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    Digital camera module with small sized image sensor chip package
    41.
    发明申请
    Digital camera module with small sized image sensor chip package 有权
    数码相机模块具有小尺寸图像传感器芯片封装

    公开(公告)号：US20060290802A1

    公开(公告)日：2006-12-28

    申请号：US11402467

    申请日：2006-04-12

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Po-Chih Hsu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Po-Chih Hsu ,  Kun-Hsieh Liu

    IPC: H04N5/225

    CPC classification number: H04N5/2253 ,  H04N5/2254

    Abstract: A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.

    Abstract translation: 数码相机模块（200）包括透镜保持器（20），容纳在透镜保持器中的透镜模块（30）和安装到透镜保持器的图像传感器芯片封装（40）。 透镜模块包括可移动地接合在透镜保持器中的透镜镜筒（301）和容纳在镜筒中的至少一个透镜（302）。 图像传感器芯片封装包括基座（401），安装在基座上的图像传感器芯片（402），透明盖（405）和相对于图像传感器芯片定位透明盖的粘合剂（50）。 粘合剂和透明盖协同地将图像传感器芯片密封在其中。

    Spreadsheet-based user interface creation
    43.
    发明授权
    Spreadsheet-based user interface creation 有权
    基于电子表格的用户界面创建

    公开(公告)号：US07107519B1

    公开(公告)日：2006-09-12

    申请号：US09932119

    申请日：2001-08-16

    Applicant: Steven Webster ,  Robb Robles ,  E. John McGarry ,  Russ Weinzimmer

    Inventor： Steven Webster ,  Robb Robles ,  E. John McGarry ,  Russ Weinzimmer

    IPC: G06F17/00

    CPC classification number: G06F17/246

    Abstract: A method is disclosed for creating a user interface for a spreadsheet-based software application. The method includes providing a spreadsheet having a plurality of standard cells displayable as standard spreadsheet cells, and a plurality of user interface cells displayable only as a window superimposed upon the standard spreadsheet cells; and providing at least one control function adapted to create the window superimposed upon the standard spreadsheet cells. Also disclosed is a user interface for a spreadsheet-based software application that includes a spreadsheet having a plurality of standard cells displayable as standard spreadsheet cells; and at least one custom view control function adapted to create a window superimposed upon the standard spreadsheet cells, the window displaying a subset of the standard cells. This invention substantially simplifies the task of programming a user interface using a spreadsheet environment. All standard spreadsheet functionality is available for use in the user interface creation process.

    Abstract translation: 公开了一种用于创建用于基于电子表格的软件应用程序的用户界面的方法。 该方法包括提供具有可标准电子表格单元可显示的多个标准单元的电子表格，以及仅可叠加在标准电子表格单元上的窗口可显示的多个用户界面单元; 以及提供适于创建叠加在标准电子表格单元上的窗口的至少一个控制功能。 还公开了一种用于基于电子表格的软件应用程序的用户界面，其包括具有可作为标准电子表格单元格显示的多个标准单元的电子表格; 以及适于创建叠加在标准电子表格单元上的窗口的至少一个定制视图控制功能，该窗口显示标准单元的子集。 本发明基本上简化了使用电子表格环境编程用户界面的任务。 所有标准电子表格功能都可用于用户界面创建过程。

    Digital still camera module
    44.
    发明申请
    Digital still camera module 有权
    数码相机模组

    公开(公告)号：US20060093352A1

    公开(公告)日：2006-05-04

    申请号：US11262592

    申请日：2005-10-31

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

    IPC: G03B17/00

    CPC classification number: H04N5/2254 ,  G02B7/025 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H04N5/2253 ,  H01L2924/00014

    Abstract: A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.

    Abstract translation: 数字静态照相机模块包括安装在图像传感器封装上的图像传感器封装（2）和透镜镜筒（30）。 图像传感器封装包括基板（20），图像传感器芯片（22）和盖子（28）。 衬底在其中限定接收室（203）。 图像传感器芯片安装在基板的接收室中。 透明并且具有比基板更小的轮廓的盖被固定到基板的顶部，从而密封接收室。 衬底的顶部在盖的周边具有未覆盖部分（29）。 镜筒包括容纳在其中的至少一个透镜（31）。 透镜筒牢固地附接到基板的顶部的未覆盖部分。

    Tool and method for forming an integrated optical circuit
    48.
    发明授权
    Tool and method for forming an integrated optical circuit 有权
    用于形成集成光电路的工具和方法

    公开(公告)号：US06875379B2

    公开(公告)日：2005-04-05

    申请号：US09751537

    申请日：2000-12-29

    Applicant: Thomas P. Glenn ,  Steven Webster

    Inventor： Thomas P. Glenn ,  Steven Webster

    IPC: B29C33/38 ,  B29C33/42 ,  B29C33/56 ,  B29C43/36 ,  B29C43/46 ,  B29C45/00 ,  B29C59/14 ,  B29D11/00

    CPC classification number: B29C43/36 ,  B29C33/3842 ,  B29C33/42 ,  B29C33/565 ,  B29C43/46 ,  B29C45/00 ,  B29C59/14 ,  B29C2043/463

    Abstract: Tools and methods for making molded an optical integrated circuit including one or more waveguides are disclosed. In one embodiment, a molding die is provided that includes a substrate that has a topographically patterned first surface. A conformal protective film is provided over the first surface of the substrate. The substrate may be formed of silicon or gallium arsenide, and may be patterned using conventional semiconductor patterning techniques, such as plasma etching. The protective film may be metal (e.g., nickel or titanium), diamond, or some other hard material. Typically, a plurality of such molding dies are formed from a wafer of the substrate material. The die is pressed into a moldable material, such as thermal plastic, to form the wave guide(s) of the optical integrated circuit. A plurality of the dies may be mounted around the curved surface of a heated roller, and a heated tape of the waveguide material may be fed under the roller in a mass production process. Alternatively, the die may be mounted in an injection molding cavity, and the IOC may be formed by an injection molding process.

    Abstract translation: 公开了用于制造包括一个或多个波导的光学集成电路的工具和方法。 在一个实施例中，提供了一种模制模具，其包括具有地形图案化的第一表面的基底。 在衬底的第一表面上提供保形膜。 衬底可以由硅或砷化镓形成，并且可以使用常规的半导体图案化技术（诸如等离子体蚀刻）进行图案化。 保护膜可以是金属（例如镍或钛），金刚石或其它一些硬质材料。 通常，由基板材料的晶片形成多个这样的模具。 模具被压入诸如热塑性的可模制材料中，以形成光学集成电路的波导。 多个模具可以安装在加热辊的弯曲表面周围，并且波导材料的加热带可以在批量生产过程中在辊下进给。 或者，模具可以安装在注射模制腔中，并且IOC可以通过注射成型工艺形成。

    Flip chip on glass sensor package
    49.
    发明授权
    Flip chip on glass sensor package 有权
    翻转芯片在玻璃传感器封装

    公开(公告)号：US06849916B1

    公开(公告)日：2005-02-01

    申请号：US09713848

    申请日：2000-11-15

    Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

    Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

    IPC: H01L23/02 ,  H01L27/146 ,  H01L31/00 ,  H01L31/0203 ,  H04N5/225

    CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N5/2253 ,  H01L2924/00

    Abstract: An image sensor package includes an image sensor having an active area and bond pads on a front surface of the image sensor. A window is mounted to the image sensor by flip chip bumps formed between the bond pads of the image sensor and interior traces on an interior surface of the window. The window has an area less than an area of the front surface of the image sensor. A bead is formed between the window and the front surface of the image sensor thus forming a sealed cavity in which the active area is located. The bead has sides coplanar with sides of the image sensor such that the image sensor package is chip size.

    Abstract translation: 图像传感器封装包括具有有源区域的图像传感器和图像传感器前表面上的接合焊盘。 通过在图像传感器的接合焊盘和窗口的内表面上的内部迹线之间形成的倒装芯片凸块将窗口安装到图像传感器。 窗口的面积小于图像传感器前表面的面积。 在窗口和图像传感器的前表面之间形成珠，从而形成有效区域所在的密封空腔。 珠粒具有与图像传感器的侧面共面的侧面，使得图像传感器封装是芯片尺寸。

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