , H01M10/657 , H01M10/647 , H01M10/623 , H01M10/613 , H01M6/46
CPC classification number: H01M2/1066 , H01L31/048 , H01M2/0207 , H01M6/46 , H01M10/0436 , H01M10/425 , H01M10/613 , H01M10/623 , H01M10/647 , H01M10/657 , H01M10/6572 , H01M2220/30 , Y02E10/50 , Y10T156/10 , Y10T156/1082
Abstract: Flexible battery packs for use in electronic devices are disclosed. In one embodiment of the present disclosure, the flexible battery pack may include a plurality of cells, such as galvanic or photovoltaic cells. The battery pack also may include a plurality of laminate layers coupled to the cells that include a top laminate layer and a bottom laminate layer. An adhesive may be used to couple the top and bottom laminate layers together such that each of the plurality of cells is isolated from each other. This arrangement may allow the battery to be shaped to fit a form factor of the electronic device. This arrangement also may allow one or more of the cells to be selectively removed from the plurality, which may be desirable from a manufacturing perspective.
Abstract translation: 公开了用于电子设备的柔性电池组。 在本公开的一个实施例中，柔性电池组可以包括多个电池，例如电流或光伏电池。 电池组还可以包括耦合到电池的多个层压层，其包括顶层叠层和底层叠层。 可以使用粘合剂将顶部和底部层压层连接在一起，使得多个单元中的每一个彼此隔离。 这种布置可以允许电池成形为适合电子设备的外形尺寸。 这种布置还可以允许从多个单元中选择性地移除一个或多个单元，这从制造的角度来看是可取的。
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公开(公告)号：US08988628B2
公开(公告)日：2015-03-24
申请号：US13167663
申请日：2011-06-23
Applicant: Steven J. Martisauskas , Joshua G. Wurzel , David A. Pakula , Pinida J. Moolsintong
Inventor： Steven J. Martisauskas , Joshua G. Wurzel , David A. Pakula , Pinida J. Moolsintong
IPC: G02F1/1333 , H04M1/02
CPC classification number: G02F1/133308 , G02F2001/133334 , H04M1/0266
Abstract: A coated chassis is disclosed. The chassis can be made from a non-conductive material and can be operable to support a display. A conductive material can be applied to at least a portion of the chassis to form a continuous strip on the chassis frame. The conductive material can further form a closed-loop around the chassis frame. The chassis frame can be included within a device, such as a mobile phone, touchpad, portable computer, portable media player, and the like. The conductive material on the chassis can be coupled to the system ground of the device. Processes for making a coated chassis are also disclosed.
Abstract translation: 公开了涂覆的底盘。 底盘可以由非导电材料制成，并且可操作以支撑显示器。 导电材料可以施加到底盘的至少一部分，以在底架上形成连续条带。 导电材料可以进一步在底盘框架周围形成闭环。 底盘框架可以包括在诸如移动电话，触摸板，便携式计算机，便携式媒体播放器等的设备中。 底盘上的导电材料可以连接到设备的系统接地。 还公开了制造涂覆底盘的方法。
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公开(公告)号：US08933347B2
公开(公告)日：2015-01-13
申请号：US13610779
申请日：2012-09-11
Applicant: Bryan P. Kiple , Charles B. Woodhull , David A. Pakula , Tang Y. Tan
Inventor： Bryan P. Kiple , Charles B. Woodhull , David A. Pakula , Tang Y. Tan
IPC: H05K7/02 , B23P11/00 , B23P17/00 , H05K5/02 , H05K13/00 , C25D11/02 , C25D7/00 , C25D11/12 , H05K5/03 , H01Q1/42 , C25D11/34 , H04M1/02 , C25D11/24
CPC classification number: H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
Abstract translation: 公开了电子设备外壳的各种部件及其组装方法。 壳体可以通过将两个或更多个不同部分组装并连接在一起而形成。 壳体的部分可以使用一个或多个联接构件联接在一起。 联接构件可以使用双射模制工艺来形成，其中第一射击形成联接构件的结构部分，并且第二射击形成联接构件的化妆品部分。
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公开(公告)号：US08830662B2
公开(公告)日：2014-09-09
申请号：US13037887
申请日：2011-03-01
Applicant: Scott A. Myers , Douglas Weber , Tang Yew Tan , Richard Hung Minh Dinh , David A. Pakula , Jason Sloey
Inventor： Scott A. Myers , Douglas Weber , Tang Yew Tan , Richard Hung Minh Dinh , David A. Pakula , Jason Sloey
CPC classification number: H05K5/0086 , H05K5/0213
Abstract: Electronic devices may have openings that serve as potential pathways for moisture intrusion into interior portions of the devices. An electronic device may be provided with moisture repelling coatings in the vicinity of these openings to help prevent moisture from reaching the interior of the device. The openings may be associated with gaps between adjacent housing structures, openings for buttons, openings for audio and connector ports or other openings in device structures. The moisture repelling coatings may be applied to housing surfaces, button members, structures associated with audio and connector ports, and other device structures.
Abstract translation: 电子设备可以具有用作水分侵入设备内部部分的潜在途径的开口。 电子设备可以在这些开口附近设置防潮涂层，以帮助防止水分到达设备内部。 这些开口可以与相邻的壳体结构之间的间隙，用于按钮的开口，用于音频和连接器端口的开口或装置结构中的其它开口相关联。 防潮涂层可以施加到壳体表面，按钮构件，与音频和连接器端口相关联的结构以及其它装置结构。
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公开(公告)号：US20140066122A1
公开(公告)日：2014-03-06
申请号：US13602009
申请日：2012-08-31
Applicant: Ashutosh Y. Shukla , David A. Pakula , Sawyer I. Cohen
Inventor： Ashutosh Y. Shukla , David A. Pakula , Sawyer I. Cohen
CPC classification number: H02K41/0356 , Y10T83/606
Abstract: A portable electronic device comprises an electromechanical module having an actuator for positioning a mechanical element between first and second positions, and a controller coupled to the electromechanical module. The controller is configured to detect a mechanical event coupling to the electromechanical module, select an actuation signal to position the mechanical element in a safe position between the first and second positions, and transmit the selected signal, such that the mechanical element is positioned in the safe position during the event.
Abstract translation: 便携式电子设备包括具有用于在第一和第二位置之间定位机械元件的致动器的机电模块以及耦合到机电模块的控制器。 控制器被配置为检测耦合到机电模块的机械事件，选择致动信号以将机械元件定位在第一和第二位置之间的安全位置，并且传送所选择的信号，使得机械元件位于 活动期间的安全位置。
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Patent Agency Ranking
公开(公告)号：US20130319865A1
公开(公告)日：2013-12-05
申请号：US13610813
申请日：2012-09-11
Applicant: Lucy Elizabeth Browning , Charles B. Woodhull , Bryan Patrick Kiple , David A. Pakula , Tang Yew Tan , Julie Hanchak-Connors , John Murray Thornton, III , Thomas Johannessen , Peter Russell-Clarke , Masashige Tatebe , Napthaneal Y. Tan
Inventor： Lucy Elizabeth Browning , Charles B. Woodhull , Bryan Patrick Kiple , David A. Pakula , Tang Yew Tan , Julie Hanchak-Connors , John Murray Thornton, III , Thomas Johannessen , Peter Russell-Clarke , Masashige Tatebe , Napthaneal Y. Tan
IPC: C25D11/02
CPC classification number: H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
Abstract: Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.
Abstract translation: 描述了用于形成保护和美容地增强金属表面的阳极氧化层的方法和结构。 在一些实施方案中，方法包括在下面的金属上形成阳极氧化层，其允许下面的金属表面是可见的。 在一些实施例中，方法包括在倾斜表面上形成第一阳极氧化层和相邻的第二阳极氧化层，两个阳极氧化层之间的界面是规则的和均匀的。 描述的是光掩模技术和工具，用于在金属表面上阳极化和纹理化图案上提供锐利定义的角。 还描述了在电子设备的制造中提供耐阳极化部件的技术和工具。
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47.发明申请Methods For Assembling Electronic Devices Using Embedded Light Guide Structures 有权使用嵌入式光导体结构组装电子设备的方法公开(公告)号：US20130215638A1
公开(公告)日：2013-08-22
申请号：US13401692
申请日：2012-02-21
Applicant: Teodor Dabov , Casey J. Feinstein , David A. Pakula , Stephen Brian Lynch
Inventor： Teodor Dabov , Casey J. Feinstein , David A. Pakula , Stephen Brian Lynch
CPC classification number: G02B6/0081 , C09J5/00 , C09J2203/318 , C09J2205/31 , G02B6/001 , G02B6/0086 , G02B6/102
Abstract: Electronic devices may include assemblies of structures such as electronic device assemblies connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light guide structures may be mounted in the assemblies. During manufacture of an electronic device, ultraviolet light may be injected into a light guide structure to cure the light-cured liquid adhesive. A light guide structure may include portions that prevent escape of ultraviolet light and portions that allow ultraviolet light to escape into the light-cured liquid adhesive. Light guide structures may include masked portions, rigid support members, and one or more openings. Openings in a light guide structure may allow the light-cured liquid adhesive to be injected into an assembly through the openings. An adhesive applicator may be used to apply the adhesive to portions of the assembly. An external light source may be used to inject light that cures the adhesive into the light guide structures.
Abstract translation: 电子设备可以包括诸如使用诸如紫外光固化粘合剂的光固化液体粘合剂连接的电子设备组件的结构的组件。 导光结构可以安装在组件中。 在制造电子装置时，可以将紫外光注入导光结构中以固化光固化液体粘合剂。 光导结构可以包括防止紫外线逸出的部分和允许紫外线逸出到光固化液体粘合剂中的部分。 导光结构可以包括掩模部分，刚性支撑构件和一个或多个开口。 在导光结构中的开口可允许光固化的液体粘合剂通过开口注入到组件中。 可以使用粘合剂施加器将粘合剂施加到组件的部分。 外部光源可以用于将固化粘合剂的光注入光导结构中。
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公开(公告)号：USD678261S1
公开(公告)日：2013-03-19
申请号：US29426218
申请日：2012-07-02
Applicant: Jody Akana , Bartley K. Andre , Jeremy Bataillou , Daniel J. Coster , Daniele De Iuliis , Richard Hung Minh Dinh , Evans Hankey , Richard P. Howarth , Jonathan P. Ive , Duncan Robert Kerr , Scott A. Myers , Shin Nishibori , David A. Pakula , Matthew Dean Rohrbach , Peter Russell-Clarke , Christopher J. Stringer , Eugene Antony Whang , Tang Yew Tan , Rico Zorkendorfer
Designer： Jody Akana , Bartley K. Andre , Jeremy Bataillou , Daniel J. Coster , Daniele De Iuliis , Richard Hung Minh Dinh , Evans Hankey , Richard P. Howarth , Jonathan P. Ive , Steve Jobs , Duncan Robert Kerr , Scott A. Myers , Shin Nishibori , David A. Pakula , Matthew Dean Rohrbach , Peter Russell-Clarke , Christopher J. Stringer , Eugene Antony Whang , Tang Yew Tan , Rico Zorkendorfer
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公开(公告)号：US20120224299A1
公开(公告)日：2012-09-06
申请号：US13037887
申请日：2011-03-01
Applicant: Scott A. Myers , Douglas Weber , Tang Yew Tan , Richard Hung Minh Dinh , David A. Pakula , Jason Sloey
Inventor： Scott A. Myers , Douglas Weber , Tang Yew Tan , Richard Hung Minh Dinh , David A. Pakula , Jason Sloey
IPC: H05K7/00
CPC classification number: H05K5/0086 , H05K5/0213
Abstract: Electronic devices may have openings that serve as potential pathways for moisture intrusion into interior portions of the devices. An electronic device may be provided with moisture repelling coatings in the vicinity of these openings to help prevent moisture from reaching the interior of the device. The openings may be associated with gaps between adjacent housing structures, openings for buttons, openings for audio and connector ports or other openings in device structures. The moisture repelling coatings may be applied to housing surfaces, button members, structures associated with audio and connector ports, and other device structures.
Abstract translation: 电子设备可以具有用作水分侵入设备内部部分的潜在途径的开口。 电子设备可以在这些开口附近设置防潮涂层，以帮助防止水分到达设备内部。 这些开口可以与相邻的壳体结构之间的间隙，用于按钮的开口，用于音频和连接器端口的开口或装置结构中的其它开口相关联。 防潮涂层可以施加到壳体表面，按钮构件，与音频和连接器端口相关联的结构以及其它装置结构。
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公开(公告)号：USD662922S1
公开(公告)日：2012-07-03
申请号：US29376156
申请日：2010-10-01
Applicant: Jody Akana , Bartley K. Andre , Jeremy Bataillou , Daniel J. Coster , Daniele De Iuliis , Richard Hung Minh Dinh , Evans Hankey , Richard P. Howarth , Jonathan P. Ive , Steve Jobs , Duncan Robert Kerr , Scott A. Myers , Shin Nishibori , David A. Pakula , Matthew Dean Rohrbach , Peter Russell-Clarke , Christopher J. Stringer , Tang Yew Tan , Eugene Antony Whang , Rico Zorkendorfer
Designer： Jody Akana , Bartley K. Andre , Jeremy Bataillou , Daniel J. Coster , Daniele De Iuliis , Richard Hung Minh Dinh , Evans Hankey , Richard P. Howarth , Jonathan P. Ive , Steve Jobs , Duncan Robert Kerr , Scott A. Myers , Shin Nishibori , David A. Pakula , Matthew Dean Rohrbach , Peter Russell-Clarke , Christopher J. Stringer , Tang Yew Tan , Eugene Antony Whang , Rico Zorkendorfer
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