公开(公告)号：US07815262B2

公开(公告)日：2010-10-19

申请号：US12281981

申请日：2007-04-23

Applicant: Kazuo Maeda

Inventor： Kazuo Maeda

IPC: B62D55/205

CPC classification number: B62D55/205 ,  B62D55/20 ,  B62D55/21 ,  B62D55/26

Abstract: A track chain assembly (22) has a track shoe (25) and a pair of parallel links (26) that are fixed to a non ground-engaging surface of the track shoe (25) with bolts (36). A connecting shaft (27) is fixed to shaft holes (31) that are provided on end portions each of which is included in the links (26). A reinforcing member (48) connects the links (26) with the bolts (36) so as to reinforce an open side between the links (26). Therefore, the links (26) are prevented from being damaged due to concentration of stress on a specific portion of each link (26).

Abstract translation: 轨道链组件（22）具有履带板（25）和一对平行链节（26），其用螺栓（36）固定到履带板（25）的非接地接合表面。 连接轴（27）固定在轴孔（31）上，轴孔（31）设置在各自包括在连杆（26）中的端部上。 加强构件（48）将连杆（26）与螺栓（36）连接起来，以便加强连杆（26）之间的敞开侧。 因此，由于每个连杆（26）的特定部分上的应力集中，防止连杆（26）被损坏。

公开(公告)号：US20100196108A1

公开(公告)日：2010-08-05

申请号：US12665193

申请日：2009-03-23

Applicant: Hisao Oka ,  Tatsuya Shino ,  Kazuo Maeda

Inventor： Hisao Oka ,  Tatsuya Shino ,  Kazuo Maeda

IPC: B23C5/10

CPC classification number: B23C5/10 ,  B23C2210/0485 ,  B23C2210/0492 ,  B23C2210/088 ,  B23C2210/54 ,  B23C2226/27

Abstract: It is an object of the present invention to effectively suppress the occurrence of burrs in machining of a fiber-reinforced composite material, etc., using an end mill. An end mill includes first cutting edges 4 which spiral in a direction defining a positive helix angle and second cutting edges 5 which spiral in a direction defining a negative helix angle, the first cutting edges 4 and the second cutting edges 5 being disposed at positions shifted in a circumferential direction. The first cutting edges 4 and the second cutting edges 5 are each configured to be continuous over an effective cutting edge length, and at a tool top, a phase angle P1 between one of the first cutting edges 4 and its adjacent second cutting edge 5 located toward the back in a tool rotation direction is set to be different from a phase angle P2 between the second cutting edge 5 and its adjacent first cutting edge 4 located toward the back in the tool rotation direction.

Abstract translation: 本发明的一个目的是使用立铣刀来有效地抑制纤维增强复合材料等的加工毛刺的发生。 端铣刀包括在限定正螺旋角的方向上螺旋形的第一切削刃4和在限定负螺旋角的方向上螺旋的第二切削刃5，第一切削刃4和第二切削刃5设置在偏移位置 在圆周方向。 第一切削刃4和第二切削刃5分别构造成在有效切削刃长度上连续，并且在刀具顶部处，第一切削刃4中的一个与其相邻的第二切削刃5之间的相位角P1位于 设置为与刀具旋转方向上的后方位于第二切削刃5与其相邻的第一切削刃4之间的相位角P2不同。

公开(公告)号：US20080164756A1

公开(公告)日：2008-07-10

申请号：US11896526

申请日：2007-09-04

Applicant: Teiji Yamamoto ,  Kazuo Maeda

Inventor： Teiji Yamamoto ,  Kazuo Maeda

IPC: B62D55/21 ,  B62D55/12 ,  B62D25/16

CPC classification number: B62D55/21

Abstract: In a track with a rotatable bushing which is brought into engagement with a sprocket of a track-type vehicle, it is intended that strength is enhanced rationally by link functionality sharing and by combination of such assigned functional tasks for achieving further improvements in rotatable bushing function. To this end, a first bolt insertion hole provided in a track shoe mount surface of an external link and a second bolt insertion hole provided in a track shoe mount surface of an internal link are arranged on the same straight line, and a straight line connecting the first bolt insertion hole and the second bolt insertion hole is situated at a position more interior than a contact plane of the external link and internal link.

Abstract translation: 在具有与轨道式车辆的链轮接合的可旋转衬套的轨道中，旨在通过链接功能共享和通过组合这些分配的功能任务来合理地增强强度，以实现可旋转衬套功能的进一步改进 。 为此，设置在外部连杆的履带板安装表面中的第一螺栓插入孔和设置在内部链节的履带板安装表面中的第二螺栓插入孔布置在同一直线上，并且连接有直线 第一螺栓插入孔和第二螺栓插入孔位于比外部连杆和内部连杆的接触面更内侧的位置。

公开(公告)号：US07329612B2

公开(公告)日：2008-02-12

申请号：US10530730

申请日：2003-10-20

Applicant: Yoshimi Shioya ,  Yuhko Nishimoto ,  Kazuo Maeda

Inventor： Yoshimi Shioya ,  Yuhko Nishimoto ,  Kazuo Maeda

IPC: H01L21/469 ,  H01L21/31

CPC classification number: H01L23/53295 ,  C23C16/401 ,  C23C16/56 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02274 ,  H01L21/0234 ,  H01L21/02362 ,  H01L21/31633 ,  H01L21/76801 ,  H01L21/76807 ,  H01L21/76826 ,  H01L21/76829 ,  H01L21/76835 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device is manufactured by the steps of generating a film forming gas by setting a flow rate ratio of H2O to any one of a silicon-contained organic compound having a siloxane bond and a silicon-contained organic compound having a CH3 group to 4 or more and adjusting a gas pressure to 1.5 Torr or more, applying a power to the film forming gas to generate a plasma thereof so as to react it, and thus forming a low-dielectric insulating film (62) on a substrate (61), plasmanizing a process gas containing at least any one of He, Ar, H2 or deuterium, and bringing the low-dielectric insulating film (62) into contact with the plasma of the process gas.

Abstract translation: 通过以下步骤制造半导体器件：通过将H 2 O 2的流量比设定为具有硅氧烷键的含硅有机化合物和含硅的有机化合物中的任何一种来生成成膜气体 具有CH 3 3〜4以上的有机化合物，将气体压力调节至1.5Torr以上，向成膜气体施加电力，生成等离子体，使其反应， 在基板（61）上形成低介电绝缘膜（62），使包含He，Ar，H 2或氘中的至少任何一种的工艺气体均质化，并使低介电绝缘层 膜（62）与工艺气体的等离子体接触。

公开(公告)号：US07281884B2

公开(公告)日：2007-10-16

申请号：US11462893

申请日：2006-08-07

Applicant: Kazuo Maeda

Inventor： Kazuo Maeda

IPC: B23C5/20

CPC classification number: B23C5/109 ,  B23C5/202 ,  B23C2200/123 ,  B23C2200/125 ,  B23C2200/203 ,  B23C2200/283 ,  B23C2200/286 ,  Y10T407/1908 ,  Y10T407/1924 ,  Y10T407/1936 ,  Y10T407/23

Abstract: A throw-away insert includes: an upper surface; a bottom surface; two side surfaces formed with upper side surfaces and lower side surfaces; two end surfaces; four nose sections formed at the corners of the upper surface; a main cutting section formed from a ridge line positioned at the intersection between the upper side surface and the upper surface; a secondary cutting section formed from a linear ridge line positioned at the intersection between the end surface and the upper surface; and an axial support surface formed from a section of the end surface. The upper side surface is projected outward more than the lower side surface.

Abstract translation: 丢弃的插入物包括：上表面; 底面; 两个侧表面形成有上侧表面和下侧表面; 两个端面; 四个鼻部形成在上表面的角落处; 主切割部分，其由位于上侧表面和上表面之间的交叉点处的棱线形成; 二次切割部，其由位于端面与上表面的交叉部的线状脊线形成; 以及从端面的一部分形成的轴向支撑表面。 上侧表面比下侧表面向外突出。

公开(公告)号：US07238629B2

公开(公告)日：2007-07-03

申请号：US10867178

申请日：2004-06-15

Applicant: Yoshimi Shioya ,  Kazuo Maeda

Inventor： Yoshimi Shioya ,  Kazuo Maeda

IPC: H01L21/44 ,  H01L21/469 ,  H01L21/31

CPC classification number: H01L21/02216 ,  C23C16/401 ,  H01L21/02274 ,  H01L21/3121 ,  H01L21/3122

Abstract: The present invention relates to a deposition method of a low dielectric constant insulating film, which comprises the steps of generating a first deposition gas containing at least one silicon source selecting from the group consisting of silicon containing organic compound having siloxane bond and silicon containing organic compound having CH3 group, and an oxidizing agent consisting of oxygen containing organic compound having alkoxyl group (OR: O is oxygen and R is CH3 or C2H5), and applying electric power to the first deposition gas to generate plasma and then causing reaction to form a low dielectric constant insulating film on a substrate.

Abstract translation: 本发明涉及一种低介电常数绝缘膜的沉积方法，其包括以下步骤：产生包含至少一个硅源的第一沉积气体，其选自含有硅氧烷键的含硅有机化合物和含硅有机化合物 具有CH 3 3个基团的氧化剂和由具有烷氧基的含氧有机化合物（OR：O是氧而R是CH 3或C 2）组成的氧化剂， 向第一沉积气体施加电力以产生等离子体，然后引起反应，从而在衬底上形成低介电常数绝缘膜。

公开(公告)号：US07210750B2

公开(公告)日：2007-05-01

申请号：US10797686

申请日：2004-03-09

Applicant: Teiji Yamamoto ,  Kazuo Maeda

Inventor： Teiji Yamamoto ,  Kazuo Maeda

IPC: B60S1/62 ,  B62D55/14 ,  B62D25/16

CPC classification number: B62D55/0882 ,  B62D55/096 ,  B62D55/14 ,  B62D55/20 ,  B62D55/32

Abstract: Vibration or the like is prevented for long-term use by normalizing, with operation continuing, a tread of a crawler belt link through grinding in an early stage where uneven wear such as corrugated wear occurs. With a crawler belt of a crawler vehicle wound, an abrasive plate for grinding the tread of the crawler belt link is disposed to contact the tread. While the crawler vehicle does normal traveling work, the abrasive plate corrects the tread of the crawler belt link for the uneven wear. The vibration of a vehicle body can thus be prevented during travel with no uneven wear produced.

Abstract translation: 通过正常化，通过正常化的操作，通过正常化，通过正常化，通过磨损履带的履带连接件的胎面在发生诸如波纹状磨损的不均匀磨损的早期阶段中的磨损被防止以长期使用振动等。 在履带式履带车辆的履带上，用于研磨履带链节的胎面的研磨板被设置成接触胎面。 当履带车进行正常的行驶工作时，研磨板校正履带链节的胎面，使其不均匀磨损。 因此，可以在行驶期间防止车体的振动，而不产生不均匀的磨损。

公开(公告)号：US20070031200A1

公开(公告)日：2007-02-08

申请号：US11462643

申请日：2006-08-04

Applicant: Kazuo Maeda

Inventor： Kazuo Maeda

IPC: B23C5/00

CPC classification number: B23C5/109 ,  B23C5/202 ,  B23C2200/083 ,  B23C2200/123 ,  B23C2200/125 ,  B23C2200/203 ,  B23C2200/286 ,  Y10T407/1908 ,  Y10T407/1924 ,  Y10T407/1936 ,  Y10T407/23

Abstract: A throw-away insert includes: an upper and bottom surface; two side surfaces; two end surfaces; a main cutting section formed from a ridge line positioned at the intersection between the side surfaces and the upper surface; a secondary cutting section formed from a ridge line positioned at the intersection between the end surfaces and the upper surface; an axial support surface supported by an insert pocket of a cutter body; and noses formed at the comers of the upper surface. The corner angles of the noses when seen from above are essentially right angles. The axial support surface is formed as a section of the end surface. The secondary cutting section is parallel to the ridge line at the upper end of the axial support surface and the bottom surface. The upper end of the axial support surface is positioned so that it is projected more in the direction of the longitudinal axis of the main cutting section than the ridge line of the upper end.

Abstract translation: 抛弃刀片包括：上表面和下表面; 两个侧面; 两个端面; 主切割部，其由位于所述侧面和所述上表面的交叉部的棱线形成; 二次切割部，其由位于端面与上表面的交叉部的棱线形成; 轴向支撑表面，其由切割器主体的刀片槽支撑; 并且在上表面的角落形成鼻子。 从上方观察时，鼻子的角角度基本上是直角。 轴向支撑表面形成为端面的一部分。 次切割部分在轴向支撑表面和底表面的上端平行于脊线。 轴向支撑表面的上端被定位成使得其在主切割部分的纵向方向上比上端的脊线更多地突出。

公开(公告)号：US20060099725A1

公开(公告)日：2006-05-11

申请号：US10530730

申请日：2003-10-20

Applicant: Yoshimi Shioya ,  Yuhko Nishimoto ,  Kazuo Maeda

Inventor： Yoshimi Shioya ,  Yuhko Nishimoto ,  Kazuo Maeda

IPC: H01L21/00

CPC classification number: H01L23/53295 ,  C23C16/401 ,  C23C16/56 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02274 ,  H01L21/0234 ,  H01L21/02362 ,  H01L21/31633 ,  H01L21/76801 ,  H01L21/76807 ,  H01L21/76826 ,  H01L21/76829 ,  H01L21/76835 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device is manufactured by the steps of generating a film forming gas by setting a flow rate ratio of H2O to any one of a silicon-contained organic compound having a siloxane bond and a silicon-contained organic compound having a CH3 group to 4 or more and adjusting a gas pressure to 1.5 Torr or more, applying a power to the film forming gas to generate a plasma thereof so as to react it, and thus forming a low-dielectric insulating film (62) on a substrate (61), plasmanizing a process gas containing at least any one of He, Ar, H2 or deuterium, and bringing the low-dielectric insulating film (62) into contact with the plasma of the process gas.

Abstract translation: 通过以下步骤制造半导体器件：通过将H 2 O 2的流量比设定为具有硅氧烷键的含硅有机化合物和含硅的有机化合物中的任何一种来生成成膜气体 具有CH 3 3〜4以上的有机化合物，将气体压力调节至1.5Torr以上，向成膜气体施加电力，生成等离子体，使其反应， 在基板（61）上形成低介电绝缘膜（62），使包含He，Ar，H 2或氘中的至少任何一种的工艺气体均质化，并使低介电绝缘层 膜（62）与工艺气体的等离子体接触。

公开(公告)号：US06911405B2

公开(公告)日：2005-06-28

申请号：US09988685

申请日：2001-11-20

Applicant: Yoshimi Shioya ,  Kouichi Ohira ,  Kazuo Maeda ,  Tomomi Suzuki ,  Youichi Yamamoto ,  Yuichiro Kotake ,  Hiroshi Ikakura ,  Shoji Ohgawara

Inventor： Yoshimi Shioya ,  Kouichi Ohira ,  Kazuo Maeda ,  Tomomi Suzuki ,  Youichi Yamamoto ,  Yuichiro Kotake ,  Hiroshi Ikakura ,  Shoji Ohgawara

IPC: H01L21/28 ,  H01L21/205 ,  H01L21/3105 ,  H01L21/311 ,  H01L21/314 ,  H01L21/316 ,  H01L21/318 ,  H01L21/3205 ,  H01L21/321 ,  H01L21/3213 ,  H01L21/768 ,  H01L23/52 ,  H01L23/522 ,  H01L21/76 ,  H01L21/26 ,  H01L21/44

CPC classification number: H01L21/7685 ,  H01L21/3105 ,  H01L21/31116 ,  H01L21/3144 ,  H01L21/3185 ,  H01L21/321 ,  H01L21/32136 ,  H01L21/76826 ,  H01L21/76834 ,  H01L21/76838 ,  H01L21/76867 ,  H01L21/76886

Abstract: A process gas consisting of one of N2, N2O or a mixture thereof is converted to a plasma and then a surface of a copper wiring layer is exposed to the plasma of the process gas, whereby a surface portion of the copper wiring layer is reformed and made into a copper diffusion preventing barrier. According to this method, a noble semiconductor device can be provided having increased operational speed and less copper diffusion.

Abstract translation: 由N 2 N 2 N 2 O 2或其混合物之一组成的工艺气体被转化为等离子体，然后将铜布线层的表面暴露于等离子体 的处理气体，由此将铜布线层的表面部分重整并制成铜扩散防止屏障。 根据该方法，可以提供具有增加的操作速度和较少的铜扩散的贵金属半导体器件。