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82 条记录 (耗时 0.046 秒)

    Determining Physical Property of Substrate
    41.
    发明申请
    Determining Physical Property of Substrate 有权
    确定基材的物理性质

    公开(公告)号：US20100261413A1

    公开(公告)日：2010-10-14

    申请号：US12822096

    申请日：2010-06-23

    申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    IPC分类号： B24B49/02 ,  B24B49/12

    CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

    摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

    摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

    DETERMINING PHYSICAL PROPERTY OF SUBSTRATE
    44.
    发明申请
    DETERMINING PHYSICAL PROPERTY OF SUBSTRATE 有权
    确定基材的物理性质

    公开(公告)号：US20080146120A1

    公开(公告)日：2008-06-19

    申请号：US11611640

    申请日：2006-12-15

    申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    IPC分类号： B24B49/00 ,  G01B11/24

    CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

    摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

    摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

    Smart conditioner rinse station
    46.
    发明申请
    Smart conditioner rinse station 失效

    公开(公告)号：US20060270322A1

    公开(公告)日：2006-11-30

    申请号：US11273766

    申请日：2005-11-14

    申请人： Alpay Yilmaz ,  Lakshmanan Karuppiah

    发明人： Alpay Yilmaz ,  Lakshmanan Karuppiah

    IPC分类号： B24B49/00 ,  B24B1/00 ,  B24B7/30

    CPC分类号： B24B53/017 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67253

    摘要： A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.

    Process and composition for electrochemical mechanical polishing
    47.
    发明申请
    Process and composition for electrochemical mechanical polishing 审中-公开
    电化学机械抛光的工艺和组成

    公开(公告)号：US20060249395A1

    公开(公告)日：2006-11-09

    申请号：US11389867

    申请日：2006-03-27

    申请人： You Wang ,  Junzi Zhao ,  Jie Diao ,  Renhe Jia ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Robert Ewald

    发明人： You Wang ,  Junzi Zhao ,  Jie Diao ,  Renhe Jia ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Robert Ewald

    IPC分类号： C09K13/00 ,  B23H9/00 ,  B23H3/00

    CPC分类号： C09K3/1463 ,  B23H5/08

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a leveler a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，整理剂，溶剂， 并且pH在约3至约10之间。该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及 去除导电材料层。

    Platen assembly utilizing magnetic slip ring
    48.
    发明申请
    Platen assembly utilizing magnetic slip ring 审中-公开
    使用磁滑环的压板组件

    公开(公告)号：US20060154569A1

    公开(公告)日：2006-07-13

    申请号：US11034350

    申请日：2005-01-11

    申请人： Terry Doyle ,  Lakshmanan Karuppiah

    发明人： Terry Doyle ,  Lakshmanan Karuppiah

    IPC分类号： B24B49/00

    CPC分类号： B24B37/04 ,  H01L21/67219 ,  H01L21/68792

    摘要： Embodiments of the present invention generally relate to an apparatus for processing a substrate and more specifically to a device that will transfer electrical power and/or control signals between a stationary base and a rotating platen without involving mechanical contact. The device does not suffer the drawbacks of conventional slip rings burdened with moving surfaces. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a planarizing material and disposed on a stationary base so that the platen assembly may rotate relative to the base. The apparatus further includes a coupling assembly for transferring electrical energy from a primary coil to a secondary coil. The coupling assembly includes the primary coil of wire wrapped around a first core; the first core coupled to the base; the secondary coil of wire wrapped around a second core; and the second core coupled to the platen assembly.

    摘要翻译： 本发明的实施例总体上涉及一种用于处理衬底的装置，更具体地涉及将在固定基座和旋转压板之间传递电力和/或控制信号而不涉及机械接触的装置。 该装置不会承受传统的滑动环带有移动表面的缺点。 在一个实施例中，提供了一种用于处理衬底的设备。 该装置包括压板组件，其具有用于支撑平坦化材料并设置在固定基座上的表面，使得压板组件可相对于底座旋转。 该装置还包括用于将电能从初级线圈传递到次级线圈的联接组件。 联接组件包括缠绕在第一芯上的线的初级线圈; 第一个核心耦合到基地; 线圈的二次线圈缠绕在第二芯上; 以及联接到压板组件的第二芯体。

    Apparatus and methods for brush and pad conditioning
    49.
    发明授权
    Apparatus and methods for brush and pad conditioning 有权
    刷和垫调节的装置和方法

    公开(公告)号：US08813293B2

    公开(公告)日：2014-08-26

    申请号：US13897008

    申请日：2013-05-17

    申请人： Sen-Hou Ko ,  Lakshmanan Karuppiah

    发明人： Sen-Hou Ko ,  Lakshmanan Karuppiah

    IPC分类号： A46B13/00 ,  B08B11/00

    CPC分类号： B24B1/00 ,  A46B13/001 ,  A46B2200/3093 ,  B08B1/002 ,  B08B1/007 ,  B08B1/04 ,  B08B3/041 ,  B08B15/04 ,  B24B37/08 ,  B24B37/20 ,  B24B53/017 ,  B24D13/12 ,  H01L21/67028 ,  H01L21/67046

    摘要： A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.

    摘要翻译： 描述了一种用于调节设置在刷盒中的圆柱形辊的处理表面的方法和装置。 在一个实施例中，描述了刷盒。 所述刷盒包括具有至少部分地设置在所述内部容积中的内部容积的容器和一对圆柱形的滚子，每个所述圆柱滚子可围绕相应的轴线旋转，所述致动器组件联接到每个所述圆柱滚子以使 在圆柱滚子接近的第一位置和圆柱滚子彼此分开的第二位置之间的相应的圆柱滚子，以及用于每个圆柱滚子的调节装置，每个调节装置包括设置在内部的调节器 当辊处于第二位置时，调节器接触每个圆柱滚子的外表面。

    In-line wafer thickness sensing
    50.
    发明授权
    In-line wafer thickness sensing 有权
    在线晶片厚度检测

    公开(公告)号：US08628376B2

    公开(公告)日：2014-01-14

    申请号：US12610979

    申请日：2009-11-02

    申请人： Garrett H. Sin ,  Sanjeev Jain ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

    发明人： Garrett H. Sin ,  Sanjeev Jain ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

    IPC分类号： B24B49/00

    CPC分类号： B24B37/013 ,  B24B49/02 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of forming bare silicon substrates is described. A bare silicon substrate is measured, wherein measuring is performed by a non-contact capacitance measurement device to obtain a signal at a point on the substrate. The signal or a thickness indicated by the signal is communicated to a controller. An adjusted polishing parameter according to the signal or thickness indicated by the signal is determined. After determining an adjusted polishing parameter, the bare silicon substrate is polished on a polisher using the adjusted polishing parameter.

    摘要翻译： 描述形成裸硅衬底的方法。 测量裸硅衬底，其中通过非接触电容测量装置进行测量以获得衬底上的点处的信号。 由信号指示的信号或厚度被传送到控制器。 确定根据由信号指示的信号或厚度的调整的抛光参数。 在确定调整的抛光参数之后，使用调整的抛光参数在抛光机上抛光裸硅衬底。