公开(公告)号：US11446711B2

公开(公告)日：2022-09-20

申请号：US16886571

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC: B08B3/10 ,  H01L21/67 ,  B24B37/34

Abstract: An apparatus for steam treatment of a carrier head or a substrate in a chemical mechanical polishing system includes a load cup, a pedestal in a cavity defined by the load cup, the pedestal configured to receive a substrate from or supply a substrate to a carrier head, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into the cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

公开(公告)号：US11298794B2

公开(公告)日：2022-04-12

申请号：US16688604

申请日：2019-11-19

Applicant: Applied Materials, Inc.

Inventor： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  Priscilla Diep

IPC: H01L21/306 ,  B24B37/005 ,  H01L21/321

Abstract: A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, oscillating the substrate laterally across the polishing pad such that a central portion of the substrate and an edge portion of the substrate are positioned over a polishing surface of the polishing pad for a first duration, and holding the substrate substantially laterally fixed in a position such that the central portion of the substrate is positioned over the polishing surface of the polishing pad and the edge portion of the substrate is positioned over the groove for a second duration.

公开(公告)号：US10967483B2

公开(公告)日：2021-04-06

申请号：US15626857

申请日：2017-06-19

Applicant: Applied Materials, Inc.

Inventor： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

IPC: B24B57/02 ,  B24B37/10 ,  H01L21/67

Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.

公开(公告)号：US20200376523A1

公开(公告)日：2020-12-03

申请号：US16886571

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC: B08B3/10 ,  H01L21/67 ,  B24B37/34

Abstract: An apparatus for steam treatment of a carrier head or a substrate in a chemical mechanical polishing system includes a load cup, a pedestal in a cavity defined by the load cup, the pedestal configured to receive a substrate from or supply a substrate to a carrier head, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into the cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

公开(公告)号：US20200282509A1

公开(公告)日：2020-09-10

申请号：US16688604

申请日：2019-11-19

Applicant: Applied Materials, Inc.

Inventor： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  Priscilla Diep

IPC: B24B37/005 ,  H01L21/321

Abstract: A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, oscillating the substrate laterally across the polishing pad such that a central portion of the substrate and an edge portion of the substrate are positioned over a polishing surface of the polishing pad for a first duration, and holding the substrate substantially laterally fixed in a position such that the central portion of the substrate is positioned over the polishing surface of the polishing pad and the edge portion of the substrate is positioned over the groove for a second duration.

公开(公告)号：US20140329439A1

公开(公告)日：2014-11-06

申请号：US13874495

申请日：2013-05-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Xiong Yeu Chew ,  Kommisetti Subrahmanyam ,  Uday Mahajan ,  Bogdan Swedek ,  Rajeev Bajaj ,  Jianshe Tang

IPC: B24B37/005

CPC classification number: B24B37/0053

Abstract: A TSV (through silicon via) reveal process using CMP (chemical mechanical polishing) may be acoustically monitored and controlled to detect TSV breakage and automatically respond thereto. Acoustic emissions received by one or more acoustic sensors positioned proximate a substrate holder and/or a polishing pad of a CMP system may be analyzed to detect TSV breakage during a CMP process. In response to detecting TSV breakage, one or more remedial actions may automatically occur. In some embodiments, a polishing pad platen may have one or more acoustic sensors integrated therein that extend into a polishing pad mounted on the polishing pad platen. Methods of monitoring and controlling a TSV reveal process are also provided, as are other aspects.

Abstract translation: TSV（通过硅通孔）显示使用CMP（化学机械抛光）的方法可以被声学监测和控制，以检测TSV断裂并自动响应于此。 可以分析由位于CMP系统的衬底保持器和/或抛光垫附近的一个或多个声学传感器接收的声发射，以在CMP处理期间检测TSV断裂。 响应于检测到TSV断裂，可能会自动发生一个或多个补救措施。 在一些实施例中，抛光垫压板可以具有集成在其中的一个或多个声学传感器，其延伸到安装在抛光垫压板上的抛光垫中。 还提供了监测和控制TSV显示过程的方法，以及其他方面。

公开(公告)号：US20250114903A1

公开(公告)日：2025-04-10

申请号：US18483973

申请日：2023-10-10

Applicant: Applied Materials, Inc.

Inventor： Chen-Wei Chang ,  Priscilla Diep ,  Jimin Zhang ,  Taketo Sekine ,  Jianshe Tang ,  Haosheng Wu

IPC: B24B37/30 ,  B24B37/04

Abstract: Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a flexible membrane coupled with the carrier body. The flexible membrane may include a substrate-receiving surface that faces away from the carrier body. The substrate-receiving surface may include a plurality of gripping elements that protrude away from the substrate-receiving surface. Each of the plurality of gripping elements may have a maximum lateral dimension that is no greater than 2 mm.

公开(公告)号：US11951589B2

公开(公告)日：2024-04-09

申请号：US16953139

申请日：2020-11-19

Applicant: Applied Materials, Inc.

Inventor： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  Priscilla Diep

IPC: B24B37/26 ,  B24B37/005 ,  B24B37/04 ,  B24B37/27

CPC classification number: B24B37/26 ,  B24B37/005 ,  B24B37/042 ,  B24B37/27

Abstract: A chemical mechanical polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, and a controller. The polishing pad has a polishing control groove. The carrier is laterally movable by a first actuator across the polishing pad and rotatable by a second actuator. The controller synchronizes lateral oscillation of the carrier head with rotation of the carrier head such that over a plurality of successive oscillations of the carrier head such that when a first angular swath of an edge portion of the substrate is at an azimuthal angular position about an axis of rotation of the carrier head the first angular swath overlies the polishing surface and when a second angular swath of the edge portion of the substrate is at the azimuthal angular position the second angular swath overlies the polishing control groove.

公开(公告)号：US20240109163A1

公开(公告)日：2024-04-04

申请号：US18537574

申请日：2023-12-12

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Chih Chung Chou ,  Jianshe Tang ,  Hui Chen ,  Hari Soundararajan ,  Brian J. Brown

IPC: B24B37/015 ,  B24B57/02 ,  H01L21/321 ,  H01L21/67

CPC classification number: B24B37/015 ,  B24B57/02 ,  H01L21/3212 ,  H01L21/67248

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.

公开(公告)号：US20240066660A1

公开(公告)日：2024-02-29

申请号：US18505913

申请日：2023-11-09

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Hari Soundararajan ,  Jianshe Tang ,  Shou-Sung Chang ,  Brian J. Brown ,  Yen-Chu Yang ,  You Wang ,  Rajeev Bajaj

IPC: B24B37/015 ,  B24B37/10 ,  B24B55/03

CPC classification number: B24B37/015 ,  B24B37/105 ,  B24B55/03 ,  H01L21/30625

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.