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公开(公告)号:US08988628B2
公开(公告)日:2015-03-24
申请号:US13167663
申请日:2011-06-23
IPC分类号: G02F1/1333 , H04M1/02
CPC分类号: G02F1/133308 , G02F2001/133334 , H04M1/0266
摘要: A coated chassis is disclosed. The chassis can be made from a non-conductive material and can be operable to support a display. A conductive material can be applied to at least a portion of the chassis to form a continuous strip on the chassis frame. The conductive material can further form a closed-loop around the chassis frame. The chassis frame can be included within a device, such as a mobile phone, touchpad, portable computer, portable media player, and the like. The conductive material on the chassis can be coupled to the system ground of the device. Processes for making a coated chassis are also disclosed.
摘要翻译: 公开了涂覆的底盘。 底盘可以由非导电材料制成,并且可操作以支撑显示器。 导电材料可以施加到底盘的至少一部分,以在底架上形成连续条带。 导电材料可以进一步在底盘框架周围形成闭环。 底盘框架可以包括在诸如移动电话,触摸板,便携式计算机,便携式媒体播放器等的设备中。 底盘上的导电材料可以连接到设备的系统接地。 还公开了制造涂覆底盘的方法。
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公开(公告)号:US20120327324A1
公开(公告)日:2012-12-27
申请号:US13167663
申请日:2011-06-23
CPC分类号: G02F1/133308 , G02F2001/133334 , H04M1/0266
摘要: A coated chassis is disclosed. The chassis can be made from a non-conductive material and can be operable to support a display. A conductive material can be applied to at least a portion of the chassis to form a continuous strip on the chassis frame. The conductive material can further form a closed-loop around the chassis frame. The chassis frame can be included within a device, such as a mobile phone, touchpad, portable computer, portable media player, and the like. The conductive material on the chassis can be coupled to the system ground of the device. Processes for making a coated chassis are also disclosed.
摘要翻译: 公开了涂覆的底盘。 底盘可以由非导电材料制成,并且可操作以支撑显示器。 导电材料可以施加到底盘的至少一部分,以在底架上形成连续条带。 导电材料可以进一步在底盘框架周围形成闭环。 底盘框架可以包括在诸如移动电话,触摸板,便携式计算机,便携式媒体播放器等的设备中。 底盘上的导电材料可以连接到设备的系统接地。 还公开了制造涂覆底盘的方法。
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公开(公告)号:US20110255250A1
公开(公告)日:2011-10-20
申请号:US12794599
申请日:2010-06-04
申请人: Richard Hung Minh Dinh , Tang Yew Tan , Nicholaus Ian Lubinski , Jason Sloey , Shayan Malek , Scott Myers , Wyeman Chen , Dennis R. Pyper , Douglas P. Kidd , Joshua G. Wurzel , David A. Pakula
发明人: Richard Hung Minh Dinh , Tang Yew Tan , Nicholaus Ian Lubinski , Jason Sloey , Shayan Malek , Scott Myers , Wyeman Chen , Dennis R. Pyper , Douglas P. Kidd , Joshua G. Wurzel , David A. Pakula
CPC分类号: H05K9/0024 , B32B17/061 , B41F17/00 , G03B15/03 , G06F1/1626 , G06F1/1656 , H01L23/24 , H01L23/296 , H01L23/3737 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01M2/026 , H01M2/0292 , H01M2220/30 , H03F3/195 , H03F3/213 , H03F2200/451 , H04M1/0277 , H05K1/0203 , H05K1/0215 , H05K1/181 , H05K1/189 , H05K3/341 , H05K3/3447 , H05K3/363 , H05K2201/0116 , H05K2201/0162 , H05K2201/056 , H05K2201/10106 , H05K2201/10121 , H05K2201/10371 , H05K2201/10409 , H05K2201/2009 , H05K2203/1316 , Y02P70/613 , Y10T29/4911
摘要: Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards.
摘要翻译: 可以提供包括机械和电子部件的电子设备。 连接器可用于连接安装到印刷电路的印刷电路和器件。 印刷电路可以包括刚性印刷电路板和柔性印刷电路板。 可以使用诸如整流罩的化妆结构来改善设备的美观性。 缓冲器可以安装在印刷电路板的粗糙边缘上,以保护布线在印刷电路板上的柔性电路。 紧固件可以焊接到印刷电路板上的焊盘结构上。
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公开(公告)号:US09578769B2
公开(公告)日:2017-02-21
申请号:US13610782
申请日:2012-09-11
申请人: Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Douglas Joseph Weber , Christopher D. Prest , Dale N. Memering , Bryan P. Kiple
发明人: Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Douglas Joseph Weber , Christopher D. Prest , Dale N. Memering , Bryan P. Kiple
IPC分类号: H01Q1/42 , H05K5/04 , B23P11/00 , B23P17/00 , G03F1/38 , H01Q1/24 , H04M1/02 , H05K5/02 , H05K13/00 , C25D11/02 , C25D7/00 , C25D11/12 , H05K5/03 , C25D11/34 , B23C5/10 , B23C5/00 , B23P17/02 , H04M1/11 , C25D11/24
CPC分类号: H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
摘要: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
摘要翻译: 公开了电子设备外壳的各种部件及其组装方法。 壳体可以通过将两个或更多个不同部分组装并连接在一起而形成。 壳体的部分可以使用一个或多个联接构件联接在一起。 联接构件可以使用双射模制工艺来形成,其中第一射击形成联接构件的结构部分,并且第二射击形成联接构件的化妆品部分。
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公开(公告)号:US08927881B2
公开(公告)日:2015-01-06
申请号:US13607440
申请日:2012-09-07
申请人: Michael B. Wittenberg , Sawyer I. Cohen , Jared M. Kole , Shayan Malek , David A. Pakula , Ashutosh Y. Shukla
发明人: Michael B. Wittenberg , Sawyer I. Cohen , Jared M. Kole , Shayan Malek , David A. Pakula , Ashutosh Y. Shukla
IPC分类号: H05K7/14
CPC分类号: H01Q1/243
摘要: Electronic devices may be provided with electronic components and cowling structures that secure the electronic components. A cowling structure may include a metal portion and an insulating portion that has been insert-molded onto the metal portion. The metal portion and the insert-molded insulating portion may each have an opening that receives a screw. The screws may pass through the respective opening and attach to a substrate. The substrate may be a transparent cover layer for a device display. The cowling structure may press the electronic components against the transparent substrate layer. The device may include an antenna. The insert-molded insulating portion may extend from an edge of the metal portion in the direction of the antenna. The insert-molded insulating portion may prevent one of the screws from forming an electrical connection with the metal portion.
摘要翻译: 电子设备可以设置有固定电子部件的电子部件和整流罩结构。 整流罩结构可以包括已经插入模制到金属部分上的金属部分和绝缘部分。 金属部分和嵌入成型的绝缘部分可以各自具有容纳螺钉的开口。 螺钉可以穿过相应的开口并附着到基底上。 衬底可以是用于器件显示的透明覆盖层。 整流罩结构可以将电子部件压靠在透明基板层上。 该装置可以包括天线。 插入成型的绝缘部分可以沿着天线的方向从金属部分的边缘延伸。 插入成型的绝缘部分可以防止其中一个螺钉与金属部分形成电连接。
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公开(公告)号:US08862182B2
公开(公告)日:2014-10-14
申请号:US13602009
申请日:2012-08-31
IPC分类号: H04M1/00
CPC分类号: H02K41/0356 , Y10T83/606
摘要: A portable electronic device comprises an electromechanical module having an actuator for positioning a mechanical element between first and second positions, and a controller coupled to the electromechanical module. The controller is configured to detect a mechanical event coupling to the electromechanical module, select an actuation signal to position the mechanical element in a safe position between the first and second positions, and transmit the selected signal, such that the mechanical element is positioned in the safe position during the event.
摘要翻译: 便携式电子设备包括具有用于在第一和第二位置之间定位机械元件的致动器的机电模块以及耦合到机电模块的控制器。 控制器被配置为检测耦合到机电模块的机械事件,选择致动信号以将机械元件定位在第一和第二位置之间的安全位置,并且传送所选择的信号,使得机械元件位于 活动期间的安全位置。
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公开(公告)号:US20140063265A1
公开(公告)日:2014-03-06
申请号:US13605837
申请日:2012-09-06
CPC分类号: G03B13/18 , G03B17/12 , G03B2217/002 , H04N5/225 , H04N5/2257 , H04N17/00
摘要: An electronic device may include a camera module. Control circuitry within the electronic device may use an image sensor within the camera module to acquire digital images. The camera module may have lens structures that are supported by lens support structures such as a lens barrel and lens carrier. An actuator such as a voice coil motor may control the position of the lens support structures relative to internal support structures such as upper and lower spacer members. Springs may be used to couple the lens support structures to the internal support structures. Outer wall structures in the camera module such as a ferromagnetic shield structures may surround and enclose at least some of the internal support structures. The outer wall structures may have openings. The internal support structures may have pins or other alignment structures that protrude through the openings.
摘要翻译: 电子设备可以包括相机模块。 电子设备内的控制电路可以使用相机模块内的图像传感器来获取数字图像。 相机模块可以具有透镜支架结构支撑的透镜结构,例如透镜镜筒和透镜支架。 诸如音圈马达的致动器可以控制透镜支撑结构相对于诸如上部和下部间隔件的内部支撑结构的位置。 弹簧可用于将透镜支撑结构连接到内部支撑结构。 相机模块中的诸如铁磁屏蔽结构的外壁结构可围绕并包围至少一些内部支撑结构。 外壁结构可以具有开口。 内部支撑结构可以具有突出穿过开口的销或其它对准结构。
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公开(公告)号:US08610822B2
公开(公告)日:2013-12-17
申请号:US12794664
申请日:2010-06-04
申请人: Trent Weber , Scott Myers , David A. Pakula , Matthew Hill , Erik L. Wang , Richard Hung Minh Dinh
发明人: Trent Weber , Scott Myers , David A. Pakula , Matthew Hill , Erik L. Wang , Richard Hung Minh Dinh
IPC分类号: H04N5/225
CPC分类号: G03B17/02 , B23K26/351 , H04N5/2251
摘要: An electronic device may be provided with a housing. A camera module may be mounted within the housing. The housing may have a camera window with which a lens in the camera module is aligned. To rotationally and laterally align the camera module with respect to the camera window and the electronic device housing, an alignment structure may be mounted to the housing in alignment with the camera window and housing. The alignment structure may be formed form a ring-shaped structure with an opening. The alignment structures may have sidewalls that form an alignment groove for the camera module. The camera window may be formed from a circular opening in a layer of opaque material deposited on a transparent housing member such as a planar layer of glass. During the process, a laser tool may be used to trim the opening in the opaque material.
摘要翻译: 电子设备可以设置有壳体。 相机模块可以安装在壳体内。 外壳可以具有相机窗口,照相机模块中的透镜与其对准。 为了相对于照相机窗口和电子设备外壳旋转和横向对准照相机模块,对准结构可以安装到壳体上,与摄像机窗口和外壳对准。 对准结构可以形成为具有开口的环形结构。 对准结构可以具有形成相机模块的对准凹槽的侧壁。 相机窗口可以由沉积在诸如平面玻璃层的透明外壳构件上的不透明材料层中的圆形开口形成。 在该过程中,可以使用激光工具来修整不透明材料中的开口。
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公开(公告)号:US20130321237A1
公开(公告)日:2013-12-05
申请号:US13610782
申请日:2012-09-11
申请人: Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Douglas Joseph Weber , Christopher D. Prest , Dale N. Memering , Bryan P. Kiple
发明人: Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Douglas Joseph Weber , Christopher D. Prest , Dale N. Memering , Bryan P. Kiple
IPC分类号: H01Q1/42
CPC分类号: H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
摘要: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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公开(公告)号:US20130320823A1
公开(公告)日:2013-12-05
申请号:US13610773
申请日:2012-09-11
CPC分类号: H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
摘要: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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