Transistor and method of manufacturing the same
    41.
    发明申请
    Transistor and method of manufacturing the same 有权
    晶体管及其制造方法

    公开(公告)号:US20090224238A1

    公开(公告)日:2009-09-10

    申请号:US12289252

    申请日:2008-10-23

    CPC classification number: H01L29/7869

    Abstract: A transistor according to example embodiments may include a channel layer, a source and a drain respectively contacting ends of the channel layer, a gate electrode separated from the channel layer, a gate insulating layer interposed between the channel layer and the gate electrode, and/or an insertion layer that is formed between the channel layer and the gate insulating layer. The insertion layer may have a work function different from that of the channel layer.

    Abstract translation: 根据示例实施例的晶体管可以包括沟道层,分别接触沟道层的端部的源极和漏极,与沟道层分离的栅电极,介于沟道层和栅电极之间的栅极绝缘层和/ 或形成在沟道层和栅极绝缘层之间的插入层。 插入层可以具有与沟道层不同的功函数。

    Thin film transistor and method of manufacturing the same
    43.
    发明申请
    Thin film transistor and method of manufacturing the same 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US20080203387A1

    公开(公告)日:2008-08-28

    申请号:US12007038

    申请日:2008-01-04

    CPC classification number: H01L29/7869

    Abstract: Provided are a thin film transistor and a method of manufacturing the same. The thin film transistor may include a gate; a channel layer; a source and a drain, the source and the drain being formed of metal; and a metal oxide layer, the metal oxide layer being formed between the channel layer and the source and the drain. The metal oxide layer may have a gradually changing metal content between the channel layer and the source and the drain.

    Abstract translation: 提供一种薄膜晶体管及其制造方法。 薄膜晶体管可以包括栅极; 一个通道层; 源极和漏极,源极和漏极由金属形成; 和金属氧化物层,金属氧化物层形成在沟道层与源极和漏极之间。 金属氧化物层可以在沟道层和源极和漏极之间具有逐渐变化的金属含量。

    Method of forming nano-sized MTJ cell without contact hole
    44.
    发明授权
    Method of forming nano-sized MTJ cell without contact hole 有权
    形成无接触孔的纳米尺寸MTJ电池的方法

    公开(公告)号:US07397099B2

    公开(公告)日:2008-07-08

    申请号:US11710475

    申请日:2007-02-26

    CPC classification number: H01L43/12 G11C11/16

    Abstract: Provided is a method of manufacturing a nano-sized MTJ cell in which a contact in the MTJ cell is formed without forming a contact hole. The method of forming the MTJ cell includes forming an MTJ layer on a substrate, forming an MTJ cell region by patterning the MTJ layer, sequentially depositing an insulating layer and a mask layer on the MTJ layer, exposing an upper surface of the MTJ cell region by etching the mask layer and the insulating layer at the same etching rate, and depositing a metal layer on the insulating layer and the MTJ layer.

    Abstract translation: 提供一种制造其中形成MTJ电池中的接触而不形成接触孔的纳米尺寸的MTJ电池的方法。 形成MTJ单元的方法包括在基板上形成MTJ层,通过图案化MTJ层形成MTJ单元区域,在MTJ层上依次沉积绝缘层和掩模层,暴露MTJ单元区域的上表面 通过以相同的蚀刻速率蚀刻掩模层和绝缘层,并在绝缘层和MTJ层上沉积金属层。

    ZnO thin film transistor and method of forming the same
    47.
    发明申请
    ZnO thin film transistor and method of forming the same 审中-公开
    ZnO薄膜晶体管及其形成方法

    公开(公告)号:US20070272922A1

    公开(公告)日:2007-11-29

    申请号:US11702222

    申请日:2007-02-05

    CPC classification number: H01L29/7869 H01L29/4908 H01L29/78606

    Abstract: A zinc oxide (ZnO) thin film transistor (TFT) and method of forming the same are provided. The ZnO may include a ZnO semiconductor channel, a conductive ZnO gate forming an electric field around the ZnO semiconductor channel, an ZnO gate insulator interposed between the conductive ZnO gate and the ZnO semiconductor channel and an insulating ZnO passivation layer on the ZnO semiconductor channel, the conductive ZnO gate and the ZnO gate insulator to protect the ZnO semiconductor channel, the conductive ZnO gate, and the ZnO gate insulator. A thin film transistor (TFT) may be formed by forming a semiconductor channel, forming a conductive gate having an electric field around the semiconductor channel, forming a gate insulator between the conductive gate and the semiconductor channel, and forming an insulating passivation layer on the semiconductor channel, the conductive gate and the gate insulator.

    Abstract translation: 提供了一种氧化锌(ZnO)薄膜晶体管(TFT)及其形成方法。 ZnO可以包括ZnO半导体沟道,在ZnO半导体沟道周围形成电场的导电ZnO栅极,介于导电ZnO栅极和ZnO半导体沟道之间的ZnO栅极绝缘体和ZnO半导体沟道上的绝缘ZnO钝化层, 导电ZnO栅极和ZnO栅极绝缘体,以保护ZnO半导体通道,导电ZnO栅极和ZnO栅极绝缘体。 可以通过形成半导体沟道来形成薄膜晶体管(TFT),在半导体沟道周围形成具有电场的导电栅极,在导电栅极和半导体沟道之间形成栅极绝缘体,并在其上形成绝缘钝化层 半导体通道,导电栅极和栅极绝缘体。

    Photomask and method thereof
    49.
    发明申请
    Photomask and method thereof 审中-公开
    光掩模及其方法

    公开(公告)号:US20060257753A1

    公开(公告)日:2006-11-16

    申请号:US11356258

    申请日:2006-02-17

    CPC classification number: G21K1/062 B82Y10/00 B82Y40/00 G03F1/24 G21K2201/067

    Abstract: A photomask and method thereof. In an example method, a photomask may be manufactured by forming an oxide layer on a surface, patterning the oxide layer to form an oxide pattern, the oxide pattern including a plurality of oxide pattern bodies and a plurality of oxide windows, filling the plurality of oxide windows with an absorbent to form an absorbent pattern and reducing the plurality of oxide pattern bodies. An example photomask may include an oxide pattern-based absorbent pattern including a plurality of absorbent pattern bodies and a plurality of absorbent pattern windows.

    Abstract translation: 光掩模及其方法。 在一个示例性方法中,可以通过在表面上形成氧化物层来形成光掩模,图案化氧化物层以形成氧化物图案,氧化物图案包括多个氧化物图案体和多个氧化物窗口, 具有吸收剂的氧化物窗口以形成吸收图案并且还原多个氧化物图案体。 示例性光掩模可以包括基于氧化物图案的吸收图案,其包括多个吸收图案体和多个吸收图案窗。

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