公开(公告)号：US5658706A

公开(公告)日：1997-08-19

申请号：US302319

申请日：1994-09-08

申请人： Hirokazu Niki ,  Hiromitsu Wakabayashi ,  Rumiko Hayase ,  Naohiko Oyasato ,  Yasunobu Onishi ,  Kazuo Sato ,  Kenji Chiba ,  Takao Hayashi

发明人： Hirokazu Niki ,  Hiromitsu Wakabayashi ,  Rumiko Hayase ,  Naohiko Oyasato ,  Yasunobu Onishi ,  Kazuo Sato ,  Kenji Chiba ,  Takao Hayashi

IPC分类号： C08K5/16 ,  C08L25/00 ,  C08L25/18 ,  G03F7/004 ,  G03F7/039 ,  H01L21/027

CPC分类号： G03F7/0045 ,  G03F7/039 ,  Y10S430/111

摘要： A resist composition for forming a pattern, which comprises (a) a compound represented by the following formula (1) and satisfying the following inequalities, ##STR1## wherein R.sup.1 is hydrogen atom or methyl group, R.sup.2 is a monovalent organic group, m is 0 or a positive integer, n is a positive integer, and m and n satisfying a condition of 0.03.ltoreq.n/(m+n).ltoreq.1, (b) a compound capable of generating an acid when irradiated with light, and (c) a nitrogen-containing compound, wherein a weight-average molecular weight, Mw and a number-average molecular weight, Mn satisfy the following inequality, 4,000.ltoreq.Mw.ltoreq.50,000, 1.10.ltoreq.Mw/Mn.ltoreq.2.50 (Mw and Mn respectively represent value converted in styrene).

摘要翻译： 用于形成图案的抗蚀剂组合物，其包含（a）由下式（1）表示的化合物并满足以下不等式，其中R 1是氢原子或甲基，R 2是一价有机基团 基团，m为0或正整数，n为正整数，m和n满足0.03≤n/（m + n）≤1的条件，（b）能够产生酸的化合物 当用光照射时，和（c）含氮化合物，其中重均分子量Mw和数均分子量Mn满足以下不等式：4,000

公开(公告)号：US5340684A

公开(公告)日：1994-08-23

申请号：US158490

申请日：1993-11-29

申请人： Rumiko Hayase ,  Masayuki Oba ,  Naoko Kihara ,  Yukihiro Mikogami

发明人： Rumiko Hayase ,  Masayuki Oba ,  Naoko Kihara ,  Yukihiro Mikogami

IPC分类号： G03F7/075 ,  H01L21/312 ,  H01L23/29 ,  G03F7/023 ,  G03F7/115

CPC分类号： H01L21/312 ,  G03F7/0754 ,  G03F7/0757 ,  G03F7/0758 ,  H01L23/293 ,  H01L2924/0002 ,  Y10S430/106

摘要： A photosensitive composition contains a polyimide constituted by a repeating unit having a hydroxyl group and a repeating unit having a siloxane bond, or a repeating unit having a hydroxyl group, a repeating unit having a siloxane bond, and a repeating unit other than these two repeating units, and a photosensitive agent consisting of an ester compound or an amide-ester compound of naphthoquinonediazidesulfonic acid or benzoquinonediazidesulfonic acid. The photosensitive composition is used as a passivation film of a semiconductor device or a photoresist.

摘要翻译： 光敏组合物含有由具有羟基的重复单元和具有硅氧烷键的重复单元或具有羟基的重复单元，具有硅氧烷键的重复单元和除了这两个重复的重复单元之外的重复单元构成的聚酰亚胺 单元，以及由萘化二叠氮磺酸或苯醌二叠氮磺酸的酯化合物或酰胺 - 酯化合物组成的感光剂。 光敏组合物用作半导体器件或光致抗蚀剂的钝化膜。

公开(公告)号：US06437090B1

公开(公告)日：2002-08-20

申请号：US09334915

申请日：1999-06-17

申请人： Shinji Murai ,  Shuji Hayase ,  Shinetsu Fujieda ,  Rumiko Hayase ,  Yasuyuki Hotta

发明人： Shinji Murai ,  Shuji Hayase ,  Shinetsu Fujieda ,  Rumiko Hayase ,  Yasuyuki Hotta

IPC分类号： C08G5968

CPC分类号： C08G59/18 ,  C08G59/68

摘要： A curing catalyst comprising at least one of a cationic curing catalyst component and an organo-metallic compound component. At least one of these components is capable of reversibly repeating the dissolution and precipitation through heating and cooling. The cationic curing catalyst component includes in its molecule at least one substituted or unsubstituted hydrocarbon group having 10 or more carbon atoms, or at least one cyclic organic structure having a substituted or unsubstituted hydrocarbon group having 10 or more carbon atoms.

摘要翻译： 包含阳离子固化催化剂组分和有机金属化合物组分中的至少一种的固化催化剂。 这些组分中的至少一种能够通过加热和冷却可逆地重复溶解和沉淀。 阳离子固化催化剂组分在其分子中包含至少一个具有10个或更多个碳原子的取代或未取代的烃基，或至少一个具有取代或未取代的具有10个或更多个碳原子的烃基的环状有机结构。

公开(公告)号：US5744281A

公开(公告)日：1998-04-28

申请号：US848747

申请日：1997-05-01

申请人： Hirokazu Niki ,  Hiromitsu Wakabayashi ,  Rumiko Hayase ,  Naohiko Oyasato ,  Yasunobu Onishi ,  Kazuo Sato ,  Kenji Chiba ,  Takao Hayashi

发明人： Hirokazu Niki ,  Hiromitsu Wakabayashi ,  Rumiko Hayase ,  Naohiko Oyasato ,  Yasunobu Onishi ,  Kazuo Sato ,  Kenji Chiba ,  Takao Hayashi

IPC分类号： G03F7/004 ,  G03F7/039

CPC分类号： G03F7/039 ,  G03F7/0045 ,  Y10S430/111

摘要： A resist composition for forming a pattern, which comprises (a) a compound represented by the following formula (1) and satisfying the following inequalities, ##STR1## wherein R.sup.1 is hydrogen atom or methyl group, R.sup.2 is a monovalent organic group, m is 0 or a positive integer, n is a positive integer, and m and n satisfying a condition of 0.03.ltoreq.n/(m+n).ltoreq.1, (b) a compound capable of generating an acid when irradiated with light, and (c) 4-phenylpyridine, wherein a weight-average molecular weight, Mw and a number-average molecular weight, Mn satisfy the following inequality, 4,000.ltoreq.Mw.ltoreq.50,000, 1.10.ltoreq.Mw/Mn.ltoreq.2.50 (Mw and Mn respectively represent value converted in styrene).

摘要翻译： 用于形成图案的抗蚀剂组合物，其包含（a）由下式（1）表示的化合物并满足以下不等式，其中R 1是氢原子或甲基，R 2是一价有机基团 基团，m为0或正整数，n为正整数，m和n满足0.03≤n/（m + n）≤1的条件，（b）能够产生酸的化合物 当用光照射时，和（c）4-苯基吡啶，其中重均分子量Mw和数均分子量Mn满足以下不等式：4,000

公开(公告)号：US5518864A

公开(公告)日：1996-05-21

申请号：US220058

申请日：1994-03-30

申请人： Masayuki Oba ,  Rumiko Hayase ,  Naoko Kihara ,  Shuzi Hayase ,  Yukihiro Mikogami ,  Yoshihiko Nakano ,  Naohiko Oyasato ,  Shigeru Matake ,  Kei Takano

发明人： Masayuki Oba ,  Rumiko Hayase ,  Naoko Kihara ,  Shuzi Hayase ,  Yukihiro Mikogami ,  Yoshihiko Nakano ,  Naohiko Oyasato ,  Shigeru Matake ,  Kei Takano

IPC分类号： G03F7/023 ,  G03F7/038 ,  G03F7/38

CPC分类号： G03F7/0387 ,  G03F7/0233

摘要： Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R.sup.1 represents a tetravalent organic group, R.sup.2 represents a divalent organic group, and R.sup.3 and R.sup.4 represent a monovalent organic group, at least one of R.sup.3 and R.sup.4 being an organic group having at least on hydroxyl group bonded to an aromatic ring. A semiconductor substrate is coated with the photosensitive resin composition, followed by exposing the coated film to light through a patterning mask and subsequently applying a development and a heat treatment so as to form a polyimide film pattern. A baking treatment also be applied immediately after the exposure step. The photosensitive resin composition of the present invention performs the function of a positive or negative photoresist film and the function of a polyimide protective film on a semiconductor substrate.

摘要翻译： 公开了含有具有下述通式（1）表示的重复单元的聚酰胺酸衍生物和感光性化合物（1）的感光性树脂组合物，其中R1表示四价有机基团，R2表示二价有机基团 并且R 3和R 4表示一价有机基团，R 3和R 4中的至少一个是至少具有与芳环键合的羟基的有机基团。 用感光性树脂组合物涂布半导体基板，然后通过图案化掩模使涂膜曝光，随后进行显影和热处理，以形成聚酰亚胺膜图案。 在曝光步骤之后立即施加烘烤处理。 本发明的感光性树脂组合物在半导体基板上具有正性或负性光致抗蚀剂膜的功能和聚酰亚胺保护膜的功能。

公开(公告)号：US5348835A

公开(公告)日：1994-09-20

申请号：US766334

申请日：1991-09-27

申请人： Masayuki Oba ,  Rumiko Hayase ,  Naoko Kihara ,  Shuzi Hayase ,  Yukihiro Mikogami ,  Yoshihiko Nakano ,  Naohiko Oyasato ,  Shigeru Matake ,  Kei Takano

发明人： Masayuki Oba ,  Rumiko Hayase ,  Naoko Kihara ,  Shuzi Hayase ,  Yukihiro Mikogami ,  Yoshihiko Nakano ,  Naohiko Oyasato ,  Shigeru Matake ,  Kei Takano

IPC分类号： G03F7/023 ,  G03F7/038 ,  G03F7/30

CPC分类号： G03F7/0387 ,  G03F7/0233

摘要： Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R.sup.1 represents a tetravalent organic group, R.sup.2 represents a divalent organic group, and R.sup.3 and R.sup.4 represent a monovalent organic group, at least one of R.sup.3 and R.sup.4 being an organic group having at least on hydroxyl group bonded to an aromatic ring. A semiconductor substrate is coated with the photosensitive resin composition, followed by exposing the coated film to light through a patterning mask and subsequently applying a development and a heat treatment so as to form a polyimide film pattern. A baking treatment also be applied immediately after the exposure step. The photosensitive resin composition of the present invention performs the function of a positive or negative photoresist film and the function of a polyimide protective film on a semiconductor substrate.

摘要翻译： 公开了一种感光性树脂组合物，其含有具有下述通式（1）表示的重复单元的聚酰胺酸衍生物和感光性化合物：其中，R 1表示四价有机基团，R 2表示二价有机基团， R3和R4表示一价有机基团，R3和R4中的至少一个是至少具有与芳环键合的羟基的有机基团。 用感光性树脂组合物涂布半导体基板，然后通过图案化掩模将涂膜曝光，随后进行显影和热处理，以形成聚酰亚胺膜图案。 在曝光步骤之后立即施加烘烤处理。 本发明的感光性树脂组合物在半导体基板上具有正性或负性光致抗蚀剂膜的功能和聚酰亚胺保护膜的功能。

公开(公告)号：US5326675A

公开(公告)日：1994-07-05

申请号：US987821

申请日：1992-12-09

申请人： Hirokazu Niki ,  Rumiko Hayase ,  Naohiko Oyasato ,  Yasunobu Onishi ,  Akitoshi Kumagae ,  Kazuo Sato ,  Masataka Miyamura ,  Yoshihito Kobayashi

发明人： Hirokazu Niki ,  Rumiko Hayase ,  Naohiko Oyasato ,  Yasunobu Onishi ,  Akitoshi Kumagae ,  Kazuo Sato ,  Masataka Miyamura ,  Yoshihito Kobayashi

IPC分类号： G03F7/26 ,  G03F7/004 ,  G03F7/039 ,  G03F7/09 ,  G03F7/11 ,  G03F7/38 ,  H01L21/027 ,  G03C5/00

CPC分类号： G03F7/09 ,  G03F7/11 ,  G03F7/0045

摘要： A radiation-sensitive layer comprising as a main component a radiation-sensitive composition containing a compound capable of generating an acid when exposed to a chemical radiation and a compound having at least one linkage decomposable by an acid is formed on a substrate. An acidic coating layer is formed on the radiation-sensitive layer. The radiation-sensitive layer and the acidic coating layer are pattern-exposed to a chemical radiation. The radiation-sensitive layer and the acidic coating layer are baked and developed by using an aqueous alkaline solution to obtain a pattern comprising lines and spaces, each having a predetermined width. A fine pattern of a rectangular sectional shape can be formed without producing eaves caused by a surface inhibition layer layer, which is produced on the film surface.

摘要翻译： 一种辐射敏感层，其包含作为主要成分的含有当暴露于化学辐射时能够产生酸的化合物的辐射敏感性组合物和具有至少一个可被酸分解的键的化合物。 在辐射敏感层上形成酸性涂层。 辐射敏感层和酸性涂层图案暴露于化学辐射。 通过使用碱性水溶液来烘烤和显影辐射敏感层和酸性涂层，以获得每个具有预定宽度的线和间隔的图案。 可以形成矩形截面形状的精细图案，而不会产生由在膜表面上产生的表面抑制层而引起的檐。

公开(公告)号：US5100768A

公开(公告)日：1992-03-31

申请号：US519397

申请日：1990-05-04

申请人： Hirokazu Niki ,  Yasunobu Onishi ,  Yoshihito Kobayashi ,  Rumiko Hayase

发明人： Hirokazu Niki ,  Yasunobu Onishi ,  Yoshihito Kobayashi ,  Rumiko Hayase

IPC分类号： G03F7/004

CPC分类号： G03F7/0045

摘要： A photosensitive composition contains an alkali-soluble polymer having a phenol skeleton in its structure and a heterocyclic compound represented by formula (I-1) or (I-2), formula (II-1) or (II-2), any of formulas (III-1) to (III-8), any of formulas (IV-1) to (IV-12), or any of formulas (V-1) to (V-4) described in the claims and specification. A photosensitive composition containing a heterocyclic compound represented by formula (I-1) or (I-2), any of formulas (III-1) to (III-8), any of formulas (IV-1) to (IV-12), or any of formulas (V-1) to (V-4) can be suitably used as a negative resist. A photosensitive composition containing a heterocyclic compound represented by formula (II-1) or (II-2) can be suitably used as a positive resist. A photosensitive composition containing an alkali-soluble polymer having a phenol skeleton in its structure and a polymer having a nitrogen-containing heterocyclic compound as a polymeric unit is also included in this invention. The latter photosensitive composition can further contain a heterocyclic compound represented by any of formulas (VI-1) to (VI-15) described in the claims and specification.

公开(公告)号：US5998509A

公开(公告)日：1999-12-07

申请号：US980343

申请日：1997-11-28

申请人： Rumiko Hayase ,  Shinetsu Fujieda ,  Yasuyuki Hotta ,  Shinji Murai

发明人： Rumiko Hayase ,  Shinetsu Fujieda ,  Yasuyuki Hotta ,  Shinji Murai

IPC分类号： C08G59/40 ,  C08G77/16 ,  C08L63/00 ,  C08L83/04 ,  H01L23/29 ,  H01L23/31 ,  C08K3/34 ,  C08L63/02

CPC分类号： C08L63/00 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253

摘要： A resin composition comprising (a) an epoxy compound, (b) a curing agent comprising a polysiloxane resin having a phenolic hydroxyl group on its side chain, and (c) an inorganic filler. The mixing ratio of the inorganic filler should preferably be 10 to 95% by weight based on the entire resin composition.

摘要翻译： 一种树脂组合物，其包含（a）环氧化合物，（b）包含其侧链上具有酚羟基的聚硅氧烷树脂的固化剂，和（c）无机填料。 基于整个树脂组合物，无机填料的混合比优选为10〜95重量％。