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公开(公告)号:US11358828B2
公开(公告)日:2022-06-14
申请号:US16756074
申请日:2018-10-18
Applicant: HEXCEL COMPOSITES LIMITED , HEXCEL CORPORATION
Inventor: John Ellis , Anthony Loccisano
IPC: B65H49/20
Abstract: There is provide a process for unwinding material from a spool (2) wherein the angle (Θ) of take off at the first contact point (4) for the unwind is always in the range 0±20°, and wherein the first contact point (4) for the unwind is no more than 600 mm from the axis (3) of rotation of the spool (2). There is also provided an apparatus for the unwinding of material from a spool (2) comprising an axis (3) upon which a spool (2) may be rotatably mounted and a static first contact point (4) for the unwound material positioned no more than 600 mm from the centre of the axis (3), wherein the angle (Θ) of take off at the first contact point (4) for the unwind is always in the range 0±20°.
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公开(公告)号:US20220009183A1
公开(公告)日:2022-01-13
申请号:US17293353
申请日:2019-11-08
Applicant: HEXCEL COMPOSITES LIMITED
Inventor: Marco ARCIDIACONO
Abstract: A method of manufacture of a composite component is provided, the method comprising the steps of providing two layers of pre-preg composite material, one of which has an edge adjacent a surface of the other. Pressure and, optionally, vibrational energy is applied to the edge to thereby smooth the ply drop.
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公开(公告)号:US11072127B2
公开(公告)日:2021-07-27
申请号:US16311934
申请日:2017-06-07
Applicant: HEXCEL COMPOSITES LIMITED
Inventor: Marco Arcidiacono , John Ellis , Benjamin Chau
Abstract: Process for forming a permanent join between two sections of fibrous material contained in a thermosetting resin matrix, said process comprising overlaying the two sections and subjecting the overlaid sections to ultrasonic welding to form a permanent join between the two sections, wherein there is no significant change in the sub-ambient Tg of the fibrous material contained in the thermosetting resin matrix in the region of the permanent join.
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公开(公告)号:US20180361682A1
公开(公告)日:2018-12-20
申请号:US16108640
申请日:2018-08-22
Applicant: Hexcel Composites Limited
Inventor: Stephen Mortimer , John Cawse
Abstract: One or more layers of structured thermoplastic polymer are located within the interleaf zones of a preform or prepreg. The structured thermoplastic polymer is a film or membrane formed by: a) dissolving polyethersulfone or polyetherimide in a solvent to form a polymer dope; b) dispersing a curing agent for an epoxy resin in the polymer dope to form a curative-enriched polymer dope; c) casting the curative-enriched polymer dope onto a surface to form a dope layer; and d) removing the solvent from the dope layer to form a layer of structured thermoplastic polymer.
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公开(公告)号:US10119001B2
公开(公告)日:2018-11-06
申请号:US15229067
申请日:2016-08-04
Applicant: Hexcel Corporation , Hexcel Composites Limited
Inventor: Yen-Seine Wang , Chris Mason , Martin Simmons
Abstract: Uncured epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising difunctional epoxy resin, trifunctional epoxy resin and/or tetrafunctional epoxy resin and a sufficient amount of [3-(4-aminobenzoyl) oxyphenyl]4-aminobenzoate (3-ABOAB), as a curing agent, such that the uncured resin can be stored at room temperature of at least 6 weeks and wherein the uncured resin can be fully cured in no more than 2 hours at a temperature of between 175° C. and 185° C.
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公开(公告)号:US20170267808A1
公开(公告)日:2017-09-21
申请号:US15529884
申请日:2015-12-20
Applicant: Hexcel Composites Limited
Inventor: Martin Simmons , Scott Thompson , Steve Mortimer
CPC classification number: C08G59/245 , C08G59/24 , C08G59/40 , C08G59/4064 , C08G59/5033 , C08G59/504 , C08J5/24 , C08J2363/00 , C08L63/00 , C08L2205/025 , C08L2207/53
Abstract: A resin composition for producing a composite, wherein the composition comprises (a) resin component comprising a glycidyl bisphenol Z epoxy resin, and (b) a curing agent.
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公开(公告)号:US20170226274A1
公开(公告)日:2017-08-10
申请号:US15502511
申请日:2015-09-21
Applicant: Hexcel Composites Limited
Inventor: Chris Harrington
CPC classification number: C08G59/4021 , C08G59/40 , C08J5/042 , C08J5/10 , C08J5/24 , C08J2363/00 , C08K5/09 , C08K5/103 , C08L63/00
Abstract: This invention relates to an epoxy resin formulation containing a curative that can be cured at 150° C. to 95% cure in no more than 150 seconds, and can be cured at 120° C. to 95% cure in no more than 4 minutes. This results in a cured resin having a Tg no greater than 140° C. wherein the formulation further contains a mould release agent.
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公开(公告)号:US20160053060A1
公开(公告)日:2016-02-25
申请号:US14442552
申请日:2013-11-20
Applicant: HEXCEL COMPOSITES LIMITED , HEXCEL HOLDING GMBH
Inventor: Johannes Moser , Philip Hadley , Ben Tipler , Chris Harrington , Nicholas Verge
CPC classification number: C08J5/18 , B29C35/0288 , B29C70/44 , B29C70/84 , B29D99/0025 , B29K2063/00 , B29L2007/002 , B29L2031/085 , C08G59/50 , C08J5/04 , C08J5/24 , C08J2363/00 , F03D1/0675 , Y02E10/721 , Y02P70/523
Abstract: A cured or partly cured fiber reinforced sheet material comprising reinforcement fibres and a reinforcement resin material, wherein the reinforcement resin material comprises an epoxy resin having an epoxy equivalent weight in the range of from 50 to 250, preferably from 100 to 200, and an amine hardener, the sheet material comprising a surface structure for spacing the sheet material from adjacent moulding materials.
Abstract translation: 一种固化或部分固化的纤维增强片材,其包含增强纤维和增强树脂材料,其中所述增强树脂材料包含环氧当量为50-250,优选为100-200的环氧树脂,以及胺 硬化剂,片材包括用于将片材与相邻成型材料隔开的表面结构。
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公开(公告)号:US20150299407A1
公开(公告)日:2015-10-22
申请号:US14441196
申请日:2013-12-20
Applicant: HEXCEL COMPOSITES LIMITED
Inventor: Chris Harrington
CPC classification number: C08J5/24 , B32B5/08 , B32B5/22 , B32B5/26 , B32B27/08 , B32B37/182 , B32B2250/20 , B32B2255/02 , B32B2255/205 , B32B2260/021 , B32B2260/046 , B32B2262/02 , B32B2262/0269 , B32B2262/06 , B32B2262/08 , B32B2262/10 , B32B2262/101 , B32B2262/106 , B32B2262/14 , B32B2305/076 , B32B2305/08 , B32B2307/50 , B32B2307/718 , B32B2603/00 , B32B2605/08 , B32B2605/18 , C08G59/18 , C08G59/4021 , C08J5/042 , C08J2363/00 , C08J2363/02 , C08J2463/04 , C08J2471/10 , C08L63/00 , C08L2205/02 , C08L2205/03 , C08L2205/06
Abstract: A fast cure epoxy resin system is provided that upon curing has a Tg no greater than 140° C. and a Phase angle below 20° at a temperature of 140° C. or below, and prepregs and mouldings based on the system. The resin formulation matches the reactivity of the resin to the amount of curative and hardener employed.
Abstract translation: 提供了一种快速固化的环氧树脂体系,其在固化时的Tg不超过140℃,相位角在140℃或更低的温度下低于20°,以及基于该体系的预浸料和模制品。 树脂配方将树脂的反应性与所用的固化剂和固化剂的量相匹配。
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公开(公告)号:US20150210039A1
公开(公告)日:2015-07-30
申请号:US14625197
申请日:2015-02-18
Applicant: Hexcel Composites Limited
Inventor: Martin Simmons , John Ellis , John Cawse , George Green
CPC classification number: B32B5/26 , B32B5/12 , B32B5/16 , B32B5/22 , B32B5/24 , B32B5/30 , B32B2250/20 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/106 , B32B2264/02 , B32B2264/0214 , B32B2264/0264 , B32B2264/10 , B32B2264/105 , B32B2264/108 , B32B2264/12 , B32B2305/076 , B32B2307/202 , B32B2307/212 , B32B2605/18 , B64D45/02 , B82Y30/00 , C08J5/005 , C08J5/10 , C08J5/24 , C08J2363/00 , Y10S428/929 , Y10S428/931 , Y10T29/49117 , Y10T428/24612 , Y10T428/249921 , Y10T428/25 , Y10T428/254 , Y10T428/31504 , Y10T442/2016 , Y10T442/209 , Y10T442/2107 , Y10T442/2115 , Y10T442/2123 , Y10T442/2418 , Y10T442/2426 , Y10T442/67 , Y10T442/673
Abstract: A prepreg comprising a single structural layer of electrically conductive unidirectional fibres and a first outer layer of curable resin substantially free of structural fibres, and optionally a second outer layer of curable resin substantially free of structural fibres, the sum of the thicknesses of the first and second outer resin layers at a given point having an average of at least 10 micrometres and varying over at least the range of from 50% to 120% of the average value, and wherein the first outer layer comprises electrically conductive particles.
Abstract translation: 一种预浸料,其包括导电单向纤维的单一结构层和基本上不含结构纤维的可固化树脂的第一外层,以及任选的基本上不含结构纤维的可固化树脂的第二外层,第一和第二层的厚度之和 在给定点处的第二外部树脂层具有至少10微米的平均值,并且在平均值的至少50%至120%的范围内变化,并且其中第一外层包含导电颗粒。
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