RING RESONATORS HAVING Si AND/OR SiN WAVEGUIDES
    41.
    发明申请
    RING RESONATORS HAVING Si AND/OR SiN WAVEGUIDES 审中-公开
    具有Si和/或SiN波长的环形谐振器

    公开(公告)号:US20130156369A1

    公开(公告)日:2013-06-20

    申请号:US13535746

    申请日:2012-06-28

    CPC classification number: G02B6/12007 G02B2006/12061

    Abstract: Provided is a ring resonator including first and second waveguides disposed spaced apart from each other, on a substrate, and at least one channel including at least one ring waveguide arranged in a row between the first and second waveguides. The first and second waveguides and the ring waveguide may be formed of silicon, a width of the ring waveguide may range from 0.7 μm to 1.5 μm, a height of the ring waveguide may range from 150 nm to 300 nm, and a space between the first and second waveguides and the ring waveguide most adjacent thereto may range from 250 nm to 1 mm.

    Abstract translation: 提供了一种环形谐振器,包括彼此间隔开地布置在衬底上的第一和第二波导,以及包括在第一和第二波导之间布置成一行的至少一个环形波导的至少一个通道。 第一和第二波导和环形波导可以由硅形成,环形波导的宽度可以在0.7μm到1.5μm的范围内,环形波导的高度可以在150nm到300nm的范围内, 第一和第二波导以及与其最相邻的环形波导可以在250nm至1mm的范围内。

    Oscillation circuit based on metal-insulator transition device and method of driving the oscillation circuit
    42.
    发明申请
    Oscillation circuit based on metal-insulator transition device and method of driving the oscillation circuit 审中-公开
    基于金属 - 绝缘体转换器件的振荡电路及驱动振荡电路的方法

    公开(公告)号:US20110304403A1

    公开(公告)日:2011-12-15

    申请号:US13137267

    申请日:2011-08-02

    CPC classification number: H01L49/003 H01L29/94 H03B17/00

    Abstract: Provided are an oscillatory circuit based on a metal-insulator transition (MIT) device that can generate a simple and very high oscillating frequency using the MIT device, and a method of driving the oscillatory circuit. The oscillatory circuit includes the MIT device that comprises an MIT thin film and an electrode thin film connected to the MIT thin film and in which an abrupt MIT is generated due to an MIT generating voltage, a resistor that is serially connected to the MIT device, an electrical power source limiting the maximum amount of an applied current and applying a direct current constant voltage to the MIT device, and a light source irradiating electromagnetic waves on the MIT device, wherein the oscillating properties are generated by irradiating the electromagnetic waves using the light source.

    Abstract translation: 提供了一种基于金属 - 绝缘体转变(MIT)器件的振荡电路,其可以使用MIT器件产生简单且非常高的振荡频率,以及驱动振荡电路的方法。 振荡电路包括MIT设备,其包括MIT薄膜和连接到MIT薄膜的电极薄膜,并且其中由于MIT产生电压而产生突然MIT;串联连接到MIT设备的电阻器, 限制施加电流的最大量并向MIT装置施加直流恒定电压的电源,以及在MIT装置上照射电磁波的光源,其中通过使用光照射电磁波来产生振荡特性 资源。

    Oscillation circuit based on metal-insulator transition device and method of driving the oscillation circuit
    43.
    发明授权
    Oscillation circuit based on metal-insulator transition device and method of driving the oscillation circuit 失效
    基于金属 - 绝缘体转换器件的振荡电路及驱动振荡电路的方法

    公开(公告)号:US08031021B2

    公开(公告)日:2011-10-04

    申请号:US12516105

    申请日:2007-10-31

    CPC classification number: H01L49/003 H01L29/94 H03B17/00

    Abstract: Provided are an oscillatory circuit based on a metal-insulator transition (MIT) device that can generate a simple and very high oscillating frequency using the MIT device, and a method of driving the oscillatory circuit. The oscillatory circuit includes the MIT device that comprises an MIT thin film and an electrode thin film connected to the MIT thin film and in which an abrupt MIT is generated due to an MIT generating voltage, a resistor that is serially connected to the MIT device, an electric al power source limiting the maximum amount of an applied current and applying a direct current constant voltage to the MIT device, and a light source irradiating electromagnetic waves on the MIT device, wherein the oscillating properties are generated by irradiating the electromagnetic waves using the light source.

    Abstract translation: 提供了一种基于金属 - 绝缘体转变(MIT)器件的振荡电路,其可以使用MIT器件产生简单且非常高的振荡频率,以及驱动振荡电路的方法。 振荡电路包括MIT设备,其包括MIT薄膜和连接到MIT薄膜的电极薄膜,并且其中由于MIT产生电压而产生突然MIT;串联连接到MIT设备的电阻器, 限制施加电流的最大量并向MIT装置施加直流恒定电压的电动电源以及在MIT装置上照射电磁波的光源,其中振荡特性是通过使用 光源。

    SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
    44.
    发明申请
    SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME 有权
    半导体器件及其形成方法

    公开(公告)号:US20110133306A1

    公开(公告)日:2011-06-09

    申请号:US12788542

    申请日:2010-05-27

    CPC classification number: H01L21/7624 H01L21/76243 H01L21/76264 H01L29/0657

    Abstract: Provided are a semiconductor device and a method of forming the same. According to the method, a first buried oxide layer is locally formed in a semiconductor substrate and a core semiconductor pattern of a line form, a pair of anchor-semiconductor patterns and a support-semiconductor pattern are formed by patterning a semiconductor layer on the first buried oxide layer to expose the first buried oxide layer. The pair of anchor-semiconductor patterns contact both ends of the core semiconductor pattern, respectively, and the support-semiconductor pattern contacts one sidewall of the core semiconductor pattern, the first buried oxide layer below the core semiconductor pattern is removed. At this time, a portion of the first buried oxide layer below each of the anchor-semiconductor patterns and a portion of the first buried oxide layer below the support-semiconductor pattern remain. A second buried oxide layer is formed to fill a region where the first buried oxide layer below the core semiconductor pattern.

    Abstract translation: 提供半导体器件及其形成方法。 根据该方法,在半导体衬底中局部地形成第一掩埋氧化物层,并且通过在第一衬底上图案化半导体层来形成线形式的芯半导体图案,一对锚半导体图案和支撑半导体图案 埋入氧化物层以暴露第一掩埋氧化物层。 一对锚半导体图案分别接触芯半导体图案的两端,并且支撑半导体图案接触芯半导体图案的一个侧壁,去除芯半导体图案下方的第一掩埋氧化物层。 此时,保留在半导体图案的每一个下面的第一掩埋氧化物层的一部分和位于载体半导体图案之下的第一掩埋氧化物层的一部分。 形成第二掩埋氧化物层以填充在芯半导体图案之下的第一掩埋氧化物层的区域。

    MONOLITHIC INTEGRATED COMPOSITE DEVICE HAVING SILICON INTEGRATED CIRCUIT AND SILICON OPTICAL DEVICE INTEGRATED THEREON, AND FABRICATION METHOD THEREOF
    45.
    发明申请
    MONOLITHIC INTEGRATED COMPOSITE DEVICE HAVING SILICON INTEGRATED CIRCUIT AND SILICON OPTICAL DEVICE INTEGRATED THEREON, AND FABRICATION METHOD THEREOF 有权
    具有硅集成电路的单片集成复合器件及其集成的硅光学器件及其制造方法

    公开(公告)号:US20100044828A1

    公开(公告)日:2010-02-25

    申请号:US12441377

    申请日:2007-04-03

    CPC classification number: H01L27/144 H01L2924/0002 H01L2924/00

    Abstract: Provided is a monolithic integrated composite device including: a silicon substrate which is partitioned into a silicon integrated circuit forming region and a silicon optical device forming region; a buried oxide layer which is formed locally in the silicon substrate of the silicon optical device forming region and isolates unit devices of the silicon optical device forming region; an overlay layer formed locally on the buried oxide layer; a silicon optical device formed in the silicon optical device forming region using the silicon overlay layer; a silicon integrated circuit formed in the silicon integrated circuit forming region of the silicon substrate; and wiring connecting the silicon integrated circuit and the silicon optical device or connecting the silicon optical devices or connecting the silicon integrated circuits.

    Abstract translation: 提供了一种单片集成复合器件,包括:分隔成硅集成电路形成区域的硅衬底和硅光学器件形成区域; 在硅光学器件形成区域的硅衬底中局部形成的掩埋氧化物层,并隔离硅光学器件形成区域的单元器件; 在掩埋氧化物层上局部形成的覆盖层; 使用所述硅覆盖层形成在所述硅光学器件形成区域中的硅光学器件; 形成在硅衬底的硅集成电路形成区域中的硅集成电路; 以及连接硅集成电路和硅光学器件或连接硅光学器件或连接硅集成电路的布线。

    SEMICONDUCTOR INTEGRATED CIRCUITS INCLUDING GRATING COUPLER FOR OPTICAL COMMUNICATION AND METHODS OF FORMING THE SAME
    46.
    发明申请
    SEMICONDUCTOR INTEGRATED CIRCUITS INCLUDING GRATING COUPLER FOR OPTICAL COMMUNICATION AND METHODS OF FORMING THE SAME 审中-公开
    半导体集成电路,包括用于光通信的光栅耦合器及其形成方法

    公开(公告)号:US20090154871A1

    公开(公告)日:2009-06-18

    申请号:US12117708

    申请日:2008-05-08

    CPC classification number: G02B6/34 G02B6/124 G02B6/30

    Abstract: Provided are semiconductor integrated circuits including a grating coupler for optical communication and methods of forming the same. The semiconductor integrated circuit includes: a cladding layer disposed on a semiconductor substrate; a grating coupler including an optical waveguide on the cladding layer and a grating on the optical waveguide; and at least one reflector formed in the cladding layer below the grating.

    Abstract translation: 提供了包括用于光通信的光栅耦合器的半导体集成电路及其形成方法。 半导体集成电路包括:设置在半导体衬底上的覆层; 包括在所述包层上的光波导的光栅耦合器和所述光波导上的光栅; 以及形成在光栅下方的包覆层中的至少一个反射器。

    OPTICAL CONNECTOR AND OPTICAL DEVICE HAVING THE SAME
    48.
    发明申请
    OPTICAL CONNECTOR AND OPTICAL DEVICE HAVING THE SAME 有权
    光学连接器和具有该光学连接器的光学器件

    公开(公告)号:US20120263411A1

    公开(公告)日:2012-10-18

    申请号:US13443843

    申请日:2012-04-10

    Abstract: Provided are an optical connector capable of improving optical alignment efficiency and an optical device having the same. The connector may include a body having a top surface and a bottom surface facing each other, through holes penetrating the body to connect the top and bottom surfaces, and alignment keys provided on at least side surface of the body to be parallel to the through holes.

    Abstract translation: 提供能够提高光取向效率的光连接器和具有该光连接器的光学装置。 连接器可以包括具有顶表面和底表面彼此面对的主体,穿过穿过主体以连接顶表面和底表面的孔以及设置在主体的至少侧表面上以与通孔平行的对准键 。

    OPTICAL CONNECTOR AND OPTICAL APPARATUS HAVING THE SAME
    49.
    发明申请
    OPTICAL CONNECTOR AND OPTICAL APPARATUS HAVING THE SAME 审中-公开
    光学连接器和具有该光学连接器的光学设备

    公开(公告)号:US20110243507A1

    公开(公告)日:2011-10-06

    申请号:US12886848

    申请日:2010-09-21

    CPC classification number: G02B6/30 G02B6/34 G02B6/3885 G02B2006/12107

    Abstract: Provided are an optical connector and an optical apparatus having the same. The optical connector comprises a substrate, at least one optical waveguide, an optical coupler, and a ferrule alignment unit. The at least one optical waveguide is formed on the substrate. The optical coupler is formed on the optical waveguide. The ferrule alignment unit allows a ferrule fixing optical fibers combined with the optical coupler to be aligned with the substrate.

    Abstract translation: 提供一种光连接器和具有该连接器的光学装置。 光学连接器包括基板,至少一个光波导,光耦合器和套圈对准单元。 所述至少一个光波导形成在所述基板上。 光耦合器形成在光波导上。 套圈对准单元允许与光耦合器组合的套圈固定光纤与衬底对准。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING OPTICAL DEVICES
    50.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING OPTICAL DEVICES 有权
    制造具有光学器件的半导体器件的方法

    公开(公告)号:US20110136318A1

    公开(公告)日:2011-06-09

    申请号:US12783216

    申请日:2010-05-19

    Abstract: Provided is a method of manufacturing a semiconductor device. According to the method, a first buried oxide layer is formed in the semiconductor substrate in a first region, such that a first semiconductor layer is defined on the first buried oxide layer. An active portion is defined by forming a trench in the semiconductor substrate in a second region. A capping semiconductor pattern is formed on a top surface and an upper portion of a sidewall of the active portion. An oxide layer is formed by oxidizing the capping semiconductor pattern and an exposed lower portion of the sidewall of the active portion, such that the oxide layer surrounds a non-oxidized portion of the active portion. The non-oxidized portion of the active portion is a core and one end of the core is connected to a first optical device formed at the first semiconductor.

    Abstract translation: 提供一种制造半导体器件的方法。 根据该方法,在第一区域中的半导体衬底中形成第一掩埋氧化物层,使得第一半导体层被限定在第一掩埋氧化物层上。 通过在第二区域中在半导体衬底中形成沟槽来限定有源部分。 在有源部分的侧壁的顶表面和上部形成封盖半导体图案。 通过氧化覆盖半导体图案和有源部分的侧壁的暴露下部来形成氧化物层,使得氧化物层包围有源部分的未氧化部分。 有源部分的未氧化部分是芯,并且芯的一端连接到形成在第一半导体处的第一光学器件。

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