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63 条记录 (耗时 0.048 秒)

    OPTICAL FIBER SHAPE SENSING SYSTEMS
    42.
    发明申请
    OPTICAL FIBER SHAPE SENSING SYSTEMS 有权
    光纤形状传感系统

    公开(公告)号：US20080285909A1

    公开(公告)日：2008-11-20

    申请号：US12106254

    申请日：2008-04-18

    申请人： Robert G. Younge ,  Bhaskar S. Ramamurthy ,  Neal A. Tanner ,  Randall L. Schlesinger ,  Eric Udd

    发明人： Robert G. Younge ,  Bhaskar S. Ramamurthy ,  Neal A. Tanner ,  Randall L. Schlesinger ,  Eric Udd

    IPC分类号： G02B6/00

    CPC分类号： G02B6/022 ,  A61B5/1076 ,  A61B5/6852 ,  A61B2017/00039 ,  A61B2017/00053 ,  A61B2034/2061 ,  A61B2090/067

    摘要： A medical instrument system includes an elongate flexible instrument body with an optical fiber substantially encapsulated in a wall of the instrument body, the optical fiber including one or more fiber gratings. A detector is operatively coupled to the optical fiber and configured to detect respective light signals reflected by the one or more fiber gratings. A controller is operatively coupled to the detector, and configured to determine a twist of at least a portion of the instrument body based on detected reflected light signals. The instrument may be a guide catheter and may be robotically or manually controlled.

    摘要翻译： 医疗仪器系统包括具有基本上封装在仪器主体的壁中的光纤的细长柔性仪器本体，所述光纤包括一个或多个光纤光栅。 检测器可操作地耦合到光纤并且被配置为检测由一个或多个光纤光栅反射的各个光信号。 控制器可操作地耦合到检测器，并且被配置为基于检测到的反射光信号来确定仪器主体的至少一部分的扭转。 仪器可以是引导导管，并且可以是机器人或手动控制的。

    Alignment of leads for ceramic integrated circuit packages
    43.
    发明授权
    Alignment of leads for ceramic integrated circuit packages 失效
    陶瓷集成电路封装的引线对准

    公开(公告)号：US4987475A

    公开(公告)日：1991-01-22

    申请号：US449518

    申请日：1989-12-05

    申请人： Randall L. Schlesinger ,  Kevin M. Eastman ,  Douglas F. Palino

    发明人： Randall L. Schlesinger ,  Kevin M. Eastman ,  Douglas F. Palino

    IPC分类号： H01L23/498

    CPC分类号： H01L23/49861 ,  H01L2924/0002 ,  Y10T29/49121

    摘要： An alignment system comprising a rectangular leadframe from the interior of which extend leads to terminations arrangement for alignment and registration with the braze pads of a ceramic integrated circuit package, the alignment and registration being maintained and defined by a web bar interconnecting the leads adjacent the between those braze pads and the leadframe. The leadframe, leads and web bar being integrally formed by etching and lying in a plane.

    摘要翻译： 一种对准系统，包括从其内部延伸的矩形引线框架将引线延伸到用于与陶瓷集成电路封装的钎焊焊盘对准和配准的端接装置，所述对准和配准由互连所述引线的互连条形网 那些铜焊盘和引线框架。 引线框架，引线和网板通过蚀刻和躺在一个平面中而整体形成。

    Medical diagnostic ultrasound catheter with dielectric isolation
    49.
    发明授权
    Medical diagnostic ultrasound catheter with dielectric isolation 有权
    医疗诊断超声导管与介质隔离

    公开(公告)号：US07232433B1

    公开(公告)日：2007-06-19

    申请号：US09401632

    申请日：1999-09-22

    申请人： Randall L. Schlesinger ,  Mathew Rahimi

    发明人： Randall L. Schlesinger ,  Mathew Rahimi

    IPC分类号： A61M25/00 ,  A61B8/00 ,  A61B8/14

    CPC分类号： A61B8/12 ,  A61B8/445 ,  A61M25/0032 ,  A61M25/005 ,  A61M2025/0034 ,  A61M2025/0036

    摘要： Medical diagnostic ultrasound catheters are provided with improved materials for dielectric withstand strength. In one aspect, the catheter includes a braid of non-conductive material. The non-conductive braid reduces the capacitive: coupling effects and allows smaller catheters or a greater number of conductors. The non-conductive braid provides both compressive and tensile strength to transmit the torque applied to the catheter. The non-conductive braid also allows fusing of components while decreasing the risk of defective manufacture. In another aspect, a dielectric film, such as a polyester film, is positioned between the transducer and any lens or window. The dielectric film allows thinner window lenses to be used, allowing smaller catheters or larger transducers. The dielectric film may also increase the sensitivity of the transducer to acoustic energy. The dielectric film prevents the lens or window material from filling kerfs in the transducer, which may eliminate the need for filling the kerfs of the transducer.

    摘要翻译： 医疗诊断超声导管提供改进的介电耐受强度材料。 在一个方面，导管包括非导电材料的编织物。 非导电编织物减少电容耦合效应，并允许更小的导管或更多数量的导体。 非导电编织物提供压缩和拉伸强度以传递施加到导管的扭矩。 非导电编织物还允许组件熔合，同时降低制造缺陷的风险。 另一方面，诸如聚酯膜之类的电介质膜位于换能器和任何透镜或窗口之间。 电介质膜允许使用更薄的窗透镜，允许较小的导管或更大的换能器。 电介质膜也可以增加换能器对声能的灵敏度。 电介质膜防止透镜或窗口材料在换能器中填充切口，这可能不需要填充换能器的切口。

    Method of mounting a tape automated bonded semiconductor in a housing using a compressor
    50.
    发明授权
    Method of mounting a tape automated bonded semiconductor in a housing using a compressor 失效
    使用压缩机将带状自动粘结半导体安装在壳体中的方法

    公开(公告)号：US5298464A

    公开(公告)日：1994-03-29

    申请号：US890984

    申请日：1992-05-29

    申请人： Randall L. Schlesinger ,  Ralph W. Doe ,  Richard D. Gates ,  Dennis P. Goddard ,  Shih C. Hsu

    发明人： Randall L. Schlesinger ,  Ralph W. Doe ,  Richard D. Gates ,  Dennis P. Goddard ,  Shih C. Hsu

    IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L21/52 ,  H01L21/58 ,  H01L21/603

    CPC分类号： H01L24/86 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  Y10T29/49121 ,  Y10T29/49126

    摘要： This invention resides in a curing process for adhesive on a housing member of a tape automated bonding section (TAB section). A force is applied to the housing member and then the entire TAB section is heated to a sufficient temperature and for a sufficient duration to cure the adhesive. The applied force, coupled with the heat squeezes a portion of the adhesive out from between the TAB section and the housing member and onto an inner portion of the outer leads before the adhesive cures. This embeds the inner portion of the outer leads with adhesive so that they are retained in alignment with and electrically isolated from each other.The manner in which the force is applied to the housing member during the curing process is also a novel feature of the invention. The TAB section within the carrier frame is placed on a pedestal in a mounting fixture. A compressor block is then disposed against the TAB section. A compressor bar clamped over the compressor block and to the mounting fixture urges the compressor block against the TAB section. This also causes a centrally-located spring loaded plunger within the compressor block to push against the semiconductor chip but with a reduced force. This reduced force presses the chip against a housing member aperture so that a silver epoxy mounted in the aperture can evenly disperse over the semiconductor chip.

    摘要翻译： 本发明涉及一种用于胶带自动粘合部分（TAB部分）的外壳部件上的粘合剂的固化方法。 将力施加到壳体构件，然后将整个TAB区段加热至足够的温度并持续足够的时间固化粘合剂。 在粘合剂固化之前，所施加的力与热量挤压粘合剂的一部分从TAB部分和壳体部件之间挤压到外部引线的内部。 这使得外部引线的内部部分用粘合剂嵌入，使得它们保持与彼此对齐并且彼此电隔离。 在固化过程中将力施加到壳体构件的方式也是本发明的新颖特征。 载体框架内的TAB部分放置在安装夹具中的基座上。 然后将压缩机块设置在TAB部分上。 夹紧在压缩机组件和安装夹具上的压缩机杆促使压缩机块抵靠TAB部分。 这也使得压缩机组件内的位于中心的弹簧加载柱塞推压半导体芯片但是具有减小的力。 这种减小的力将芯片压靠住壳体构件孔，使得安装在孔中的银环氧树脂可以均匀地分散在半导体芯片上。