摘要:
A redundancy circuit in a semiconductor memory device having a multiblock structure in which a memory cell array is classified into a plurality of memory cell blocks, an integrated redundancy circuit having a plurality of fuse boxes for storing, per block, addresses of defective memory cells provided in the plurality of memory cell blocks, the plurality of fuse boxes being connected to the common precharge unit and being selectively activated in response to a block distinction selection signal.
摘要:
A method for programming a phase-change memory array and circuit of a phase-change memory device, each having a plurality of phase-change memory cells, may enable all the phase-change memory cells therein to be changed or set at a set resistance state, and may reduce the time needed to change the phase-change memory array to the set resistance state. In the method, a set current pulse having first through nth stages may be applied to the cells of the array to change the cells to the set resistance state. A minimum current level of the set current pulse applied to the phase-change memory cells in any stage may be higher than a reference current level for the cells of the array. A given current level of the set current pulse may be sequentially reduced from stage to stage.
摘要:
A semiconductor memory device employs a power supply system in which a first power supply voltage supplied to a cell area is separated from a second power supply voltage supplied to a peripheral circuit area. Particularly, during a wafer burn-in test operation mode, the first power supply voltage supplied to the cell area is higher than the second power supply voltage supplied to the peripheral circuit area. If a wafer burn-in test operation is performed under the second power supply system, a DC current path formed by a latch-up phenomenon of a memory cell can be shut off.
摘要:
A static random access memory (SRAM) device comprises an array of memory cells, a plurality of bit line precharge circuit for selectively delivering current to bit lines in response to a pair of control signals, during normal and burn-in test modes, and a burn-in current source circuit for selectively delivering current to the memory cells selected by the word lines along with the precharge circuit, in response to the control signals, during the burn-in test mode. In burn-in write operation, memory cells can be supplied with enough cell current without large increasing of chip size and power consumption in normal operation mode.
摘要:
The present invention pertains to semiconductor memory devices and more particularly to a burn-in circuit of such devices and burn-in method which improve reliability of a static random access memory RAM. The semiconductor memory device according to the present invention, which includes a memory cell array in which a plurality of memory cells are stored in the directions of row and column, a row decoder for selecting the row of the memory cell array, and a column decoder for selecting the column of the memory cell array, comprises an input/output line control circuit formed between a data input/output pin disposed on the same chip and the column of the memory cell array for transmitting data inputted/outputted through the data input/output pin, a read/write control circuit for supplying a signal which controls input/output of data in the memory cell array to the input/output line control circuit, and a burn-in control circuit for inputting the output signal of the read/write control circuit, supplying a burn-in signal responsive to the data input through the input/output line control circuit to the row decoder and column decoder, and enabling a burn-in test of the same chip after a package process.
摘要:
A phase-change cell memory device includes a plurality of phase-change memory cells, an address circuit, a write driver, and a write driver control circuit. The phase-change memory cells each include a volume of material that is programmable between amorphous and crystalline states. The address circuit selects at least one of the memory cells, and the write driver generates a reset pulse current to program a memory cell selected by the address circuit into the amorphous state, and a set pulse current to program the memory cell selected by the address circuit into the crystalline state. The write driver control circuit varies at least one of a pulse width and a pulse count of at least one of the reset and set pulse currents according to a load between the write driver and the memory cell selected by the address circuit.
摘要:
A true bit line can extend across a memory cell area of the memory device in a first direction and a complementary bit line can extend across the memory cell area in a second direction opposing the first direction, wherein the true bit line and the complementary bit line comprising a bit line pair.
摘要:
A write driver circuit including a plurality of programmable fuses for a phase change memory device in which a write operation is correctly performed even in the case where a current output shift in a write current generation circuit; or in the case where a phase change memory cell having a phase change property shift due to an external factor or due a process change. The write driver circuit includes a write current control unit for outputting a first or second level of voltage selected, by selecting one of a first or second programmable current path, based on whether a first or second selection pulse signal is applied; and a current driving unit for generating a write current controlled by the output voltage of the write current control unit. Each of the first and second programmable current paths includes fuses that can be programmed to adjust their resistance to adjust the respective selected output voltage to compensate for the current output shift in the write current generation circuit or for the phase change memory cell having the phase change property shift.
摘要:
A redundancy circuit in a semiconductor memory device having a multiblock structure in which a memory cell array is classified into a plurality of memory cell blocks, an integrated redundancy circuit having a plurality of fuse boxes for storing, per block, addresses of defective memory cells provided in the plurality of memory cell blocks, the plurality of fuse boxes being connected to the common precharge unit and being selectively activated in response to a block distinction selection signal.
摘要:
A semiconductor memory device having memory cells connected with pairs of bit lines and word lines comprises a pre-charging part for pre-charging a pair of bit lines in response to a first state control signal at a stand-by mode of the semiconductor memory device; a bit line charging control part for generating a second state control signal to the pre-charging part when a stand-by current failure occurs due to defect in the pair of bit lines, wherein the second state control signal is independent of a pre-charge relating signal externally applied and the pre-charging part cuts-off a supply voltage from being applied to the pair of bit lines with defect; and a bit line floating prevent part for compensatively fixing potential values of the pair of bit lines with defect so that a cell supply voltage is prevented from being applied to the pair of bit lines with defect at a memory access mode of the semiconductor memory device, so that a hard type defect like a stand-by current failure can be repaired regardless of a logic state of a pre-charge control signal, thereby reducing the probability of occurrence of defect in a semiconductor memory device.