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    APPARATUSES AND METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING NON-AXISYMMETRIC BEAM SPOTS
    43.
    发明申请
    APPARATUSES AND METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING NON-AXISYMMETRIC BEAM SPOTS 审中-公开

    公开(公告)号：US20180093914A1

    公开(公告)日：2018-04-05

    申请号：US15718848

    申请日：2017-09-28

    Applicant: CORNING INCORPORATED

    Inventor： Ravindra Kumar Akarapu ,  Garrett Andrew Piech ,  Sergio Tsuda ,  James Andrew West

    IPC: C03B33/08 ,  C03B33/10 ,  B23K26/00 ,  B23K26/06 ,  B23K26/073 ,  B23K26/08 ,  B23K26/38 ,  B23K26/067

    Abstract: A method for laser processing a transparent workpiece includes forming a contour line that includes defects, by directing a pulsed laser beam output by a beam source through an aspheric optical element positioned offset in a radial direction from the beam pathway and into the transparent workpiece such that the portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece that produces a defect within the transparent workpiece. The portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, an effective spot size wo,eff, and a non-axisymmetric beam cross section having a minimum Rayleigh range ZRx,min in an x-direction and a minimum Rayleigh range ZRy,min in a y-direction. Further, the smaller of ZRx,min and ZRy,min is greater than F D  π   w 0 , eff 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater.

    METHODS OF CONTINUOUS FABRICATION OF HOLES IN FLEXIBLE SUBSTRATE SHEETS AND PRODUCTS RELATING TO THE SAME
    48.
    发明申请
    METHODS OF CONTINUOUS FABRICATION OF HOLES IN FLEXIBLE SUBSTRATE SHEETS AND PRODUCTS RELATING TO THE SAME 审中-公开
    连续制造柔性基材片和相关产品的方法

    公开(公告)号：US20170008122A1

    公开(公告)日：2017-01-12

    申请号：US15205284

    申请日：2016-07-08

    Applicant: CORNING INCORPORATED

    Inventor： Kristopher Allen Wieland ,  Garrett Andrew Piech ,  John Tyler Keech ,  Jeffrey Mathew Clark

    IPC: B23K26/00 ,  B32B3/26 ,  B23K26/386 ,  B32B17/06

    CPC classification number: B32B3/266 ,  B23K26/0604 ,  B23K26/53 ,  B23K2103/54 ,  B32B17/06 ,  B32B2307/412 ,  C03B33/0222 ,  C03C15/00 ,  C03C17/06 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49827 ,  Y02P40/57

    Abstract: Systems and processes of cutting and drilling in a target substrate uses a laser (e.g., a pulsed laser) and an optical system to generate a line focus of the laser beam within the target substrate, such as a glass substrate sheet, are provided. The laser cutting and drilling system and process creates holes or defects that, in certain embodiments, extend the full depth of the glass sheet with each individual laser pulse, and allows the laser system to cut and separate the target substrate into any desired contour by creating a series of perforations that form a contour or desired part shape. Since a glass substrate sheet is brittle, cracking will then follow the perforated contour, allowing the glass substrate sheet to separate into any required shape defined by the perforations.

    Abstract translation: 在靶基板中切割和钻孔的系统和工艺使用激光器（例如脉冲激光器）和光学系统来产生激光束在诸如玻璃基板之类的目标基板内的线焦点。 激光切割和钻孔系统和工艺产生孔或缺陷，在某些实施例中，使用每个单独的激光脉冲来延伸玻璃板的整个深度，并且允许激光系统通过产生目标基板来切割和分离任何期望的轮廓 形成轮廓或期望的部件形状的一系列穿孔。 由于玻璃基片是脆性的，因此随着穿孔轮廓的开裂，允许玻璃基片分离成由穿孔限定的任何所需形状。

    LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES
    50.
    发明申请
    LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES 审中-公开
    激光切割温度基板

    公开(公告)号：US20160200621A1

    公开(公告)日：2016-07-14

    申请号：US14993236

    申请日：2016-01-12

    Applicant: Corning Incorporated

    Inventor： Moussa N'Gom ,  Garrett Andrew Piech ,  James Joseph Watkins ,  Kristopher Allen Wieland ,  Chad Michael Wilcox

    IPC: C03B33/02 ,  B23K26/402 ,  B23K26/38

    CPC classification number: C03B33/0222 ,  B23K26/0622 ,  B23K26/359 ,  B23K26/53 ,  B23K2103/54 ,  Y02P40/57

    Abstract: Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.

    Abstract translation: 公开了用于激光切割热回火衬底的系统和方法。 在一个实施例中，分离热回火衬底的方法包括引导激光束焦线，使得激光束焦线的至少一部分在热回火衬底的主体内。 聚焦的脉冲激光束被脉冲以形成包括一个或多个子脉冲的脉冲串序列。 激光束焦线沿着激光束焦线在回火基板的主体内产生损伤轨迹。 在聚焦的脉冲激光束和回火衬底之间提供相对运动，使得脉冲激光束在回火衬底内形成一系列损伤轨迹。 损伤轨迹序列的单个损伤轨迹由横向间隔分开，并且一个或多个微裂纹连接损坏轨迹序列的相邻损伤轨迹。

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