Abstract:
The present invention relates to a nonvolatile memory such as, for example a ROM or an EPROM, in which the information density of the memory is increased relative to a conventional nonvolatile memory that includes two logic state devices. Specifically, the nonvolatile memory of the present invention includes a SiN/TaN/SiN thin film resistor embedded within a material having a thermal conductivity of about 1 W/m-K or less; and a non-linear Si-containing device coupled to the resistor. Read and write circuits and operations are also provided in the present application.
Abstract:
The present invention relates to a nonvolatile memory such as, for example a ROM or an EPROM, in which the information density of the memory is increased relative to a conventional nonvolatile memory that includes two logic state devices. Specifically, the nonvolatile memory of the present invention includes a SiN/TaN/SiN thin film resistor embedded within a material having a thermal conductivity of about 1 W/m-K or less; and a non-linear Si-containing device coupled to the resistor. Read and write circuits and operations are also provided in the present application.
Abstract:
A communication system, which includes a microelectronics chip including a power distribution network; a transmitter operatively configured to generate a communication signal and provide the communication signal to the power distribution network; and a receiver operatively configured to receive the communication signal from the power distribution network. A method is also provided for transmitting a communication signal via a power distribution network of a microelectronics chip.
Abstract:
An OTDR to examine light reflected from an optic fibre has an amplification stage that operates in either a high gain or low gain mode. To avoid saturation of the amplifier in the high gain mode, the trace is examined to identify the location of spikes and a switch is controlled to connect the amplifier to the signal after the occurrence of the spike.
Abstract:
An integrated circuit, testing structure, and method for monitoring electro-migration (EM) performance. A method is described that includes method for measuring on-chip electro-migration (EM) performance, including: providing a first on-chip sensor continuously powered with a stress current; providing a second on-chip sensor that is powered only during measurement cycles with a nominal current; obtaining a first resistance measurement from the first on-chip sensor and a second resistance measurement from the second on-chip sensor during each of a series of measurement cycles; and processing the first and second resistance measurements.
Abstract:
A FET pair based physically unclonable function (PUF) circuit with a constant common mode voltage and methods of use are disclosed. The circuit includes a first n-type field effect transistor (NFET) and a second NFET. The circuit also includes a first load resistor coupled to the first NFET by a first p-type field effect transistor (PFET) and a second load resistor coupled to the second NFET by a second PFET. The circuit further comprises a closed loop, wherein the closed loop creates a constant common mode voltage.
Abstract:
Embodiments of the present invention provide an approach for utilizing a sense amplifier to select a suitable circuit, wherein a suitable circuit generates a voltage that is greater than or equal to a configurable reference voltage. An amplifier gain selector selects a voltage gain of a sense amplifier having input terminals, auxiliary inputs, an output, an array of resistive loads, and the amplifier gain selector. Auxiliary inputs are utilized to nullify direct current (DC) offset voltage of the sense amplifier. Combinatorial logic circuitry connects the input terminals of the sense amplifier to output terminals of a circuit that is within a group of circuits. A comparator circuit determines if the circuit generates a voltage greater than or equal to a configurable reference voltage, based on the output of the sense amplifier.
Abstract:
A method for fabricating an interconnect function array includes forming a first plurality of conductive lines on a substrate, forming an insulator layer over the first plurality of conductive lines and the substrate, removing portions of the insulator layer to define cavities in the insulator layer that expose portions of the substrate and the first plurality of conductive lines, wherein the removal of the portions of the insulator layer results in a substantially random arrangement of cavities exposing portions of the substrate and the first plurality of conductive lines, depositing a conductive material in the cavities, and forming a second plurality of conductive lines on portions of the conductive material in the cavities and the insulator layer.
Abstract:
A single pole double throw (SPDT) semiconductor switch includes a series connection of a first transmitter-side transistor and a first reception-side transistor between a transmitter node and a reception node. Each of the two first transistors is provided with a gate-side variable impedance circuit, which provides a variable impedance connection between a complementary pair of gate control signals. Further, the body of each first transistor can be connected to a body bias control signal through a body-side variable impedance circuit. In addition, the transmitter node is connected to electrical ground through a second transmitter-side transistor, and the reception node is connected to electrical ground through a second reception-side transistor. Each of the second transistors can have a body bias that is tied to the body bias control signals for the first transistors so that switched-off transistors provide enhanced electrical isolation.
Abstract:
A structure includes a substrate comprising a region having a circuit or device which is sensitive to electrical noise. Additionally, the structure includes a first isolation structure extending through an entire thickness of the substrate and surrounding the region and a second isolation structure extending through the entire thickness of the substrate and surrounding the region.