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    APPARATUS FOR INSPECTION OF A PACKAGE ASSEMBLY WITH A THERMAL SOLUTION
    41.
    发明申请
    APPARATUS FOR INSPECTION OF A PACKAGE ASSEMBLY WITH A THERMAL SOLUTION 审中-公开

    公开(公告)号：US20190067135A1

    公开(公告)日：2019-02-28

    申请号：US15685772

    申请日：2017-08-24

    Applicant: Intel Corporation

    Inventor： Aastha Uppal ,  Je-Young Chang ,  Shankar Devasenathipathy ,  Joseph B. Petrini

    IPC: H01L21/66 ,  G01K7/22 ,  H01L23/498

    Abstract: Embodiments of the present disclosure provide techniques and configurations for inspection of a package assembly with a thermal solution, in accordance with some embodiments. In embodiments, an apparatus for inspection of a package assembly with a thermal solution may include a first fixture to house the package assembly on the apparatus, and a second fixture to house at least a portion of a thermal solution that is to be disposed on top of the package assembly. The apparatus may further include a load actuator, to apply a load to a die of the package assembly, via the thermal solution, and a plurality of sensors disposed around the thermal solution and the package assembly, to perform in situ thermal and/or mechanical measurements associated with the application of the load to the die of the package assembly. Other embodiments may be described and/or claimed.

    Hybrid interposer of glass and silicon to reduce thermal crosstalk
    44.
    发明授权
    Hybrid interposer of glass and silicon to reduce thermal crosstalk 有权

    公开(公告)号：US12191220B2

    公开(公告)日：2025-01-07

    申请号：US16659395

    申请日：2019-10-21

    Applicant: Intel Corporation

    Inventor： Zhimin Wan ,  Chandra Mohan Jha ,  Je-Young Chang ,  Chia-Pin Chiu

    IPC: H01L23/15 ,  H01L23/00 ,  H01L23/373 ,  H01L23/498 ,  H01L25/18

    Abstract: Embodiments include semiconductor packages. A semiconductor package includes a hybrid interposer with a first region and a second region. The first region is comprised of glass or low thermal conductive materials, and the second region is comprised of silicon or diamond materials. The semiconductor package includes a first die on the first region of the hybrid interposer, a second die on the second region of the hybrid interposer, and an integrated heat spreader over the first die, the second die, and the hybrid interposer. The hybrid interposer includes first and second interconnects, where the first interconnects vertically extend from a bottom surface of the first region to a top surface of the first region, and where the second interconnects vertically extend from a bottom surface of the second region to a top surface of the second region. The first interconnects are through-glass vias, and the second interconnects are through-silicon vias.

    Integrated circuit assemblies having metal foam structures
    47.
    发明授权
    Integrated circuit assemblies having metal foam structures 有权

    公开(公告)号：US11721607B2

    公开(公告)日：2023-08-08

    申请号：US16750213

    申请日：2020-01-23

    Applicant: INTEL CORPORATION

    Inventor： Aastha Uppal ,  Je-Young Chang

    IPC: H01L23/42 ,  H01L21/56

    CPC classification number: H01L23/42 ,  H01L21/56

    Abstract: An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a heat dissipation device, a thermal interface material between the at least one integrated circuit device and the heat dissipation device, and a metal foam surrounding the at least one integrated circuit device and contacting the thermal interface material. The integrated circuit assembly may further include a stiffener attached to the electronic substrate and surrounding the at least one integrated circuit device, wherein the metal foam is disposed between the stiffener, the at least one integrated circuit device, the electronic substrate, and the heat dissipation device.

    Standoff members for semiconductor package
    49.
    发明授权
    Standoff members for semiconductor package 有权

    公开(公告)号：US11469185B2

    公开(公告)日：2022-10-11

    申请号：US16465907

    申请日：2017-11-27

    Applicant: Intel Corporation

    Inventor： Je-Young Chang ,  Shubhada H. Sahasrabudhe ,  Tannaz Harirchian

    IPC: H01L23/00 ,  H01L21/48 ,  H01L23/16 ,  H01L23/04 ,  H01L25/065 ,  H01L23/42 ,  H01L23/10 ,  H01L23/40 ,  H01L23/498 ,  H01L23/367 ,  H01L23/427

    Abstract: Semiconductor packages having support members are provided. Support members can mitigate damage to a semiconductor die mounted on a semiconductor package. In some embodiments, an arrangement of support packages can be formed at respective locations of a frame layer that serves as a stiffener for the semiconductor package. Each support member in the arrangement can be formed from a same material of the frame layer or a different material. In some embodiments, a support member can be mounted or otherwise coupled to an exposed surface of the frame layer. In addition or in other embodiments, a support member can be mounted on a surface that supports the semiconductor die. The arrangement of support members can include support members comprising a first material and/or other support members formed from respective materials. A support member can be formed from a metal, a metal alloy, a semiconductor, a polymer, a composite material, or a porous material.

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