公开(公告)号：US20130249071A1

公开(公告)日：2013-09-26

申请号：US13854140

申请日：2013-04-01

申请人： Jinzhong Yao ,  Zhigang Bai ,  Yuan Zang

发明人： Jinzhong Yao ,  Zhigang Bai ,  Yuan Zang

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/495 ,  B29C33/005 ,  B29C45/14221 ,  B29C45/14655 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/565 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of assembling a semiconductor device includes providing a lead frame having a die pad and a fame member with lead fingers that surround the die pad. The lead fingers have distal ends connected to the frame member and proximal ends near the die pad. A die is attached to the die pad and die connection pads are electrically connected to the proximal ends of the lead fingers with bond wires. The die, bond wires, and part of the lead fingers are encapsulated with an encapsulant. The encapsulating process includes separating the lead fingers into first and second sets of lead fingers. The proximal ends of the first set lie in a first plane and the proximal ends of the second set lie in a second plane that is spaced and maintained from the first plane solely by the encapsulation material.

摘要翻译： 一种组装半导体器件的方法包括提供引线框架，该引线框架具有管芯焊盘和引导指围绕管芯焊盘的成形构件。 引线指具有连接到框架构件的远端和靠近管芯焊盘的近端。 模具附接到管芯焊盘，管芯连接焊盘通过接合线电连接到引线指的近端。 管芯，接合线和引线的一部分用密封剂封装。 封装过程包括将引线分离成第一和第二组引线指。 第一组的近端位于第一平面中，并且第二组的近端位于第二平面中，第二平面仅与第一平面间隔开并由包封材料保持。

公开(公告)号：US20130049183A1

公开(公告)日：2013-02-28

申请号：US13549518

申请日：2012-07-16

申请人： Jinzhong YAO ,  Zhigang Bai ,  Xuesong Xu

发明人： Jinzhong YAO ,  Zhigang Bai ,  Xuesong Xu

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L23/49537 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49568 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/13101 ,  H01L2224/1329 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92242 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00012

摘要： A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers.

摘要翻译： 封装功率半导体管芯的方法包括提供双量规引线框架的第一引线框架。 第一引线框架包括厚的芯片焊盘。 磁带附着到厚芯片焊盘的第一侧，并且功率管芯附接到厚芯片焊盘的第二侧。 提供了双量规引线框架的第二引线框架。 第二引线框架具有薄的引线指。 引线指的一端连接到功率管芯的有源表面，使得引线指电连接到功率管芯的焊盘。 然后将模塑料分配到双量规引线框架的顶表面上，使得模制化合物覆盖电源模具和引线指。

公开(公告)号：US20120211846A1

公开(公告)日：2012-08-23

申请号：US13334006

申请日：2011-12-21

申请人： Jun LI ,  Jianhong WANG ,  Xuesong XU ,  Jinzhong YAO ,  Wanming YU

发明人： Jun LI ,  Jianhong WANG ,  Xuesong XU ,  Jinzhong YAO ,  Wanming YU

IPC分类号： H01L29/82 ,  H01L23/552 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of assembling a magnetoresistive random access memory (MRAM) device includes providing a substrate having an opening. A tape is applied to a surface of the substrate and a first magnetic shield is placed onto the tape and within the substrate opening. An adhesive is applied between the first magnetic shield and the substrate to attach the first magnetic shield to the substrate. An MRAM die is attached to the first magnetic shield and bond pads of the MRAM die are connected to pads on the substrate with wires. A second magnetic shield is attached to a top surface of the MRAM die. An encapsulating material is dispensed onto the substrate, the MRAM die, the second magnetic shield and part of the first magnetic shield, cured, and then the tape is removed. Solder balls then may be attached to the substrate.

摘要翻译： 一种组装磁阻随机存取存储器（MRAM）器件的方法包括提供具有开口的衬底。 将带施加到基板的表面，并且第一磁屏蔽被放置在带上和基板开口内。 在第一磁屏蔽和基板之间施加粘合剂以将第一磁屏蔽件附接到基板。 将MRAM管芯连接到第一磁屏蔽，并且MRAM管芯的接合焊盘通过电线连接到衬底上的焊盘。 第二磁屏蔽连接到MRAM管芯的顶表面。 将封装材料分配到基板上，MRAM管芯，第二磁屏蔽件和第一磁屏蔽件的一部分固化，然后去除磁带。 焊球然后可以附着到基板上。

公开(公告)号：US08216886B2

公开(公告)日：2012-07-10

申请号：US13004029

申请日：2011-01-11

申请人： Bin Tian ,  Nan Xu ,  Jinzhong Yao

发明人： Bin Tian ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L21/00

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for assembling a semiconductor package includes a rapid cooling step after post mold curing of an encapsulation material. The rapid cooling step includes blowing chilled, compressed air over the package for about two minutes. The rapid cooling step does not require any clamping pressure be simultaneously applied to the package. The rapid cooling step reduces a temperature of the encapsulation material from a curing temperature to the cooled temperature within a maximum period of less than five minutes. By using rapid cooling, as opposed to cooling the package under a clamping pressure with ambient air, package warpage due to CTE mismatches is prevented.

摘要翻译： 一种组装半导体封装的方法包括在封装材料的后模塑固化之后的快速冷却步骤。 快速冷却步骤包括将冷却的压缩空气吹在包装上约两分钟。 快速冷却步骤不需要同时对包装施加任何夹紧压力。 快速冷却步骤将封装材料的温度从低于5分钟的最长时间内将固化温度降低到冷却温度。 通过使用快速冷却，与在环境空气下的夹紧压力下冷却封装相反，防止由于CTE错配引起的封装翘曲。

公开(公告)号：US20110263077A1

公开(公告)日：2011-10-27

申请号：US13025143

申请日：2011-02-10

申请人： Zhigang BAI ,  Zhijie Wang ,  Jinzhong Yao

发明人： Zhigang BAI ,  Zhijie Wang ,  Jinzhong Yao

IPC分类号： H01L21/50

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

摘要： A method of assembling semiconductor devices for surface mounting includes forming an array of lead frames in which supporting frame structures of adjacent lead frames include an intermediate common bar connecting on both its sides with sets of leads of the respective adjacent lead frames. The semiconductor devices are singulated by sawing through the leads on each side of the common bars without sawing the common bars longitudinally. The material sawn off from the common bars in a first direction is removed by washing it away before sawing off the intermediate common bars that run in an orthogonal direction. The supporting frame structures include bars surrounding the array and singulation includes sawing beside the surrounding bars to saw them off before sawing off the intermediate common bars.

摘要翻译： 组装用于表面安装的半导体器件的方法包括形成引线框架阵列，其中相邻引线框架的支撑框架结构包括在其两侧与相应的相邻引线框架的引线组连接的中间公共杆。 半导体器件通过在公共棒的每一侧上的引线进行锯切而不是纵向地锯切公共棒来切割。 在沿着正交方向移动的中间公共棒之前，通过将其从第一方向上从共同的杆上脱落的材料通过洗涤除去。 支撑框架结构包括围绕阵列的条纹，并且分割包括在周围的条子旁边锯切以在锯切中间公共条之前锯切它们。

公开(公告)号：US07727817B2

公开(公告)日：2010-06-01

申请号：US12403400

申请日：2009-03-13

申请人： Xuesong Xu ,  Nan Xu ,  Jinzhong Yao

发明人： Xuesong Xu ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a method of packaging a semiconductor IC, a tape is attached to a back surface of a lead frame array, and the lead frame array is held between an upper mold chase and a lower mold chase of a mold, with the back surface of the lead frame array upward. The upper and lower mold chases form an upper cavity and a lower cavity with respect to the lead frame array respectively. A mold compound is injected into the upper and lower cavities respectively. With respect to clearances between leads, between die pads and/or between the leads and the die pads, the mold compound injected into the upper cavity covers the portion of the tape over the clearances before the mold compound injected into the lower cavity fills the clearances, so that the tape is depressed. After curing the mold compound, removing the mold and de-taping, the mold compound filled in the clearances is recessed inward from the back surface, which increases the solderability in the subsequent surface mount process and decreases the possibility of the occurrence of lead short-circuits.

摘要翻译： 在封装半导体IC的方法中，将带附接到引线框架阵列的后表面，并且引线框架阵列保持在模具的上模追逐和下模追逐之间，其中 引线框阵列向上。 上下模具分别相对于引线框架阵列形成上腔体和下腔体。 模具化合物分别注入上腔和下穴。 关于引线之间，芯片之间和/或引线和芯片焊盘之间的间隙，注入上腔的模具复合体在注入到下腔内的模具化合物填充间隙之前在间隙上覆盖磁带的部分 ，使得磁带被压下。 在固化模具化合物之后，除去模具和脱胶，填充间隙的模具化合物从后表面向内凹入，这增加了随后的表面贴装工艺中的可焊性，并且降低了引线短路的可能性， 电路。

公开(公告)号：US20080266828A1

公开(公告)日：2008-10-30

申请号：US12053622

申请日：2008-03-24

申请人： Xuesong XU ,  Meijiang Song ,  Jinzhong Yao

发明人： Xuesong XU ,  Meijiang Song ,  Jinzhong Yao

IPC分类号： H05K7/20 ,  H01R43/00

CPC分类号： H01R4/028 ,  H01L23/49503 ,  H01L23/49582 ,  H01L2924/0002 ,  Y10T29/49121 ,  H01L2924/00

摘要： A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A boundary between the regions causes a wetting force difference that inhibits molten solder flow between regions during solder die bonding.

摘要翻译： 引线框架具有在其表面上具有不同润湿特性的多个区域。 例如，形成一个区域来处理镀银，而另一个区域具有较少的润湿能力。 区域之间的边界引起润湿力差，在焊料芯片接合期间阻止区域之间的熔融焊料流动。