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公开(公告)号：US20130082340A1
公开(公告)日：2013-04-04
申请号：US13629659
申请日：2012-09-28
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Klaus Elian , Georg Ernst , Horst Theuss
CPC classification number: G01R33/072 , G01D5/147 , G01R33/06 , G01R33/091
Abstract: An apparatus may include a back-bias magnet; and a semiconductor chip element; wherein the semiconductor chip element has a sensor for measuring a magnetic field strength; and wherein a contact surface is formed on a contact side of the back-bias magnet and on a contact side of the semiconductor chip element and wherein the contact side of the semiconductor chip element has one or more structures such that the contact surface of the back-bias magnet is shaped in a manner corresponding to the structures of the semiconductor chip element.
Abstract translation: 设备可以包括背偏磁体; 和半导体芯片元件; 其中所述半导体芯片元件具有用于测量磁场强度的传感器; 并且其中在所述背偏压磁体的接触侧和所述半导体芯片元件的接触侧上形成接触表面，并且其中所述半导体芯片元件的接触侧具有一个或多个结构，使得所述背面的接触表面 -bias磁体以对应于半导体芯片元件的结构的方式成形。
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公开(公告)号：US12210706B2
公开(公告)日：2025-01-28
申请号：US17850026
申请日：2022-06-27
Applicant: Infineon Technologies AG
Inventor： Rainer Markus Schaller , Jochen Dangelmaier , Klaus Elian , Horst Theuss
Abstract: An ultrasonic touch sensor is proposed for attachment to a casing, having a semiconductor chip including a substrate side and a component side, the semiconductor chip including an ultrasonic transducer element and the ultrasonic transducer element being arranged on the component side, having an acoustic coupling medium covering the semiconductor chip at least in the region of the ultrasonic transducer element, having electrical contact elements for controlling the ultrasonic transducer element, and the electrical contact elements being arranged on the component side of the semiconductor chip.
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公开(公告)号：US12158448B2
公开(公告)日：2024-12-03
申请号：US18050178
申请日：2022-10-27
Applicant: Infineon Technologies AG
Inventor： Derek Debie , Klaus Elian , Ludwig Heitzer , David Tumpold , Jens Pohl , Cyrus Ghahremani , Thorsten Meyer , Christian Geissler , Andreas Allmeier
Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.
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公开(公告)号：US12122667B2
公开(公告)日：2024-10-22
申请号：US18467897
申请日：2023-09-15
Applicant: Infineon Technologies AG
Inventor： Rainer Markus Schaller , Klaus Elian , Horst Theuss
CPC classification number: B81B7/0051 , B81C1/00325 , B81B2203/033 , B81B2207/07 , B81B2207/096 , B81C2203/0118
Abstract: A method for producing sensor devices includes generating a semiconductor wafer having a plurality of sensor chips, wherein each sensor chip comprises a micro-electromechanical systems (MEMS) structure arranged at a main surface of the semiconductor wafer; forming a plurality of gas-permeable covers over the main surface of the semiconductor wafer, wherein each gas-permeable cover covers a corresponding MEMS structure of the MEMS structures and forms a cavity above the corresponding MEMS structure; and singulating the semiconductor wafer into a plurality of sensor devices.
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公开(公告)号：US12079431B1
公开(公告)日：2024-09-03
申请号：US18466476
申请日：2023-09-13
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Derek Debie , Fabian Streb
IPC: G06F3/043 , B06B1/02 , B06B1/06 , F21K9/64 , F21V9/40 , F21V23/04 , F21Y103/10 , F21Y107/90 , F21Y113/13 , F21Y115/10
CPC classification number: G06F3/0436 , B06B1/0292 , B06B1/0666 , F21K9/64 , F21V9/40 , F21V23/0485 , B06B2201/55 , F21Y2103/10 , F21Y2107/90 , F21Y2113/13 , F21Y2115/10
Abstract: An ultrasonic touch sensor includes a housing having a package cavity; an ultrasonic transmitter arranged within the package cavity, and configured to transmit an ultrasonic transmit wave; an ultrasonic receiver arranged within the package cavity, and configured to receive an ultrasonic reflected wave produced by a reflection of the ultrasonic transmit wave and generate a measurement signal representative of the ultrasonic reflected wave; a measurement circuit arranged within the package cavity and coupled to the ultrasonic receiver, and configured to detect a touch or a non-touch based on the measurement signal; a light source configured to produce an activating light; and a coupling medium that fills or at least partially fills the package cavity. The coupling medium includes a luminescent material that is configured to be activated by the activating light to produce a backlight that is emitted from the package cavity.
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Patent Agency Ranking
公开(公告)号：US12040543B2
公开(公告)日：2024-07-16
申请号：US17648730
申请日：2022-01-24
Applicant: Infineon Technologies AG
Inventor： Walter Hartner , Tuncay Erdoel , Klaus Elian , Christian Geissler , Bernhard Rieder , Rainer Markus Schaller , Horst Theuss , Maciej Wojnowski
CPC classification number: H01Q13/06 , H01Q1/2283 , H01Q1/526 , H01Q23/00
Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.
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公开(公告)号：US11410942B2
公开(公告)日：2022-08-09
申请号：US16935459
申请日：2020-07-22
Applicant: Infineon Technologies AG
Inventor： Jochen Dangelmaier , Klaus Elian
IPC: H01L23/00 , H01L23/31 , H01L21/48 , H01L21/56 , H01L23/495
Abstract: A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, and an encapsulant encapsulating at least part of the electronic component and only part of the carrier so that another exposed part of the carrier is exposed with regard to the encapsulant. The exposed part of the carrier comprises an electric connection structure and a corrosion protection structure. One of the electric connection structure and the corrosion protection structure is selectively formed on only a sub-portion of the other one of the electric connection structure and the corrosion protection structure outside of the encapsulant.
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公开(公告)号：US10515879B2
公开(公告)日：2019-12-24
申请号：US15992958
申请日：2018-05-30
Applicant: Infineon Technologies AG
Inventor： Manfred Schindler , Klaus Elian , Volker Strutz , Horst Theuss , Michael Weber
IPC: H01L23/495 , H01L23/31
Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.
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公开(公告)号：US20180350727A1
公开(公告)日：2018-12-06
申请号：US15992958
申请日：2018-05-30
Applicant: Infineon Technologies AG
Inventor： Manfred Schindler , Klaus Elian , Volker Strutz , Horst Theuss , Michael Weber
IPC: H01L23/495 , H01L23/31
Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.
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公开(公告)号：US09817079B2
公开(公告)日：2017-11-14
申请号：US14336305
申请日：2014-07-21
Applicant: Infineon Technologies AG
Inventor： Choo Tian Ooi , Chew Theng Tai , Klaus Elian , Mohd Hirzarul Hafiz Mohd Tahir
CPC classification number: G01R33/0047 , G01R33/0052 , H01L2224/48091 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
Abstract: A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound encasing the sensor die and attaching the magnet to the leadframe. A method of manufacturing the molded sensor package includes loading the magnet and the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool, molding the magnet and the sensor die with the same molding compound while loaded in the molding tool and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die.
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