公开(公告)号：US20070065308A1

公开(公告)日：2007-03-22

申请号：US10566580

申请日：2004-07-21

申请人： Mitsuru Yamamoto ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Sakae Kitajo

发明人： Mitsuru Yamamoto ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Sakae Kitajo

IPC分类号： F04B17/00

CPC分类号： F04B43/02 ,  F04B43/046

摘要： A diaphragm pump enabling an increase in pump efficiency by reducing the pressure loss of liquid and reduction in thickness. The flow passage in piezoelectric pump (1) includes a pressure chamber (50) formed into a flat shape in cross section and a suction side flow passage (70a) and discharge side flow passage (70b). The suction side flow passage (70a) and the discharge side flow passage (70b) are disposed at both ends of the pressure chamber (50) so that the axes thereof are aligned with each other. The check valves (20a, 20b) are respectively disposed on the suction side flow passage (70a) and the discharge side flow passage (70b), and are tilted relative to the flow direction of the liquid.

摘要翻译： 一种隔膜泵，通过减少液体的压力损失和减小厚度，可以提高泵的效率。 压电泵（1）中的流路包括形成为扁平形状的压力室（50）和吸入侧流路（70a）和排出侧流路（70b）。 吸入侧流路（70a）和排出侧流路（70b）设置在压力室（50）的两端，使其轴线彼此对准。 止回阀（20a，20b）分别设置在吸入侧流路（70a）和排出侧流路（70b）上，相对于液体的流动方向倾斜。

公开(公告)号：US20060055053A1

公开(公告)日：2006-03-16

申请号：US11267328

申请日：2005-11-07

申请人： Takao Yamazaki ,  Hirobumi Inoue ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Masahiro Kubo ,  Yoshimichi Sogawa ,  Hidehiko Kuroda

发明人： Takao Yamazaki ,  Hirobumi Inoue ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Masahiro Kubo ,  Yoshimichi Sogawa ,  Hidehiko Kuroda

IPC分类号： H01L23/48

CPC分类号： H01L25/50 ,  H01L23/4985 ,  H01L25/105 ,  H01L2224/02371 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.

公开(公告)号：US06999643B2

公开(公告)日：2006-02-14

申请号：US10303976

申请日：2002-11-26

申请人： Hideo Kikuchi ,  Mikio Oda ,  Hikaru Kouta ,  Sakae Kitajo ,  Yuzo Shimada

发明人： Hideo Kikuchi ,  Mikio Oda ,  Hikaru Kouta ,  Sakae Kitajo ,  Yuzo Shimada

IPC分类号： G02B6/12

CPC分类号： G02B6/4228 ,  G02B6/138 ,  G02B6/305 ,  G02B6/42 ,  G02B6/4202 ,  G02B6/4204 ,  G02B6/423 ,  G02B6/43 ,  G02B2006/12069 ,  G02B2006/1215 ,  G02B2006/12159 ,  H05K1/0274

摘要： After an optical waveguide substrate including a supporting substrate is adhered to an electric wiring board, the supporting substrate alone is dissolved using an organic solvent for removal. Alternatively, the supporting substrate alone is melted through a thermal treatment for removal. Further, a core layer of an optical waveguide is formed on the substrate using a photosensitive resin having a thermal expansion coefficient substantially identical to that of the supporting substrate.

摘要翻译： 在将包括支撑基板的光波导基板粘附到电气布线板上之后，仅使用有机溶剂溶解支撑基板以进行除去。 或者，单独的支撑衬底通过热处理熔化以除去。 此外，使用具有与支撑基板的热膨胀系数基本相同的热膨胀系数的感光性树脂，在基板上形成光波导的芯层。

公开(公告)号：US20050231914A1

公开(公告)日：2005-10-20

申请号：US10524770

申请日：2003-08-18

申请人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Mitsuru Yamamoto

发明人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Mitsuru Yamamoto

IPC分类号： G06F1/20 ,  H01L23/467 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/473 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.

摘要翻译： 本发明提供了一种易于构建并将其固定在电子设备上的散热装置，其热传导和散热优良，并且可以使装置的总体构型变薄。 液体冷却单元9和空气冷却单元12形成为一个单元。 液体冷却单元9的吸热表面19接触或结合到功率消耗最大的诸如CPU和发热体的发热组件，并且还在箱2中的小区域内局部产生热量。 液体冷却单元9，由电磁泵构成的液体冷却泵14布置成使冷却剂在流路10中循环。由诸如CPU 6，发热体7等的发热组件产生的热量是热的 通过使液体冷却泵14循环冷却剂，将热传导到整个液体冷却单元9中。

公开(公告)号：US06238086B1

公开(公告)日：2001-05-29

申请号：US09239835

申请日：1999-01-29

申请人： Kazuyuki Mikubo ,  Sakae Kitajo

发明人： Kazuyuki Mikubo ,  Sakae Kitajo

IPC分类号： G01N2518

CPC分类号： G01N25/18 ,  G01K7/42 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01039 ,  H01L2924/1532 ,  H01L2924/00014

摘要： The thermal resistance of an entire semiconductor package with a semiconductor chip and radiation fins is calculated based on thermal resistance of resin between the semiconductor chip and case, thermal resistance of the radiation fins, and thermal resistance of three heat radiation paths in the semiconductor package. One of said three heat radiation paths is passing through the bottom surface of the case. The other of said three radiation paths is passing through the leadframe. The other of three radiation paths is passing through sides of the case other than the leadframe.

摘要翻译： 基于半导体芯片和壳体之间的树脂的热阻，散热片的热阻和半导体封装中的三个热辐射路径的热阻计算出具有半导体芯片和散热片的整个半导体封装的热阻。 所述三个热辐射路径中的一个穿过壳体的底表面。 所述三个辐射路径中的另一个穿过引线框架。 三个辐射路径中的另一个穿过壳体的引导框架以外的两侧。