Utilization of biocompatible adhesive/sealant materials for securing
surgical devices
    42.
    发明授权
    Utilization of biocompatible adhesive/sealant materials for securing surgical devices 失效
    利用生物相容的粘合剂/密封剂材料来固定外科手术器械

    公开(公告)号:US5550172A

    公开(公告)日:1996-08-27

    申请号:US385015

    申请日:1995-02-07

    CPC classification number: A61L24/046 A61L24/02 A61L24/06

    Abstract: A process for enhancing the security of implantable surgical devices secured to bone tissue comprising implanting in bone tissue a surgical device with a biocompatible adhesive and/or sealant selected from the group consisting of: p1 (a) a material made from monomers of the formula:CHR.sup.1 .dbd.CX.sup.1 Y.sup.1 wherein X.sup.1 and Y.sup.1 are each strong electron withdrawing groups, and R.sup.1 is hydrogen or, provided that X.sup.1 and Y.sup.1 are both cyano groups, a C.sub.1 -C.sub.4 alkyl group;(b) a semi-crystalline aliphatic poly(ester) of the formula:[--0--R.sup.11 --C(0)--].sub.y, wherein R.sup.11 is selected from the group consisting of --CR.sup.12 H--, --(CH.sub.2).sub.3 --0--, --CH.sub.2 --CH.sub.2 --O--CH.sub.2 --, CR.sub.12 H--CH.sub.2, --(CH.sub.2).sub.4 --, --(CH.sub.2).sub.z --O--C(O)-- and --(CH.sub.2).sub.z --C(O)--CH.sub.2 --; R.sup.12 is hydrogen or methyl; z is an integer in the range of from 1 to 7 and y is an integer in the range of from about 10 to about 20,000; and(c) a slurry of water and a calcium containing compounds with the general formula:M.sup.2+.sub.10-n N.sup.1+.sub.2n (WO.sub.4.sup.3-).sub.6 mU.sup.2- where n is an integer from 1 to 10, and m is 2 when x is 1, or m is 1 when x is 2, M and N are alkali or alkaline earth metals; WO.sub.4 is an acid radical and w is phosphorus, vanadium, sulfur, silicon, or is substituted in whole or part with carbonate (CO.sub.3.sup.2-); and U is a halide, hydroxide, or carbonate; provided in an amount effective to increase the amount of force necessary to remove the implanted surgical device. Additionally provided is a surgical device that is at least partially coated with at least one biocompatible adhesive and/or sealant.

    Abstract translation: 一种用于增强固定到骨组织的可植入手术装置的安全性的方法,包括在骨组织中植入具有选自以下的生物相容性粘合剂和/或密封剂的手术装置:p1(a)由下式的单体制成的材料: CHR1 = CX1Y1,其中X1和Y1各自是强吸电子基团,R1是氢,或者X1和Y1都是氰基,C1-C4烷基; (b)下式的半结晶脂族聚(酯):[-0-R11-C(O) - ] y,其中R11选自-CR12H - , - (CH2)3-0 - , - CH 2 - (CH 2)4 - , - (CH 2)z OC(O) - 和 - (CH 2)z C(O) R 12是氢或甲基; z是1至7的整数,y是约10至约20,000的整数; 和(c)水和含钙化合物的浆料,通式为:M2 + 10-nN1 + 2n(WO43-)6mU2-其中n为1至10的整数,当x为1时,m为2, 或当x为2时m为1,M和N为碱金属或碱土金属; WO4是酸基,w是磷,钒,硫,硅,或全部或部分被碳酸酯(CO32-)取代; U是卤化物,氢氧化物或碳酸盐; 提供有效量以增加去除植入的手术装置所需的力的量。 另外提供了至少部分地涂覆有至少一种生物相容性粘合剂和/或密封剂的手术装置。

    Drug-enhanced adhesion prevention
    46.
    发明授权
    Drug-enhanced adhesion prevention 有权
    药物增强粘附防止

    公开(公告)号:US08394399B2

    公开(公告)日:2013-03-12

    申请号:US12021546

    申请日:2008-01-29

    CPC classification number: A61K9/1647

    Abstract: The present invention includes methods for the inhibition of post-operative adhesion formation between tissue surfaces in a body cavity having been subjected to a surgical procedure, which methods involve administering Pemirolast, or an analog thereof, directly to tissue surfaces in the body cavity in amounts and under conditions effective to inhibit formation of adhesions, and to delivery vehicles and compositions suitable for use for local, non-systemic administration of a drug to the body and directly to tissue within a body cavity having been subjected to a surgical procedure.

    Abstract translation: 本发明包括用于抑制经受外科手术的体腔中的组织表面之间的术后粘连形成的方法,该方法包括将Pemirolast或其类似物以体积的数量直接施用于体腔内的组织表面 并且在有效抑制粘连形成的条件下,以及适用于局部,非全身给药的体内和直接经受外科手术的体腔内组织的输送载体和组合物。

    FABRICATION OF SELF-ASSEMBLED NANOWIRE-TYPE INTERCONNECTS ON A SEMICONDUCTOR DEVICE
    50.
    发明申请
    FABRICATION OF SELF-ASSEMBLED NANOWIRE-TYPE INTERCONNECTS ON A SEMICONDUCTOR DEVICE 审中-公开
    半导体器件上自组装纳米型互连的制作

    公开(公告)号:US20120133031A1

    公开(公告)日:2012-05-31

    申请号:US13308182

    申请日:2011-11-30

    CPC classification number: H01L21/76895 H01L21/2885 H01L2221/1094

    Abstract: Consistent with an example embodiment, there is a semiconductor device with nanowire-type interconnect elements.The semiconductor device comprises a semiconductor substrate with a pn junction formed by a first doped substrate region of a first conductivity type, and a second doped substrate region of an opposite second conductivity type. There is a layer structure on the semiconductor substrate, the layer structure includes a first metal structure which is conductively connected with the first doped substrate region, and further comprising a second metal structure, which is conductively connected with the second doped substrate region. The layer structure allows the transmission of photons with an energy suitable for creating free charge carriers in the first and second doped substrate regions. A third metal structure comprising at least one self-assembled metal dendrite forms an interconnect element between the first and second metal structures.

    Abstract translation: 与示例实施例一致,存在具有纳米线型互连元件的半导体器件。 半导体器件包括具有由第一导电类型的第一掺杂衬底区域形成的pn结的半导体衬底和具有相反的第二导电类型的第二掺杂衬底区域。 在半导体衬底上存在层结构,层结构包括与第一掺杂衬底区域导电连接的第一金属结构,并且还包括与第二掺杂衬底区域导电连接的第二金属结构。 层结构允许以适于在第一和第二掺杂衬底区域中产生自由电荷载流子的能量传输光子。 包括至少一个自组装金属枝晶的第三金属结构在第一和第二金属结构之间形成互连元件。

Patent Agency Ranking