公开(公告)号：US11630251B2

公开(公告)日：2023-04-18

申请号：US17571039

申请日：2022-01-07

Applicant: Applied Materials, Inc.

Inventor： Yongan Xu ,  Rutger Meyer Timmerman Thijssen ,  Jinrui Guo ,  Ludovic Godet

IPC: G03F7/20 ,  G02B5/18 ,  G03F1/42

Abstract: A method of forming patterned features on a substrate is provided. The method includes positioning a plurality of masks arranged in a mask layout over a substrate. The substrate is positioned in a first plane and the plurality of masks are positioned in a second plane, the plurality of masks in the mask layout have edges that each extend parallel to the first plane and parallel or perpendicular to an alignment feature on the substrate, the substrate includes a plurality of areas configured to be patterned by energy directed through the masks arranged in the mask layout. The method further includes directing energy towards the plurality of areas through the plurality of masks arranged in the mask layout over the substrate to form a plurality of patterned features in each of the plurality of areas.

公开(公告)号：US11572619B2

公开(公告)日：2023-02-07

申请号：US16795232

申请日：2020-02-19

Applicant: Applied Materials, Inc.

Inventor： Jinrui Guo ,  Ludovic Godet ,  Rutger Meyer Timmerman Thijssen ,  Yongan Xu ,  Jhenghan Yang ,  Chien-An Chen

IPC: C23C16/04 ,  C23C16/56 ,  C23C16/30

Abstract: Embodiments of the present disclosure generally relate to processing a workpiece containing a substrate during deposition, etching, and/or curing processes with a mask to have localized deposition on the workpiece. A mask is placed on a first layer of a workpiece, which protects a plurality of trenches from deposition of a second layer. In some embodiments, the mask is placed before deposition of the second layer. In other embodiments, the second layer is cured before the mask is deposited. In other embodiments, the second layer is etched after the mask is deposited. Methods disclosed herein allow the deposition of a second layer in some of the trenches present in the workpiece, while at least partially preventing deposition of the second layer in other trenches present in the workpiece.

公开(公告)号：US11557987B2

公开(公告)日：2023-01-17

申请号：US17455312

申请日：2021-11-17

Applicant: Applied Materials, Inc.

Inventor： Wayne McMillan ,  Visweswaren Sivaramakrishnan ,  Joseph C. Olson ,  Ludovic Godet ,  Rutger Meyer Timmerman Thijssen ,  Naamah Argaman

IPC: H02N13/00 ,  C23F1/00 ,  G02B6/34 ,  H01L21/683 ,  C23C16/453 ,  H05H1/24 ,  H01L21/265

Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.

公开(公告)号：US20220363064A1

公开(公告)日：2022-11-17

申请号：US17647820

申请日：2022-01-12

Applicant: Applied Materials, Inc.

Inventor： Daihua ZHANG ,  Ludovic Godet ,  Michael David-Scott Kemp ,  Kang Luo ,  Kazuya Daito ,  Kenneth S. Ledford ,  Bahubali S. Upadhye ,  Hemantha Raju ,  John Rusconi ,  Elsa Massonneau ,  Mahendran Chidambaram ,  Alexey Stepanov ,  Visweswaren Sivaramakrishnan

IPC: B41J2/175

Abstract: Embodiments described herein relate to an inkjet printing platform. The inkjet printing platform is utilized for fabrication of optical films and optical device structures. The inkjet printing platform includes a transfer chamber, one or more inkjet chambers, a plurality of auxiliary modules, a substrate flipper, and load ports. The inkjet printing platform is operable to perform an inkjet printing process on a substrate to form an optical film and/or an optical device.

公开(公告)号：US11488856B2

公开(公告)日：2022-11-01

申请号：US17069195

申请日：2020-10-13

Applicant: Applied Materials, Inc.

Inventor： Pramit Manna ,  Ludovic Godet ,  Rui Cheng ,  Erica Chen ,  Ziqing Duan ,  Abhijit Basu Mallick ,  Srinivas Gandikota

IPC: H01L21/762 ,  H01L21/768 ,  H01L21/02 ,  H01L23/31 ,  H01L29/06

Abstract: Methods for seam-less gapfill comprising sequentially depositing a film with a seam, reducing the height of the film to remove the seam and repeating until a seam-less film is formed. Some embodiments include optional film doping and film treatment (e.g., ion implantation and annealing).

公开(公告)号：US11487058B2

公开(公告)日：2022-11-01

申请号：US16993067

申请日：2020-08-13

Applicant: Applied Materials, Inc.

Inventor： Levent Colak ,  Ludovic Godet ,  Andre P. Labonte

IPC: F21V8/00

Abstract: Embodiments described herein provide for methods of forming optical device structures. The methods utilize rotation of a substrate, to have the optical device structures formed thereon, and tunability of etch rates of a patterned resist disposed over the substrate and one of a device layer or the substrate to form the optical device structures without multiple lithographic patterning steps and angled etch steps.

公开(公告)号：US20220299677A1

公开(公告)日：2022-09-22

申请号：US17654860

申请日：2022-03-15

Applicant: Applied Materials, Inc.

Inventor： Erica CHEN ,  Kang Luo ,  Hao Tang ,  Jinrui Guo ,  Ludovic Godet

IPC: G02B1/00 ,  G02B1/11 ,  G02B5/18

Abstract: Embodiments of the present disclosure generally relate to encapsulated optical devices and methods of forming encapsulated optical devices. The optical devices include a plurality of optical device structures disposed on a substrate. An encapsulation coating is disposed over the plurality of optical device structures. The encapsulation coating includes a ratio of encapsulation material to solvent. A plurality of gaps are formed in the optical device. The plurality of gaps are formed when the solvent is evaporated from the encapsulation coating. The material composition of the encapsulation coating, the width and device angle of the plurality of optical device structures, as well as process parameters of the spin on coating process, the curing process, the baking process, the drying process, and the developing process will affect the formation of the plurality of gaps and the depth at which the plurality of gaps are formed.

公开(公告)号：US11437559B2

公开(公告)日：2022-09-06

申请号：US16823206

申请日：2020-03-18

Applicant: Applied Materials, Inc

Inventor： Mingwei Zhu ,  Zihao Yang ,  Nag B. Patibandla ,  Ludovic Godet ,  Yong Cao ,  Daniel Lee Diehl ,  Zhebo Chen

IPC: H01L21/3205 ,  H01L39/24 ,  H01L39/12 ,  H01L39/22 ,  C23C14/54 ,  C23C14/34 ,  G01J1/44

Abstract: A physical vapor deposition system includes a chamber, three target supports to targets, a movable shield positioned having an opening therethrough, a workpiece support to hold a workpiece in the chamber, a gas supply to deliver nitrogen gas and an inert gas to the chamber, a power source, and a controller. The controller is configured to move the shield to position the opening adjacent each target in turn, and at each target cause the power source to apply power sufficient to ignite a plasma in the chamber to cause deposition of a buffer layer, a device layer of a first material that is a metal nitride suitable for use as a superconductor at temperatures above 8° K on the buffer layer, and a capping layer, respectively.

公开(公告)号：US20220214163A1

公开(公告)日：2022-07-07

申请号：US17645200

申请日：2021-12-20

Applicant: Applied Materials, Inc.

Inventor： Yangyang SUN ,  Jinxin Fu ,  Ludovic Godet

IPC: G01B11/26

Abstract: Embodiments described herein provide for devices and methods of measuring a pitch P of optical device structures and an orientation angle ϕ of the optical device structures. One embodiment of the system includes an optical arm coupled to an arm actuator. The optical arm includes a light source. The light source emits a light path operable to be diffracted to the stage. The optical arm further includes a first beam splitter and a second beam splitter positioned in the light path. The first beam splitter directs the light path through a first lens and the second beam splitter directs the light path through a first dove prism and a second lens. The optical arm further includes a first detector operable to detect the light path from the first lens and second detector operable to detect the light path from the second lens.

公开(公告)号：US11111176B1

公开(公告)日：2021-09-07

申请号：US16803956

申请日：2020-02-27

Applicant: Applied Materials, Inc.

Inventor： Yongan Xu ,  Chien-An Chen ,  Ludovic Godet

IPC: C03C17/36 ,  C03C17/38

Abstract: Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one implementation, a film stack for optical devices includes a glass substrate including a first surface and a second surface. The film stack includes a device function layer formed on the first surface, a hard mask layer formed on the device function layer, and a substrate recognition layer formed on the hard mask layer. The hard mask layer includes one or more of chromium, ruthenium, or titanium nitride. The film stack includes a backside layer formed on the second surface. The backside layer formed on the second surface includes one or more of a conductive layer or an oxide layer.