中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

141 records (took 0.026 seconds)

    BATTERY MODULE HAVING EXCELLENT HEAT DISSIPATION ABILITY AND BATTERY PACK EMPLOYED WITH THE SAME
    41.
    发明申请
    BATTERY MODULE HAVING EXCELLENT HEAT DISSIPATION ABILITY AND BATTERY PACK EMPLOYED WITH THE SAME 有权
    具有优异散热能力的电池模块和与其同时使用的电池组

    公开(公告)号：US20110223457A1

    公开(公告)日：2011-09-15

    申请号：US12672160

    申请日：2009-09-04

    Applicant: Jin Kyu Lee ,  Hee Soo Yoon ,  Bumhyun Lee ,  Dal Mo Kang ,  Jongmoon Yoon

    Inventor： Jin Kyu Lee ,  Hee Soo Yoon ,  Bumhyun Lee ,  Dal Mo Kang ,  Jongmoon Yoon

    IPC: H01M10/50 ,  H01M2/10

    CPC classification number: H01M2/1077 ,  H01M10/0585 ,  H01M10/613 ,  H01M10/617 ,  H01M10/625 ,  H01M10/647 ,  H01M10/6551 ,  H01M10/6555 ,  H01M10/6556 ,  H01M10/6567

    Abstract: Disclosed herein is a battery module constructed in a structure in which a plurality of plate-shaped battery cells are sequentially stacked in a module case, wherein each of the plate-shaped battery cells includes an electrode assembly of a cathode/separator/anode structure mounted in a battery case formed of a laminate sheet including a resin layer and a metal layer, a plurality of heat dissipation members are disposed at two or more interfaces between the battery cells, and a heat exchange member integrally interconnecting the heat dissipation members is mounted to one side of a stack of the battery cells, whereby heat generated from the battery cells during the charge and discharge of the battery cells is removed by the heat exchange member.

    Abstract translation: 这里公开了一种电池模块，其结构是将多个板状电池单元依次层叠在模块壳体中，其中，每个板状电池单元包括安装有阴极/隔板/阳极结构的电极组件 在由包括树脂层和金属层的层压片形成的电池壳体中，多个散热构件设置在电池单元之间的两个或更多个界面处，并且将散热构件一体地互连的热交换构件安装到 电池单元的堆叠的一侧，由此通过热交换构件去除在电池单元的充电和放电期间从电池单元产生的热量。

    SILICA-BASED FLUORESCENT NANOPARTICLES
    48.
    发明申请
    SILICA-BASED FLUORESCENT NANOPARTICLES 审中-公开
    二氧化硅荧光纳米粒子

    公开(公告)号：US20100047859A1

    公开(公告)日：2010-02-25

    申请号：US12196808

    申请日：2008-08-22

    Applicant: Jin-Kyu Lee

    Inventor： Jin-Kyu Lee

    IPC: G01N1/30 ,  C08L83/00 ,  C07D311/80 ,  C07D311/78 ,  C07D311/04 ,  G01N21/75

    CPC classification number: C07D311/82 ,  B82Y30/00 ,  C09B11/28 ,  C09B13/06 ,  G01N1/30

    Abstract: A composition including the reaction product of: an organic silane of Formula SiR1mX14-m; a fluorescent dye-silane compound of Formula D-L′-(CH2)n—SiX23; water; and a hydrolysis catalyst; where R1 is a C1-C6 alkyl that is unsubstituted or substituted with one or more halogens or hydroxyl group, C2-C6 alkenyl that is unsubstituted or substituted with one or more halogens or hydroxyl group, or an aryl group that is unsubstituted or substituted with one or more halogens or hydroxyl group, m is 0 or 1; n is 3, 4, 5, 6, 7, 8, 9, 10, 11, or 12, D is a radical having a fluorophore; L1 is a bond, O, S, C(O)O, C(O)NR2, SO2O, C(O)S, C(S), or S2; R2 is hydrogen, a C1-C12 alkyl that is unsubstituted or is substituted with hydroxyl; each X1 and X2 are independently a hydrolyzable substituent; and the reaction product is a silica-based fluorescent nanoparticle.

    Abstract translation: 一种组合物，包括以下反应产物：式SiR1mX14-m的有机硅烷; 式D-L' - （CH 2）n -Si X 23的荧光染料 - 硅烷化合物; 水; 和水解催化剂; 其中R 1是未被取代或被一个或多个卤素或羟基取代的C 1 -C 6烷基，未被取代或被一个或多个卤素或羟基取代的C 2 -C 6烯基或未被取代或被 一个或多个卤素或羟基，m为0或1; n为3,4,5,6,7,8,9,10,11或12，D为具有荧光团的基团; L是键，O，S，C（O）O，C（O）NR 2，SO 2 O，C（O）S，C（S）或S 2; R2是氢，未被取代或被羟基取代的C1-C12烷基; 每个X1和X2独立地是可水解取代基; 反应产物是二氧化硅基荧光纳米颗粒。

    Ultra-Low Dielectrics Film for Copper Interconnect
    50.
    发明申请
    Ultra-Low Dielectrics Film for Copper Interconnect 审中-公开
    用于铜互连的超低介电膜

    公开(公告)号：US20080287573A1

    公开(公告)日：2008-11-20

    申请号：US10581165

    申请日：2004-05-12

    Applicant: Hee-Woo Rhee ,  Do Young Yoon ,  Kook Heon Char ,  Jin-Kyu Lee ,  Bongjin Moon ,  Sung-Kyu Min ,  Se Jung Park ,  Jae-Jin Shin

    Inventor： Hee-Woo Rhee ,  Do Young Yoon ,  Kook Heon Char ,  Jin-Kyu Lee ,  Bongjin Moon ,  Sung-Kyu Min ,  Se Jung Park ,  Jae-Jin Shin

    IPC: C08K5/1545

    CPC classification number: H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/31695 ,  H01L21/7682 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    Abstract: The present invention relates to an ultra-low dielectric film for a copper interconnect, in particular, to an porous film prepared in such a manner that coating with an organic solution containing a polyalkyl silsesquioxane precursor or its copolymer as a matrix and acetylcyclodextrin nanoparticles as a template and then performing a sol-gel reaction and heat treatment at higher temperature. The present films may contain the template of up to 60 vol %, due to the use of acetylcyclodextrin, and have homogeneously distributed pores with the size of no more than 5 nm in the matrix. In addition, the present films exhibit a relatively low dielectric constant of about 1.5, and excellent interconnectivity between pores, so that they are considered a promising ultra-low dielectric film for a copper interconnect.

    Abstract translation: 本发明涉及一种用于铜互连的超低电介质膜，特别涉及一种多孔膜，其制备方法是用含有聚烷基倍半硅氧烷前体或其共聚物作为基质的有机溶液和乙酰基环糊精纳米颗粒作为 模板，然后进行溶胶 - 凝胶反应并在较高温度下进行热处理。 由于使用乙酰基环糊精，本发明的膜可以含有高达60体积％的模板，并且在基质中具有不超过5nm的尺寸的均匀分布的孔。 此外，本发明的膜具有约1.5的相对低的介电常数和孔之间的优异的互连性，因此它们被认为是用于铜互连的有希望的超低介电膜。

Patent Agency Ranking