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公开(公告)号：US5275931A
公开(公告)日：1994-01-04
申请号：US980734
申请日：1992-11-24
申请人： Mitsuo Saitou , Hisashi Okamura , Tadashi Ikeda
发明人： Mitsuo Saitou , Hisashi Okamura , Tadashi Ikeda
摘要： A silver halide light-sensitive material containing at least silver halide grains, a dispersion medium, an antifoggant, and a hardening agent, wherein said antifoggant is an antifoggant having a reactive substituent capable of reacting with a functional group of the dispersion medium to form a covalent bond after adsorption on the silver halide grains and/or an antifoggant previously covalently bonded to the dispersion medium. The antifoggant is immobilized in a light-sensitive material while exerting its antifogging activity and is not therefore dissolved into a developing solution.
摘要翻译： 至少含有卤化银颗粒的卤化银感光材料，分散介质，防灰雾剂和硬化剂，其中所述防灰雾剂是具有能够与分散介质的官能团反应形成 在卤化银颗粒上吸附后的共价键和/或先前共价键合到分散介质上的防灰雾剂。 防灰雾剂固化在感光材料中同时发挥其防雾活性，因此不会溶解在显影液中。
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公开(公告)号：US5190846A
公开(公告)日：1993-03-02
申请号：US614181
申请日：1990-11-13
申请人： Morio Yagihara , Hisashi Okamura , Kazunobu Katoh
发明人： Morio Yagihara , Hisashi Okamura , Kazunobu Katoh
IPC分类号： G03C7/26 , G03C1/06 , G03C1/295 , G03C1/34 , G03C1/40 , G03C1/43 , G03C5/29 , G03C7/305 , G03C7/392
CPC分类号： G03C1/34 , G03C1/06 , G03C1/295 , G03C1/40 , G03C1/43 , G03C7/305 , G03C1/061 , G03C1/07 , G03C2200/22 , G03C7/30541 , Y10S430/156 , Y10S430/158 , Y10S430/16
摘要： A silver halide photographic material comprising a support having thereon at least one light-sensitive silver halide emulsion layer, wherein the silver halide photographic material contains at least one photographic agent represented by the following formula (I): ##STR1## wherein X represents a hydrogen atom or a group capable of forming a hydrogen atom upon hydrolysis; Time represents a divalent linking group; PUG represents a photographically useful group; V represents ##STR2## wherein R.sub.0 represents n alkoxy group or an aryloxy group, ##STR3## an iminomethylene group or ##STR4## R.sub.1 represents a hydrogen atom, an aliphatic group, an aromatic group, a heterocyclic group, an alkoxy group, an aryloxy group, an amino group or --CHR.sub.2 --(Time).sub.m PUG; R.sub.2 represents a hydrogen atom, an aliphatic group, an aromatic group or a heterocyclic group; m represents 0 or 1; and n represents 0 or 1. The redox compound represented by formula (I) has excellent preservability and rapidly releases a photographically useful agent.
摘要翻译： 一种卤化银照相材料，其包含其上具有至少一种感光卤化银乳剂层的载体，其中所述卤化银照相材料含有至少一种下式（I）表示的照相剂：其中X 表示氢原子或在水解时能够形成氢原子的基团; 时间表示二价连接基团; PUG代表一个摄影有用的组; V表示其中R 0表示n个烷氧基或芳氧基，其中R 1表示亚氨基亚甲基或R 1表示氢原子，脂族基团，芳基，杂环基，烷氧基，芳氧基 基团，氨基或-CHR2-（时间）mPUG; R2表示氢原子，脂肪族基团，芳香族基团或杂环基团; m表示0或1; 并且n表示0或1.由式（I）表示的氧化还原化合物具有优异的保存性并快速释放照相用的试剂。
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公开(公告)号：US5134055A
公开(公告)日：1992-07-28
申请号：US512221
申请日：1990-04-20
CPC分类号： G03C7/30511 , G03C1/061 , G03C8/408 , Y10S430/156 , Y10S430/158 , Y10S430/16
摘要： A silver halide photographic material is disclosed, which has at least one compound represented general formula (1): ##STR1## wherein R represents an aliphatic group, an aromatic group, or a heterocyclic group; both L and Time represent a divalent organic group; t represents 0 or 1; PUG represents a photographically useful group; Y represents --SO.sub.2 --, --Y'--SO.sub.2 --, or ##STR2## and Y' represents --O--, --NH--, or ##STR3## The material has a broad exposure latitude in line image-taking work and has a high resolving power in the work. It can form an ultrahard image having a high gamma value of 10 or more. The material may excellently reproduce a line original to form an ultrahard image having a high background density. It also has a broad exposure latitude in halftone dot image-taking work and can form a halftone dot image having ultrahigh contrast with high image quality.
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公开(公告)号：US5028510A
公开(公告)日：1991-07-02
申请号：US525019
申请日：1990-05-18
申请人： Hisashi Okamura , Takahiro Goto , Kazonobu Katoh
发明人： Hisashi Okamura , Takahiro Goto , Kazonobu Katoh
CPC分类号： G03C1/48561 , G03C1/061
摘要： A silver halide photographic material having at least one hydrophilic colloid layer, wherein at least one hydrophilic colloid layer is a silver halide photographic emulsion layer, and at least one hydrophilic colloid layer contains a compound represented by the general formula (I): ##STR1## wherein A.sub.1 and A.sub.2 both represent hydrogen atoms, or one of them represents a hydrogen atom and the other represents a sulfonyl group or ##STR2## (wherein R.sub.0 represents an alkyl group, an alkenyl group, an aryl group, an alkoxy group or an aryloxy group, and l.sub.1 represents 1 or 2); G represents ##STR3## (wherein m.sub.1 represents 1 or 2), --SO.sub.2 --, --SO--, ##STR4## (wherein R.sub.1 represents an alkoxy group or an aryloxy group), a thiocarbonyl group or an iminomethylene group; X represents a substituted or unsubsituted aliphatic group, a substituted or unsubstituted aromatic group or a substituted or unsubstituted heterocyclic group; Y represents a divalent organic group; and Het represents a nitrogen containing heterocyclic aromatic group.
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公开(公告)号：US4506001A
公开(公告)日：1985-03-19
申请号：US595632
申请日：1984-04-03
CPC分类号： G03C8/56 , Y10S430/142
摘要： A photographic recording material is disclosed. The material is comprised of a transparent support base and a number of layers positioned on that base. A dye ligand or a dye ligand-forming substance is positioned on the base and is associated with a light-sensitive silver halide emulsion. In addition, the material contains a mordant layer, an alkaline processing composition, and a means for releasing the composition throughout the photographic recording material in an integrated manner or as a different system. The mordant layer contains a coordination polymer composed of a ligand represented by a general formula (I) defined within the application and a metal ion. The invention makes it possible to immobilize a metal ion using inexpensive, easily available metal-chelatable ligands.
摘要翻译： 公开了一种照相记录材料。 该材料由透明支撑基底和位于该基底上的多个层组成。 染料配体或染料配体形成物质位于基底上并与感光卤化银乳剂相关联。 此外，该材料包含媒染剂层，碱性处理组合物，以及用于以综合的方式或作为不同的系统将整个照相记录材料中的组合物释放的装置。 媒染层含有由本申请中定义的通式（I）表示的配体和金属离子组成的配位聚合物。 本发明使得可以使用便宜且易于获得的金属螯合配体固定金属离子。
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公开(公告)号：US08384185B2
公开(公告)日：2013-02-26
申请号：US13306659
申请日：2011-11-29
CPC分类号： H01L23/5286 , H01L22/32 , H01L23/522 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/12 , H01L24/48 , H01L24/49 , H01L27/0251 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05552 , H01L2224/05553 , H01L2224/05599 , H01L2224/05624 , H01L2224/13099 , H01L2224/1411 , H01L2224/16 , H01L2224/48227 , H01L2224/48463 , H01L2224/49171 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/1306 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A technique is provided which allows a chip mounted by wire bonding and a chip mounted by bump electrodes to share a manufacturing process. Both in a case where a chip is electrically coupled to an external circuit by bump electrodes and a case where the chip is electrically coupled to the external circuit by bonding wires, a bump coupling part and a bonding pad are both provided in a single uppermost wiring layer. When the bump electrodes are used, an opening is provided in an insulating film on the bump coupling part and a surface of the bonding pad is covered with the insulating film. On the other hand, when the bonding wires are used, an opening is provided in an insulating film on the bonding pad and a surface of the bump coupling part is covered with the insulating film.
摘要翻译： 提供了一种技术，其允许通过引线接合安装的芯片和由凸块电极安装的芯片共享制造工艺。 在通过凸块电极将芯片电耦合到外部电路的情况下，以及通过接合线将芯片电耦合到外部电路的情况，凸起耦合部分和接合焊盘都设置在单个最上面的布线 层。 当使用凸起电极时，在凸块接合部分上的绝缘膜中设置开口，并且用绝缘膜覆盖焊盘的表面。 另一方面，当使用接合线时，在接合焊盘上的绝缘膜中设置开口，并且凸起接合部的表面被绝缘膜覆盖。
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公开(公告)号：US20090212425A1
公开(公告)日：2009-08-27
申请号：US12367297
申请日：2009-02-06
IPC分类号： H01L23/498 , H01L21/60 , H01L21/78
CPC分类号： H01L23/5286 , H01L22/32 , H01L23/522 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/12 , H01L24/48 , H01L24/49 , H01L27/0251 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05552 , H01L2224/05553 , H01L2224/05599 , H01L2224/05624 , H01L2224/13099 , H01L2224/1411 , H01L2224/16 , H01L2224/48227 , H01L2224/48463 , H01L2224/49171 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/1306 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A technique is provided which allows a chip mounted by wire bonding and a chip mounted by bump electrodes to share a manufacturing process. Both in a case where a chip is electrically coupled to an external circuit by bump electrodes and a case where the chip is electrically coupled to the external circuit by bonding wires, a bump coupling part and a bonding pad are both provided in a single uppermost wiring layer. When the bump electrodes are used, an opening is provided in an insulating film on the bump coupling part and a surface of the bonding pad is covered with the insulating film. On the other hand, when the bonding wires are used, an opening is provided in an insulating film on the bonding pad and a surface of the bump coupling part is covered with the insulating film.
摘要翻译： 提供了一种技术，其允许通过引线接合安装的芯片和由凸块电极安装的芯片共享制造工艺。 在通过凸块电极将芯片电耦合到外部电路的情况下，以及通过接合线将芯片电耦合到外部电路的情况，凸起耦合部分和接合焊盘都设置在单个最上面的布线 层。 当使用凸起电极时，在凸块接合部分上的绝缘膜中设置开口，并且用绝缘膜覆盖焊盘的表面。 另一方面，当使用接合线时，在接合焊盘上的绝缘膜中设置开口，并且凸起接合部的表面被绝缘膜覆盖。
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公开(公告)号：US5766822A
公开(公告)日：1998-06-16
申请号：US733450
申请日：1996-10-18
申请人： Nobuaki Inoue , Toshihide Ezoe , Takashi Hoshimiya , Kazumi Nii , Kazunobu Katoh , Tetsuo Yamaguchi , Hisashi Okamura
发明人： Nobuaki Inoue , Toshihide Ezoe , Takashi Hoshimiya , Kazumi Nii , Kazunobu Katoh , Tetsuo Yamaguchi , Hisashi Okamura
摘要： A silver halide photographic material comprising a support having thereon at least one light-sensitive silver halide hydrophilic colloid emulsion layer, at least one light-insensitive hydrophilic colloid layer interposed between the support and at least one silver halide emulsion layer, and at least one hydrazine derivative selected from the group consisting of compounds represented by the general formula (1) and (2) contained in the at least one of hydrophilic colloid layers provided in the same side of the support as that coated with the light-sensitive silver halide hydrophilic colloid emulsion layer: ##STR1## wherein their substituents are defined in the specification.
摘要翻译： 一种卤化银照相材料，其包括其上具有至少一种感光卤化银亲水胶体乳剂层的支持物，插入在所述载体和至少一种卤化银乳剂层之间的至少一种不透光的亲水胶体层和至少一种肼 选自由通式（1）和（2）表示的化合物的衍生物，所述化合物包含在与涂覆有感光卤化银亲水胶体的载体相同侧面上的亲水胶体层中的至少一种中 乳剂层：其中它们的取代基在说明书中定义。
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公开(公告)号：US5478697A
公开(公告)日：1995-12-26
申请号：US400292
申请日：1995-03-06
申请人： Minoru Sakai , Kazunobu Katoh , Hisashi Okamura
发明人： Minoru Sakai , Kazunobu Katoh , Hisashi Okamura
CPC分类号： G03C1/061
摘要： Silver halide photographic material is disclosed, which has provided on a support at least one silver halide emulsion layer which comprises silver halide grains containing a silver chloride of 50 mol % or more and at least one emulsion layer and other hydrophilic colloid layers contain at least one hydrazine derivative and at least one phosphonium salt compound.
摘要翻译： 公开了卤化银照相材料，其在载体上提供至少一种卤化银乳剂层，其包含含有50摩尔％以上的氯化银的卤化银颗粒和至少一种乳剂层，以及其它亲水胶体层含有至少一种 肼衍生物和至少一种鏻盐化合物。
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公开(公告)号：US5447835A
公开(公告)日：1995-09-05
申请号：US167219
申请日：1993-12-16
申请人： Minoru Sakai , Kazunobu Katoh , Hisashi Okamura , Kazumi Nii
发明人： Minoru Sakai , Kazunobu Katoh , Hisashi Okamura , Kazumi Nii
CPC分类号： G03C1/061 , G03C7/30511 , Y10S430/158
摘要： Disclosed is a silver halide photographic material comprising a support having thereon a silver halide emulsion layer containing at least one nucleating agent represented by general formula (N-1) shown below. The silver halide photographic material contains at least one compound represented by general formula (Q-2) shown below in the above described silver halide emulsion layer and/or in a hydrophilic colloid layer adjacent thereto which does not contain a silver halide emulsion: ##STR1## The variable terms in the above formulas are defined in the specification. The silver halide photographic material is suitable for plate making and provides a high contrast image even when using a highly stable developing solution.
摘要翻译： 公开了一种卤化银照相材料，其包括其上具有卤化银乳剂层的载体，所述卤化银乳剂层含有至少一种由下述通式（N-1）表示的成核剂。 卤化银照相材料在上述卤化银乳剂层和/或不含卤化银乳剂的亲水胶体层中含有至少一种下述通式（Q-2）表示的化合物：
（Q-2）上述公式中的变量项在规范中定义。 卤化银照相材料适用于制版，即使使用高度稳定的显影液也能提供高对比度的图像。
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