摘要:
A method for determining a reliable gate oxide thickness for a transistor involves subjecting test transistors to an alternating current (AC) voltage until the test transistors break down. The breakdown times of the test transistors are measured and correlated with the corresponding gate oxide thickness of the test transistor to form a reliability model of the transistor. The reliable gate oxide thickness is determined by extrapolating the reliability model out to a predetermined period of time for which reliability is desired, for example, ten years.
摘要:
A method of forming a NAND-type flash memory device (200) includes forming a stacked gate flash memory structure (346) for one or more flash memory cells in a core region (305) and forming a transistor structure having a first gate oxide (336) and a gate conductor (338) for both a select gate transistor (344) in the core region (305) and a low voltage transistor (342) in a periphery region (328). In addition, a NAND-type flash memory device (200) includes a core region (305) comprising a stacked gate flash memory cell structure (346) and a select gate transistor (344) and a periphery region (328, 332) comprising a low voltage transistor (342) and a high voltage transistor (350), wherein a structure of the select gate transistor (344) and the low voltage transistor (342) are substantially the same.
摘要:
A method for forming a set of p-channel devices with enhanced n-doping and penetration of boron into the channel region between the source and drain regions, thereby creating channel length independent p-channel threshold voltage behavior. Long channel and short channel transistors have approximately equal threshold voltages as (a) short channel effect is reduced with increased n-doping in short channel transistors (where boron penetration has little effect), and (b) the effects of boron penetration and increased n-doping are offset in longer channel transistors.
摘要:
A floating gate cell memory device, such as an EPROM or flash EEPROM, with improved discharge speed. A negative bias is applied to the effective substrate during discharge. The negative bias increases the electric field near the junction, thereby increasing the number of hot holes which can be injected to the floating gate, improving discharge speed.
摘要:
A method and system for providing at least one contact in a flash memory device is disclosed. The flash memory device includes a plurality of gate stacks and at lease one component including a polysilicon layer as a top surface. The method and system further include forming a silicide on the top surface of the polysilicon layer and providing an insulating layer covering the plurality of gate stacks, the at least one component and the silicide. The method and system also include etching the insulating layer to provide at least one contact hole. The insulating layer etching step uses the silicide as an etch stop layer to ensure that the insulating etching step does not etch through the polysilicon layer. The method and system also include filling the at least one contact hole with a conductor.
摘要:
A method and system for providing at least one contact in a flash memory device is disclosed. The flash memory device includes a plurality of gate stacks and at lease one component including a polysilicon layer as a top surface. The method and system further include forming a silicide on the top surface of the polysilicon layer and providing an insulating layer covering the plurality of gate stacks, the at least one component and the silicide. The method and system also include etching the insulating layer to provide at least one contact hole. The insulating layer etching step uses the silicide as an etch stop layer to ensure that the insulating etching step does not etch through the polysilicon layer. The method and system also include filling the at least one contact hole with a conductor.
摘要:
A NAND flash memory device incorporates a unique booster plate design. The booster plate is biased during read and program operations and the coupling to the floating gates in many cases reduces the voltage levels necessary to program and read the charge stored in the gates. The booster plate also shields against unwanted coupling between floating gates. Self boosting, local self boosting, and erase area self boosting modes used with the unique booster plate further improve read/write reliability and accuracy. A more compact and reliable memory device can hence be realized according to the present invention.
摘要:
A NAND flash memory device incorporates a unique booster plate design. The booster plate is biased during read and program operations and the coupling to the floating gates in many cases reduces the voltage levels necessary to program and read the charge stored in the gates. The booster plate also shields against unwanted coupling between floating gates. Self boosting, local self boosting, and erase area self boosting modes used with the unique booster plate further improve read/write reliability and accuracy. A more compact and reliable memory device can hence be realized according to the present invention.
摘要:
A method and apparatus for compensating a base current of a bipolar junction transistor by replicating operating conditions of the BJT in a compensating circuit. An output current of the compensating circuit is fractionally related to the base current and thus can be supplied to an operational circuit comprising the BJT to compensate the base current. In a preferred embodiment, the BJT is operated between BVCEO and BVCBO and the base current to be compensated flows from the BJT.
摘要:
A method of forming a trench isolation device capable of reducing corner recess comprising forming a pad oxide layer and a silicon nitride mask layer on a semiconductor base, and forming a trench by etching. Next, a liner oxide layer is formed on the semiconductor base and on the surface of the shallow trench. Then, the silicon nitride mask layer will be etched to reveal the corner. Finally, a layer of oxide is formed on the base to fill up the trench so that the trench isolation device can be completed. The present invention is designed to solve the corner recess problem, reduce generation of kick effect, and enhance the device characteristics and electrical quality.