Abstract:
In a semiconductor memory device having a memory cell array and sense amplifiers connected by bit lines, a conductive shield plate is arranged over the bit lines and between the memory cell array and the sense amplifiers.
Abstract:
A dynamic random access memory device includes a storage capacitor having a plurality of stacked conductive films which form a storage electrode. A gap is formed between elevationally adjacent conductive films so as to surround the storage electrode. A gap is also formed between an insulating film which covers a gate electrode for insulation and a lowermost film of the storage electrode. Connection between the adjacent films may be established so that an uppermost film elevationally extends so as to make contact with a drain region. Also, connection can be established so that an upper film is mounted directly on an lower film. An end portion of the film may be thicker than the other portion thereof. The stacked film structure may be produced by alternatively forming a film made of a material different from the insulating film covering the gate electrode, and a conductive film.
Abstract:
A semiconductor integrated circuit includes a switch unit for controlling the supply of a power source voltage to a signal amplification circuit for receiving an input signal, and a control unit for selectively turning ON and OFF the switch unit in accordance with the amplitude or frequency of this input signal. By the constitution, it is possible to provide an input circuit or an output circuit capable of being applied to an input/output interface adapted for a small amplitude operation.
Abstract:
A dynamic random access memory includes a capacitor in at least one memory cell each for storing one bit digital data as a terminal voltage, at least one bit line corresponding to at least one memory cell, a gate provided for each of the capacitors in the memory cells and which controls an electrical connection/disconnection between a terminal of the capacitor in the memory cell which stores the terminal voltage and the bit line corresponding to the memory cell, and at least one data bus line provided for at least one bit line. A current is continuously supplied to each of at least one of the data bus lines from a predetermined source through a predetermined resistor, and a reading voltage output unit provided for each of the bit lines, connects a current input terminal thereof with a data bus corresponding to the bit line, and changes a voltage of the data bus according to the voltage change on the bit line.
Abstract:
A food sterilizing apparatus has a simple configuration and can completely and efficiently sterilize food. The food sterilizing apparatus is designed to sterilize food contained in rigid food containers and comprises a food supplying section, a linear cylindrical heater, a linear cylindrical cooler and a discharge section, each having inlet and outlet ports arranged respectively at the upstream and downstream ends thereof, any two adjacent ones of said component sections being connected in parallel or rectangularly with each other at the respective outlet and inlet ports thereof with a sealing gate interposed therebetween, said component sections being further provided with respective pushers disposed at the upstream end thereof for moving rigid food containers downstream, each of said pushers having a stroke at least equal to the width of a rigid container.
Abstract:
A signal amplifier circuit suitable for a semiconductor memory device includes a first current mirror circuit for outputting a first current to a first signal line and for outputting a second mirror current, and a second current mirror circuit for outputting a third current to a second signal line and for outputting a fourth mirror current. The first and second signal line form a pair of complementary signal lines. The amplifier circuit also includes a third current mirror circuit for receiving the second and fourth mirror currents and for outputting an output signal based on a potential difference between the first and second data signal lines.
Abstract:
A semiconductor integrated circuit comprises a chip, an oscillator provided on the for producing an alternate current with a controlled amplitude that is determined by the drive voltage, a rectifier provided on the chip for receiving and converting the alternate current into a direct current, a voltage detector provided on the chip for detecting a voltage level of the direct current, and a controller provided on the chip and supplied with the detection signal from the voltage detector for controlling the oscillator such that the amplitude of the alternate current is changed in response to the detection signal. The controller increases the amplitude of the alternate current when the voltage level of the direct current has decreased below a predetermined level and decreases the amplitude of the alternate current when the voltage level of the direct current has increased above the predetermined level.
Abstract:
An on-chip voltage regulator controls a gate of a regulator transistor having a first terminal connectable to receive an external power supply voltage and a second terminal connectable to an internal circuit formed on a chip on which the on-chip voltage regulator is formed. The regulator includes a clock receiving part for receiving a predetermined clock signal related to an operation of the internal circuit, and a regulator part for generating a gate voltage output to the gate of the regulator transistor on the basis of a state of the predetermined clock signal so that the regulator transistor can generate a substantially fixed internal voltage from the external power supply voltage irrespective of whether or not the internal circuit is operating.
Abstract:
Connecting a superconductive material wiring layer to an electrode formed of normal metals (i.e. non-superconductive metals, such as aluminum), and connecting a part of a semiconductor region to the normal metal. The normal metal can contact the superconductive wiring layer via a barrier metal, such as TiN, at least at a side wall of the superconductive wiring layer which is essentially orthogonal to the layer wiring. Accordingly, even when the wiring layer is anisotropically superconductive mainly in a direction parallel to the plane of deposition, the superconductive property can be fully realized. The inventive structure prevents copper atoms in the superconductive material and silicon atoms in the semiconductor region of the IC from producing an undesirable alloy. This improves reliability of the IC operation, i.e. the semiconductor material as well as the superconductive material is not deteriorated.
Abstract:
A comparator circuit comprises a differential amplifier supplied with a reference signal and an input signal. A resonant-tunneling transistor has a base supplied with an output signal of the differential amplifier. A collector is connected to a first power supply source via a resistor. An emitter is connected to a second power supply source. Therefore, it is possible to simplify a circuit configuration of the comparator circuit and to improve an operation speed of the comparator circuit by outputting an output signal from a connection portion between the resistor and the collector of the transistor.