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公开(公告)号：US08178448B2
公开(公告)日：2012-05-15
申请号：US12852094
申请日：2010-08-06
IPC分类号： H01L21/31
CPC分类号： H01L21/0217 , C23C16/345 , C23C16/45527 , C23C16/45542 , C23C16/45546 , H01L21/0228 , H01L21/3141 , H01L21/3185
摘要： Disclosed is a method for using a film formation apparatus to form a silicon nitride film by CVD on target substrates while suppressing particle generation. The apparatus includes a process container and an exciting mechanism attached on the process container. The method includes conducting a pre-coating process by performing pre-cycles and conducting a film formation process by performing main cycles. Each of the pre-cycles and main cycles alternately includes a step of supplying a silicon source gas and a step of supplying a nitriding gas with steps of exhausting gas from inside the process container interposed therebetween. The pre-coating process includes no period of exciting the nitriding gas by the exciting mechanism. The film formation process repeats a first cycle set that excites the nitriding gas by the exciting mechanism and a second cycle that does not excite the nitriding gas by the exciting mechanism.
摘要翻译： 公开了一种使用成膜装置在目标基板上通过CVD形成氮化硅膜同时抑制颗粒产生的方法。 该装置包括附着在处理容器上的处理容器和激励机构。 该方法包括通过执行预循环并通过执行主循环进行成膜过程进行预涂工艺。 预循环和主循环中的每一个交替地包括供给硅源气体的步骤和从氮化气体供给步骤的步骤，该步骤从夹在其间的处理容器内部排出气体。 预涂工艺不包括激发机构激发氮化气体的时间。 成膜过程重复利用激发机构激发氮化气体的第一循环组和不由激发机构激发氮化气体的第二循环。
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公开(公告)号：US08168375B2
公开(公告)日：2012-05-01
申请号：US12441007
申请日：2008-06-06
CPC分类号： H01L21/3086 , G03F7/40 , H01L21/02164 , H01L21/02219 , H01L21/02274 , H01L21/3088 , H01L21/31608
摘要： Disclosed is a patterning method including: forming a first film on a substrate; forming a multi-layered film including a resist film on the first film; forming a patterned resist film having a preset pattern by patterning the resist film by photolithography; forming a silicon oxide film different from the first film on the patterned resist film and the first film by alternately supplying a first gas containing organic silicon and a second gas containing an activated oxygen species to the substrate; etching the silicon oxide film to thereby form a sidewall spacer on a sidewall of the patterned resist film; removing the patterned resist film; and processing the first film by using the sidewall spacer as a mask.
摘要翻译： 公开了一种图案化方法，包括：在基板上形成第一膜; 在所述第一膜上形成包括抗蚀剂膜的多层膜; 通过光刻对图案化抗蚀剂膜形成具有预设图案的图案化抗蚀剂膜; 在所述图案化的抗蚀剂膜和所述第一膜上形成与所述第一膜不同的氧化硅膜，通过交替地向所述基板供给含有有机硅的第一气体和含有活性氧的第二气体; 蚀刻氧化硅膜，从而在图案化抗蚀剂膜的侧壁上形成侧壁间隔物; 去除图案化的抗蚀剂膜; 以及通过使用侧壁间隔件作为掩模来处理第一膜。
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公开(公告)号：US08080290B2
公开(公告)日：2011-12-20
申请号：US12320018
申请日：2009-01-14
CPC分类号： H01L21/3185 , C23C16/345 , C23C16/45542
摘要： A film formation method is used for forming a silicon nitride film on a target substrate by repeating a plasma cycle and a non-plasma cycle a plurality of times, in a process field configured to be selectively supplied with a first process gas containing a silane family gas and a second process gas containing a nitriding gas and communicating with an exciting mechanism for exciting the second process gas to be supplied. The method includes obtaining a relation formula or relation table that represents relationship of a cycle mixture manner of the plasma cycle and the non-plasma cycle relative to a film quality factor of the silicon nitride film; determining a specific manner of the cycle mixture manner based on a target value of the film quality factor with reference to the relation formula or relation table; and arranging the film formation process in accordance with the specific manner.
摘要翻译： 使用成膜方法在目标衬底上形成氮化硅膜，通过重复等离子体循环和非等离子体循环多次，在被配置为选择性地供给包含硅烷族的第一工艺气体的工艺过程中 气体和含有氮化气体的第二工艺气体，并与用于激发待供应的第二工艺气体的激励机构连通。 该方法包括获得表示等离子体循环与非等离子体循环的循环混合方式相对于氮化硅膜的膜质量因子的关系的关系式或关系表; 参照关系公式或关系表，基于电影品质因子的目标值确定循环混合方式的具体方式; 并根据具体方式布置成膜处理。
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公开(公告)号：US07989354B2
公开(公告)日：2011-08-02
申请号：US12441754
申请日：2008-06-06
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： G03F7/405 , G03F7/0035 , H01L21/02164 , H01L21/0228 , H01L21/0271 , H01L21/0337 , H01L21/31144 , H01L21/32139
摘要： Disclosed is a patterning method including: forming a first film on a substrate; forming a first resist film on the first film; processing the first resist film into a first resist pattern having a preset pitch by photolithography; forming a silicon oxide film on the first resist pattern and the first film by alternately supplying a first gas containing organic silicon and a second gas containing an activated oxygen species to the substrate; forming a second resist film on the silicon oxide film; processing the second resist film into a second resist pattern having a preset pitch by the photolithography; and processing the first film by using the first resist pattern and the second resist pattern as a mask.
摘要翻译： 公开了一种图案化方法，包括：在基板上形成第一膜; 在第一膜上形成第一抗蚀剂膜; 通过光刻将第一抗蚀剂膜加工成具有预设间距的第一抗蚀剂图案; 通过将含有有机硅的第一气体和含有活性氧的第二气体交替地供给到所述基板上，在所述第一抗蚀剂图案和所述第一膜上形成氧化硅膜; 在氧化硅膜上形成第二抗蚀剂膜; 通过光刻将第二抗蚀剂膜加工成具有预设间距的第二抗蚀剂图案; 以及通过使用第一抗蚀剂图案和第二抗蚀剂图案作为掩模来处理第一膜。
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公开(公告)号：US20110129619A1
公开(公告)日：2011-06-02
申请号：US12954778
申请日：2010-11-26
申请人： Masanobu Matsunaga , Keisuke Suzuki , Jaehyuk Jang , Pao-Hwa Chou , Masato Yonezawa , Masayuki Hasegawa , Kazuhide Hasebe
发明人： Masanobu Matsunaga , Keisuke Suzuki , Jaehyuk Jang , Pao-Hwa Chou , Masato Yonezawa , Masayuki Hasegawa , Kazuhide Hasebe
CPC分类号： H01L21/3185 , C23C16/345 , C23C16/4404 , C23C16/45542 , C23C16/45546 , C23C16/52 , H01L21/0217 , H01L21/0228
摘要： A film formation method includes setting a target object at a temperature of 150 to 550° C., the target object being placed inside the process container configured to hold a vacuum state therein, and then, repeating a cycle alternately including a first supply step and a second supply step a plurality of times to form a silicon nitride film on the target object. The first supply step is a step of supplying monochlorosilane gas as an Si source into the process container while setting the process container at a pressure of 66.65 to 666.5 Pa therein. The second supply step is a step of supplying a nitrogen-containing gas as a nitriding gas into the process container.
摘要翻译： 成膜方法包括将目标物体设定在150〜550℃的温度，将被处理物体配置在保持真空状态的处理容器的内部，然后交替地重复包含第一供给工序和 第二供给步骤多次以在目标物体上形成氮化硅膜。 第一供给步骤是将处理容器中的一氯硅烷气体作为Si源供给到处理容器中，同时使处理容器的压力为66.65〜666.5Pa。 第二供给步骤是将作为氮化气体的含氮气体供给到处理容器中的步骤。
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公开(公告)号：US20110129618A1
公开(公告)日：2011-06-02
申请号：US12954767
申请日：2010-11-26
CPC分类号： C23C16/345 , C23C16/4404 , C23C16/45542 , C23C16/45546
摘要： A method for using a vertical film formation apparatus includes performing a coating process inside the process container without product target objects present therein to cover an inner surface of the process container with a coating film, and then performing a film formation process inside the process container accommodating the holder with the product target objects placed thereon to form a predetermined film on the product target objects. The coating process alternately supplies the first and second process gases into the process container without turning either of the first and second process gases into plasma. The film formation process alternately supplies the first and second process gases into the process container while turning at least one of the first and second process gases into plasma.
摘要翻译： 使用垂直成膜装置的方法包括在其中没有产品目标物体的处理容器内部进行涂覆处理以用涂膜覆盖处理容器的内表面，然后在容纳处理容器内部进行成膜处理 具有放置在其上的产品目标物体的保持器，以在产品目标物体上形成预定的膜。 涂覆过程交替地将第一和第二工艺气体提供到工艺容器中，而不将第一和第二工艺气体中的任何一种转化为等离子体。 成膜过程将第一和第二处理气体交替地供给到处理容器中，同时将第一和第二处理气体中的至少一个转化为等离子体。
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公开(公告)号：US20100304574A1
公开(公告)日：2010-12-02
申请号：US12852094
申请日：2010-08-06
IPC分类号： H01L21/318
CPC分类号： H01L21/0217 , C23C16/345 , C23C16/45527 , C23C16/45542 , C23C16/45546 , H01L21/0228 , H01L21/3141 , H01L21/3185
摘要： Disclosed is a method for using a film formation apparatus to form a silicon nitride film by CVD on target substrates while suppressing particle generation. The apparatus includes a process container and an exciting mechanism attached on the process container. The method includes conducting a pre-coating process by performing pre-cycles and conducting a film formation process by performing main cycles. Each of the pre-cycles and main cycles alternately includes a step of supplying a silicon source gas and a step of supplying a nitriding gas with steps of exhausting gas from inside the process container interposed therebetween. The pre-coating process includes no period of exciting the nitriding gas by the exciting mechanism. The film formation process repeats a first cycle set that excites the nitriding gas by the exciting mechanism and a second cycle that does not excite the nitriding gas by the exciting mechanism.
摘要翻译： 公开了一种使用成膜装置在目标基板上通过CVD形成氮化硅膜同时抑制颗粒产生的方法。 该装置包括附着在处理容器上的处理容器和激励机构。 该方法包括通过执行预循环并通过执行主循环进行成膜过程进行预涂工艺。 预循环和主循环中的每一个交替地包括提供硅源气体的步骤和从氮化气体供给步骤的步骤，该步骤从其间插入处理容器内部排出气体。 预涂工艺不包括激发机构激发氮化气体的时间。 成膜过程重复利用激发机构激发氮化气体的第一循环组和不由激发机构激发氮化气体的第二循环。
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公开(公告)号：US07718497B2
公开(公告)日：2010-05-18
申请号：US12130296
申请日：2008-05-30
IPC分类号： H01L21/8234
CPC分类号： H01L21/823864 , H01L21/823814
摘要： A semiconductor device manufacturing method includes: forming a sidewall spacer on a sidewall surface of a gate electrode; forming a pair of second conductive type source and drain regions in an active region; covering top surfaces of a semiconductor layer, a device isolation region, the sidewall spacer and the gate electrode with a metal film; reducing resistance of the source and drain regions and the gate electrode partially by making the metal film react with the semiconductor layer and the gate electrode; and removing an unreacted portion of the metal film and the sidewall spacer simultaneously by using an etchant which readily etches the unreacted portion of the metal film and the sidewall spacer while hardly etching the device isolation region, resistance-reduced portions of the gate electrode and resistance-reduced portions of the source and drain regions.
摘要翻译： 半导体器件制造方法包括：在栅电极的侧壁表面上形成侧壁间隔物; 在有源区中形成一对第二导电型源区和漏区; 用金属膜覆盖半导体层的顶表面，器件隔离区，侧壁间隔物和栅电极; 通过使金属膜与半导体层和栅极电极反应，部分地降低源极和漏极区域和栅电极的电阻; 并且通过使用易于蚀刻金属膜和侧壁间隔物的未反应部分的蚀刻剂同时去除金属膜和侧壁间隔物的未反应部分，同时几乎不蚀刻器件隔离区域，栅电极的电阻减少部分和电阻 - 源区和漏区的部分。
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公开(公告)号：US20080299728A1
公开(公告)日：2008-12-04
申请号：US12130296
申请日：2008-05-30
IPC分类号： H01L21/8236
CPC分类号： H01L21/823864 , H01L21/823814
摘要： A semiconductor device manufacturing method includes: forming a sidewall spacer on a sidewall surface of a gate electrode; forming a pair of second conductive type source and drain regions in an active region; covering top surfaces of a semiconductor layer, a device isolation region, the sidewall spacer and the gate electrode with a metal film; reducing resistance of the source and drain regions and the gate electrode partially by making the metal film react with the semiconductor layer and the gate electrode; and removing an unreacted portion of the metal film and the sidewall spacer simultaneously by using an etchant which readily etches the unreacted portion of the metal film and the sidewall spacer while hardly etching the device isolation region, resistance-reduced portions of the gate electrode and resistance-reduced portions of the source and drain regions.
摘要翻译： 半导体器件制造方法包括：在栅电极的侧壁表面上形成侧壁间隔物; 在有源区中形成一对第二导电型源区和漏区; 用金属膜覆盖半导体层的顶表面，器件隔离区，侧壁间隔物和栅电极; 通过使金属膜与半导体层和栅极电极反应，部分地降低源极和漏极区域和栅电极的电阻; 并且通过使用易于蚀刻金属膜和侧壁间隔物的未反应部分的蚀刻剂同时去除金属膜和侧壁间隔物的未反应部分，同时几乎不蚀刻器件隔离区域，栅电极的电阻减少部分和电阻 - 源区和漏区的部分。
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公开(公告)号：US20080063791A1
公开(公告)日：2008-03-13
申请号：US11892948
申请日：2007-08-28
IPC分类号： C23C16/00
CPC分类号： C23C16/45525 , C03C17/225 , C03C2217/281 , C03C2217/282 , C03C2217/283 , C03C2218/152 , C23C16/30 , C23C16/45542 , C23C16/45546 , C23C16/45578
摘要： An insulating film is formed on a target substrate by CVD, in a process field to be selectively supplied with a first process gas containing a silane family gas, a second process gas containing a nitriding gas or oxynitriding gas, a third process gas containing a boron-containing gas, and a fourth process gas containing a carbon hydride gas. A first step performs supply of the first process gas and a preceding gas, which is one of the third and fourth process gases, while stopping supply of the second process gas and a succeeding gas, which is the other of the third and fourth process gases. A second step performs supply of the succeeding gas, while stopping supply of the second process gas and the preceding gas. A third step performs supply of the second process gas while stopping supply of the first process gas.
摘要翻译： 通过CVD在目标基板上形成绝缘膜，在选择性地供给包含硅烷族气体的第一工艺气体，含有氮化气体或氮氧化气体的第二工艺气体的工艺领域中，含有硼的第三工艺气体 和含有碳氢化合物气体的第四工艺气体。 第一步骤是在停止供给第二处理气体的第一处理气体和作为第三和第四处理气体之一的前一个气体的供给的同时，提供作为第三和第四处理气体中的另一个的后续气体 。 第二步骤在停止第二处理气体和前一个气体的供给的同时，进行后续气体的供给。 第三步骤在停止供应第一处理气体的同时进行第二处理气体的供应。
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