公开(公告)号：US07285351B2

公开(公告)日：2007-10-23

申请号：US10676470

申请日：2003-10-01

申请人： Akio Yamamoto ,  Kazunori Fukuma ,  Takatsugu Koyama ,  Hideo Numata ,  Masahiro Matsutani

发明人： Akio Yamamoto ,  Kazunori Fukuma ,  Takatsugu Koyama ,  Hideo Numata ,  Masahiro Matsutani

IPC分类号： H01M8/04 ,  H01M2/12

CPC分类号： H01M8/0662 ,  H01M8/04126 ,  H01M8/04156 ,  H01M8/04231

摘要： An apparatus for dilution of discharged fuel of a fuel cell is provided, which has an inlet for guiding purged hydrogen gas coming from the fuel cell, a reservoir for storing the purged hydrogen gas guided through the inlet, and a cathode exhaust gas pipe penetrating the reservoir. The cathode exhaust gas pipe has a feature that it has holes inside the reservoir and is supplied with cathode exhaust gas of the fuel cell. Also the apparatus has a feature that the cathode exhaust gas pipe sucks the purged hydrogen gas stored in the reservoir through the holes and discharges the purged hydrogen gas diluted by mixing with the cathode exhaust gas.

摘要翻译： 提供一种用于稀释燃料电池的排放燃料的装置，其具有用于引导来自燃料电池的净化氢气的入口，用于存储通过入口引导的净化氢气的储存器和穿透入口的阴极排气管 水库 阴极排气管具有在储存器内部具有孔的燃料电池的阴极排气的特征。 此外，该装置具有阴极排气管通过孔吸收储存在储存器中的净化氢气并排出通过与阴极废气混合而稀释的净化氢气的特征。

公开(公告)号：US20070212001A1

公开(公告)日：2007-09-13

申请号：US11711862

申请日：2007-02-28

申请人： Wataru Sakurai ,  Kazuhito Saito ,  Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

发明人： Wataru Sakurai ,  Kazuhito Saito ,  Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

IPC分类号： G02B6/36

CPC分类号： G02B6/43 ,  G02B6/4202 ,  H01L2924/0002 ,  H01L2924/00

摘要： When a resin 59 to form a molded body 20 is poured and a lead frame 30 is attached to a front end face 21 of the molded body 20 by insert molding, protective leads 32 provided on both outsides of a lead pattern 31 of the lead frame 30 moderate the flow of the resin 59 and the force acting on the lead pattern 31 is decreased, so that misregistration of the lead pattern 31 can be prevented. Accordingly, the inserted and molded lead frame 30 can be wired on the front end face 21 of the molded body 20 for easily accomplishing three-dimensional electric wiring.

摘要翻译： 当浇铸形成模制体20的树脂59并且通过嵌件模制将引线框架30附接到模制体20的前端面21时，设置在引线框架的引线图案31的外侧的保护引线32 30使树脂59的流动缓和，并且作用在引线图案31上的力减小，从而可以防止引线图案31的不对准。 因此，插入成型的引线框架30可以布线在成型体20的前端面21上，以便于实现三维电线。

公开(公告)号：US20070165986A1

公开(公告)日：2007-07-19

申请号：US11640861

申请日：2006-12-19

申请人： Wataru Sakurai ,  Kazuhito Saito ,  Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

发明人： Wataru Sakurai ,  Kazuhito Saito ,  Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

IPC分类号： G02B6/36

CPC分类号： G02B6/3644 ,  G02B6/3652 ,  G02B6/3696 ,  G02B6/4202

摘要： After a wiring plate 30 having a plurality of leads 31 been insert-molded to an edge face 21 of a molded article 20, unwanted portions of the wiring plate 30 are cut, thereby enabling easy three-dimensional wiring. As a result, an electrode terminal section 43 of a photoelectric conversion element 41 disposed opposite an end face 11b of an optical fiber 11 can be electrically coupled to an electrical wiring section 23 of an optical coupling part 10.

摘要翻译： 在具有多根引线31的布线板30嵌入成型到成形品20的边缘面21之后，切断布线板30的不希望的部分，从而能够容易地进行三维布线。 结果，与光纤11的端面11b相对设置的光电转换元件41的电极端子部43可以电耦合到光耦合部10的电配线部23。

公开(公告)号：US07235425B2

公开(公告)日：2007-06-26

申请号：US11062664

申请日：2005-02-23

申请人： Hideo Numata ,  Chiaki Takubo

发明人： Hideo Numata ,  Chiaki Takubo

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/27005 ,  H01L2224/2732 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512

摘要： A method for fabricating a semiconductor device includes mountain a first semiconductor chip on a wiring substrate, bonding a spacer having a first main surface and a second main surface opposing the first main surface such that the first main surface is in contact with the first semiconductor chip. The method further includes bonding a second semiconductor chip having a surface, onto the second main surface via a layer of a die bonding material selectively formed on a part of a third main surface.

摘要翻译： 一种制造半导体器件的方法包括：在布线基板上形成第一半导体芯片，将具有第一主表面和与第一主表面相对的第二主表面的间隔物接合，使得第一主表面与第一半导体芯片接触 。 该方法还包括通过选择性地形成在第三主表面的一部分上的芯片接合材料层将具有表面的第二半导体芯片接合到第二主表面上。

公开(公告)号：US20060254906A1

公开(公告)日：2006-11-16

申请号：US11408392

申请日：2006-04-21

申请人： Hideo Numata ,  Akio Yamamoto ,  Masahiro Matsutani ,  Shujiro Nozaki ,  Shinri Hayashi

发明人： Hideo Numata ,  Akio Yamamoto ,  Masahiro Matsutani ,  Shujiro Nozaki ,  Shinri Hayashi

IPC分类号： C25B15/00

CPC分类号： H01M8/04097 ,  H01M8/04231

摘要： A fuel cell discharge-gas processing device includes: an anode off-gas introduction path which introduces an anode off-gas discharged from an anode of a fuel cell; a dilution container which is connected to the anode off-gas introduction path, and into which the anode off-gas is introduced; and a bypass path which branches off from a cathode gas supply path for supplying a cathode gas to a cathode of the fuel cell, and is connected to the dilution container so as to bypass the fuel cell. While the fuel cell is in operation, the cathode gas supplied from the bypass path into the dilution container is discharged to an exterior of the dilution container.

公开(公告)号：US20060139893A1

公开(公告)日：2006-06-29

申请号：US11132290

申请日：2005-05-19

申请人： Atsushi Yoshimura ,  Naoyuki Komuta ,  Hideo Numata

发明人： Atsushi Yoshimura ,  Naoyuki Komuta ,  Hideo Numata

IPC分类号： H05K7/00

CPC分类号： H01L25/0657 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.

公开(公告)号：US06352073B1

公开(公告)日：2002-03-05

申请号：US09404595

申请日：1999-09-24

申请人： Tetsuya Kurosawa ,  Hideo Numata ,  Keisuke Tokubuchi

发明人： Tetsuya Kurosawa ,  Hideo Numata ,  Keisuke Tokubuchi

IPC分类号： B28D704

CPC分类号： H01L21/67092 ,  B28D5/0094 ,  H01L21/6838 ,  H01L21/78 ,  Y10T279/11 ,  Y10T279/1249

摘要： By preventing warping of chips when detaching individual chips from a dicing sheet, improvement in quality without cracks and in productivity is realized. A collet (115) used in a step of detaching chips (110) discretely divided as bonded to a dicing sheet (109) from the dicing sheet has a flat attraction surface made of a porous material of a size equal to or larger than the chip size. Alternatively, the collet may have a chip attraction groove containing poles, balls or hemispheres, for example, to prevent warping of chips. In the step of detaching each chip from the dicing sheet, a means for reducing the bonding force of the dicing sheet, such as heating device or cooling device, may be provided. Thus, warping or cracking can be prevented in a process of thinned semiconductor substrate. Additionally, since the means for reducing the bonding force of the dicing sheet is provided in a semiconductor manufacturing equipment, breakage or cracking of chips can be prevented more reliably.

摘要翻译： 通过防止从切割片上分离各个芯片时芯片的翘曲，可以实现质量的提高，无裂纹和生产率。 在从切割片离散分离的切片（110）分离的步骤中使用的夹头（115）具有由等于或大于芯片的尺寸的多孔材料制成的平坦的吸引表面 尺寸。 或者，夹头可以具有例如包含杆，球或半球的芯片吸引槽，以防止芯片翘曲。 在从切割片分离每个芯片的步骤中，可以提供用于降低切割片（例如加热装置或冷却装置）的结合力的装置。 因此，在减薄的半导体衬底的工艺中可以防止翘曲或破裂。 此外，由于在半导体制造装置中设置了用于降低切割片的接合力的装置，因此可以更可靠地防止切屑的断裂或破裂。

公开(公告)号：US5871610A

公开(公告)日：1999-02-16

申请号：US24913

申请日：1993-03-02

申请人： Tomio Minohoshi ,  Toyohiko Takeda ,  Hideo Numata

发明人： Tomio Minohoshi ,  Toyohiko Takeda ,  Hideo Numata

IPC分类号： H01L21/52 ,  H01L21/00 ,  B32B31/00

CPC分类号： H01L21/67144 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  Y10T156/171 ,  Y10T156/1744 ,  Y10T29/53174 ,  Y10T29/53187

摘要： Lead frames supplied from a first supply unit are intermittently conveyed in a non-oxidizing atmosphere. An adhesive is supplied from a second supply unit onto islands of the lead frames, and also semiconductor chips are supplied from a third supply unit onto the islands. When one of different kinds of semiconductor chips supplied from the third supply unit is selected, the selected semiconductor chip is held by a holder having a configuration adapted to the selected semiconductor chip. Therefore, transfer means for semiconductor chips includes at least two kinds of holders.

摘要翻译： 从第一供应单元供应的引线框在非氧化气氛中间歇地输送。 粘合剂从第二供应单元供应到引线框架的岛上，并且半导体芯片从第三供应单元供应到岛上。 当选择从第三供电单元提供的不同种类的半导体芯片中的一种时，所选择的半导体芯片由具有适合所选择的半导体芯片的配置的保持器保持。 因此，用于半导体芯片的转移装置包括至少两种保持器。

公开(公告)号：US08268673B2

公开(公告)日：2012-09-18

申请号：US13137097

申请日：2011-07-20

申请人： Atsushi Yoshimura ,  Naoyuki Komuta ,  Hideo Numata

发明人： Atsushi Yoshimura ,  Naoyuki Komuta ,  Hideo Numata

IPC分类号： H01L21/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/02 ,  H01L23/14 ,  H01L23/34 ,  H01L23/29 ,  H01L25/11 ,  H01L23/31

CPC分类号： H01L25/0657 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.

摘要翻译： 堆叠的电子部件包括经由第一粘合剂层粘附在基板上的第一电子部件和通过使用第二粘合层粘附的第二电子部件。 第二粘合剂层具有由相同材料形成且具有不同弹性模量的两层结构。 双层结构的第二粘合剂层具有设置在第一电子部件侧的第一层和设置在第二电子部件侧的第二层。 第一层在粘合剂温度下软化或熔化。 第二层在粘合剂温度下保持层状。 根据堆叠的电子元件，可以防止绝缘故障和短路的发生，并且还可以抑制电子部件之间的剥离故障，制造成本的增加等。

公开(公告)号：US08008763B2

公开(公告)日：2011-08-30

申请号：US12011253

申请日：2008-01-25

申请人： Atsushi Yoshimura ,  Naoyuki Komuta ,  Hideo Numata

发明人： Atsushi Yoshimura ,  Naoyuki Komuta ,  Hideo Numata

IPC分类号： H01L23/02 ,  H01L23/34 ,  H01L23/06 ,  H01L23/04 ,  H01L23/12 ,  H01L23/48 ,  H01L23/52 ,  H01L23/40

CPC分类号： H01L25/0657 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.

摘要翻译： 堆叠的电子部件包括经由第一粘合剂层粘附在基板上的第一电子部件和通过使用第二粘合层粘附的第二电子部件。 第二粘合剂层具有由相同材料形成且具有不同弹性模量的两层结构。 双层结构的第二粘合剂层具有设置在第一电子部件侧的第一层和设置在第二电子部件侧的第二层。 第一层在粘合剂温度下软化或熔化。 第二层在粘合剂温度下保持层状。 根据堆叠的电子元件，可以防止绝缘故障和短路的发生，并且还可以抑制电子部件之间的剥离故障，制造成本的增加等。