公开(公告)号：US20080245510A1

公开(公告)日：2008-10-09

申请号：US12142381

申请日：2008-06-19

Applicant: Min-Hui YU ,  Chi-Feng LIN ,  Chin-Ming CHEN

Inventor： Min-Hui YU ,  Chi-Feng LIN ,  Chin-Ming CHEN

IPC: F28D15/00

CPC classification number: F28D15/0283 ,  B23P15/26 ,  F28D15/046 ,  F28F1/14 ,  F28F1/24 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

Abstract: A heat dissipation apparatus includes a plurality of fins and a two-phase heat exchange device connected to the fins. The two-phase heat exchange device includes a main body and a continuous wick structure. The main body forms a closed space therein, and the continuous wick structure is disposed on the entire inner surface of the main body. Methods for manufacturing a two-phase heat exchange device and a heat dissipation apparatus are also introduced.

Abstract translation: 散热装置包括多个散热片和连接到散热片的两相热交换装置。 两相热交换装置包括主体和连续的芯结构。 主体在其中形成封闭空间，并且连续芯体结构设置在主体的整个内表面上。 还介绍了制造两相热交换装置和散热装置的方法。

公开(公告)号：US20080238806A1

公开(公告)日：2008-10-02

申请号：US11691026

申请日：2007-03-26

Applicant: Chao-Hui Yu ,  Hung-Jen Chen ,  Jia-Hung Su ,  Kai Shih ,  Yu-Yuan Wu

Inventor： Chao-Hui Yu ,  Hung-Jen Chen ,  Jia-Hung Su ,  Kai Shih ,  Yu-Yuan Wu

IPC: H01Q9/04 ,  H01Q1/12

CPC classification number: H01Q1/243 ,  H01Q1/48

Abstract: An antenna structure for mobile phone comprises a PCB (printed circuit board), an antenna portion and a second grounding portion position connected to the PCB. A face of the PCB is smeared with a stratum metal material and functioning as a first grounding portion. The antenna portion further has an antenna, a feeding point and a grounding point connected with the antenna. The second grounding portion connected to the PCB on another side of the PCB opposite to the antenna portion. Because the area of the grounding portion is increased, the electric field could be equality distributed within the whole grounding portion.

Abstract translation: 用于移动电话的天线结构包括连接到PCB的PCB（印刷电路板），天线部分和第二接地部分位置。 PCB的表面涂有金属层，并作为第一接地部分。 天线部还具有与天线连接的天线，馈电点和接地点。 第二接地部分连接到PCB的与天线部分相对的另一侧的PCB。 由于接地部的面积增加，所以电场可以相等地分布在整个接地部分内。

公开(公告)号：US20080148182A1

公开(公告)日：2008-06-19

申请号：US11611969

申请日：2006-12-18

Applicant: Hui Yu Chiang ,  Alen Mujkic ,  Sherryl Lee Lorraine Scott

Inventor： Hui Yu Chiang ,  Alen Mujkic ,  Sherryl Lee Lorraine Scott

IPC: G06F3/048

CPC classification number: H04M1/72583 ,  G06F3/0482 ,  H04M1/72547

Abstract: A menu and application utilizing the menu is provided that provides a sub-list of outcomes associated with a list of options directly in the menu to avoid multiple sub-menus and/or navigation through multiple screens. The menu is particularly beneficial with mobile devices where screen area is at a premium and navigation through multiple screens can be confusing. The outcomes may be folders in which an application stored on the mobile device can be moved, and/or a list of applications that can be unhidden. When moving an application into a folder, a moving mode feature is preferably initiated that enables the user to move the application within the selected folder without having to choose such an option.

Abstract translation: 提供利用菜单的菜单和应用程序，其提供与菜单中的选项列表相关联的结果的子列表，以避免多个子菜单和/或通过多个屏幕的导航。 该菜单对于屏幕区域非常有优势的移动设备是特别有益的，并且通过多个屏幕的导航可能令人困惑。 结果可以是可以移动存储在移动设备上的应用的文件夹，和/或可以被取消隐藏的应用的列表。 当将应用移动到文件夹中时，优选地启动移动模式特征，其使得用户能够在所选择的文件夹内移动应用，而不必选择这样的选项。

公开(公告)号：US20080142939A1

公开(公告)日：2008-06-19

申请号：US11609944

申请日：2006-12-13

Applicant: Wen-Kun Yang ,  Chun-Hui Yu ,  Chih-Wei Lin

Inventor： Wen-Kun Yang ,  Chun-Hui Yu ,  Chih-Wei Lin

IPC: H01L23/12 ,  H01L21/58

CPC classification number: H01L24/96 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L2221/68318 ,  H01L2221/68368 ,  H01L2224/29014 ,  H01L2224/2919 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01094 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00

Abstract: The present invention discloses a tool structure for chip redistribution and method of chip redistribution. The tool structure comprises a base substrate, a separable adhesion film formed on the base substrate, and the patterned glues placed on the separable adhesion film for fixating the dice covered by the core paste materials formed on a fixed substrate. The fixed substrate is bonding on the core paste materials and dice to form the panel wafer. The method comprises printing the pluralities of patterned glues placed on the separable adhesion film and the bonding pluralities of dice covered by the core paste materials, and then, the fixed substrate is bonding on the core paste materials and pluralities of dice. The method further comprises curing and separating the glues and the pluralities of dice with the fixed substrate, and then cleaning the residual glues on the panel wafer (pluralities of dice).

Abstract translation: 本发明公开了一种用于芯片再分配的工具结构和芯片再分配方法。 工具结构包括基底基底，形成在基底基底上的可分离粘合膜，以及放置在可分离粘合膜上的图案化胶，用于固定由形成在固定基底上的芯糊材料覆盖的骰子。 固定基板粘合在芯糊材料和芯片上以形成面板晶片。 该方法包括印刷放置在可分离粘合膜上的多个图案化胶和由芯糊材料覆盖的多个骰子的接合，然后固定的基底粘合在芯糊材料和多个骰子上。 该方法还包括用固定基板固化和分离胶水和多个骰子，然后清洁面板晶片上的残留胶（多个骰子）。

公开(公告)号：US20080029877A1

公开(公告)日：2008-02-07

申请号：US11869154

申请日：2007-10-09

Applicant: Wen-Kun Yang ,  Chun Hui Yu ,  Jui-Hsien Chang ,  Hsien-Wen Hsu

Inventor： Wen-Kun Yang ,  Chun Hui Yu ,  Jui-Hsien Chang ,  Hsien-Wen Hsu

IPC: H01L23/48

CPC classification number: H01L23/562 ,  H01L21/78 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00

Abstract: The present invention provides a semiconductor device package singulation method. The method comprises printing a photo epoxy layer on the back surface of a substrate of a wafer for marking the scribe lines to be diced. Then etching is performed through the substrate along the marks in the photo epoxy layer. Dicing the panel into individual package with a typical art designing knife, the step not only avoids the roughness on the edge of each die, but also decrease the cost of singulation process.

Abstract translation: 本发明提供一种半导体器件封装分割方法。 该方法包括在晶片的基板的背面上印刷光环氧树脂层，以标记要切割的划线。 然后沿着光环氧树脂层中的标记通过基板进行蚀刻。 通过典型的美术设计刀将面板切割成单独的包装，该步骤不仅避免了每个模具边缘的粗糙度，而且降低了切割过程的成本。

公开(公告)号：US20070277961A1

公开(公告)日：2007-12-06

申请号：US11730857

申请日：2007-04-04

Applicant: Min-Hui Yu ,  Chi-Feng Lin ,  Chin-Ming Chen

Inventor： Min-Hui Yu ,  Chi-Feng Lin ,  Chin-Ming Chen

IPC: F28D15/00

CPC classification number: F28D15/0283 ,  F28D15/046 ,  F28D2021/0031 ,  F28F1/20 ,  F28F1/30 ,  F28F2275/04 ,  F28F2275/06 ,  F28F2275/12 ,  Y10T29/49353

Abstract: A heat dissipation module includes a heat column and a plurality of heat dissipation fins disposed outside of the heat column and connected with the heat column. The heat column has a column body and a base, and the column body has a top portion and a sidewall ringed with the top portion. The sidewall and the top portion are integrally formed. The base is disposed opposite to the top portion, and the base has an indentation for allowing an end of the sidewall of the column body to insert so as to form a closed space between the base and the column body. The base further has an annular protrusion close to the indentation, and after the end of the sidewall of the column body is inserted into the indentation of the base, the annular protrusion is processed to be filled between the indentation and the sidewall so as to tightly assemble the base and the column body.

Abstract translation: 散热模块包括加热塔和设置在加热塔外部并与热塔连接的多个散热片。 加热塔具有柱体和底座，柱体具有顶部和与顶部相连的侧壁。 侧壁和顶部一体地形成。 基部与顶部相对地设置，并且基部具有用于允许柱体的侧壁的端部插入以在基部和柱体之间形成封闭空间的凹陷。 基部还具有靠近凹槽的环形突起，并且在柱体的侧壁的端部插入基部的凹陷中之后，环形突起被加工成填充在凹陷和侧壁之间以紧紧地 组装底座和柱体。

公开(公告)号：US07279782B2

公开(公告)日：2007-10-09

申请号：US11029929

申请日：2005-01-05

Applicant: Wen-Kun Yang ,  Chin-Chen Yang ,  Wen-Bin Sun ,  Jui-Hsien Chang ,  Chun Hui Yu ,  His-Ying Yuan

Inventor： Wen-Kun Yang ,  Chin-Chen Yang ,  Wen-Bin Sun ,  Jui-Hsien Chang ,  Chun Hui Yu ,  His-Ying Yuan

IPC: H01L23/02

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.

Abstract translation: 封装结构包括放置在印刷电路板上的管芯。 将玻璃基板粘附在粘合膜图案上以在玻璃基板和芯片之间形成气隙区域。 微透镜设置在芯片上。 透镜架固定在印刷电路板上。 玻璃基板可防止微透镜受到颗粒污染。

公开(公告)号：US20070146584A1

公开(公告)日：2007-06-28

申请号：US11595974

申请日：2006-11-13

Applicant: Chih-Yuan Wang ,  Hui-Yu Chang ,  Yi-Te Lee

Inventor： Chih-Yuan Wang ,  Hui-Yu Chang ,  Yi-Te Lee

IPC: G02F1/1335

CPC classification number: G02F1/133514 ,  G02B5/201 ,  G02B5/223 ,  G02F1/133617 ,  G02F2001/133614

Abstract: A color filter device includes a transparent substrate, a phosphor layer, and a color filter layer. The phosphor layer is provided on the transparent substrate to transform incoming light having a short wavelength into white light having a broad range of wavelengths. The color filter layer is provided on the transparent substrate and has multiple filter sections for filtering the white light to generate desired light components of primary colors.

Abstract translation: 滤色器装置包括透明基板，荧光体层和滤色器层。 荧光体层设置在透明基板上以将具有短波长的入射光转换成具有宽波长范围的白光。 滤色器层设置在透明基板上，并且具有多个滤光器部分，用于过滤白光以产生所需原色的原色组分。

公开(公告)号：US20060187929A1

公开(公告)日：2006-08-24

申请号：US11064711

申请日：2005-02-24

Applicant: Jay Moorman ,  Hui Yu

Inventor： Jay Moorman ,  Hui Yu

IPC: H04L12/28

CPC classification number: H04W48/16 ,  H04W24/02 ,  H04W28/18 ,  H04W80/00

Abstract: A channel information detector, a method of detecting channel information and a communications node. In one embodiment, the channel information detector includes (1) an information retriever configured to extract data unit parameters from a plurality of data units progressing through a protocol stack and (2) an information analyzer, coupled to the information retriever, configured to collectively analyze the data unit parameters to deduce channel information therefrom.

Abstract translation: 信道信息检测器，检测信道信息的方法和通信节点。 在一个实施例中，信道信息检测器包括（1）信息检索器，被配置为从通过协议栈进行的多个数据单元提取数据单元参数，以及（2）耦合到信息检索器的信息分析器，被配置为共同分析 数据单元参数从中推导出信道信息。

公开(公告)号：US20060145364A1

公开(公告)日：2006-07-06

申请号：US11026488

申请日：2004-12-30

Applicant: Wen-Kun Yang ,  Chin-Chen Yang ,  Cheng-hsien Chiu ,  Wen-Bin Sun ,  Kuang-Chi Chao ,  His-Ying Yuan ,  Chun-Hui Yu

Inventor： Wen-Kun Yang ,  Chin-Chen Yang ,  Cheng-hsien Chiu ,  Wen-Bin Sun ,  Kuang-Chi Chao ,  His-Ying Yuan ,  Chun-Hui Yu

IPC: H01L23/29

CPC classification number: H01L21/6835 ,  H01L23/5389 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01094 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.

Abstract translation: 公开了一种填充浆料结构和晶片级封装的工艺。 该方法包括填充粘合剂材料以填充多个骰子并覆盖多个骰子。 多个骰子粘附在形成在可移除基底上的共同状态下的粘度的胶图案上。 用粘合剂材料涂覆刚性基材以粘附骰子。 然后，在连接刚性基底之后，多个骰子由特殊的环境离开胶合图案。