公开(公告)号：US07858536B2

公开(公告)日：2010-12-28

申请号：US11902300

申请日：2007-09-20

申请人： Kazuhiro Eguchi ,  Seiji Inumiya ,  Yoshitaka Tsunashima

发明人： Kazuhiro Eguchi ,  Seiji Inumiya ,  Yoshitaka Tsunashima

IPC分类号： H01L21/31

CPC分类号： H01L29/511 ,  C23C16/30 ,  C23C16/45523 ,  H01L21/28176 ,  H01L21/28185 ,  H01L21/28194 ,  H01L21/28202 ,  H01L21/28211 ,  H01L21/28229 ,  H01L21/31604 ,  H01L28/56 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L29/78

摘要： A semiconductor device comprising a semiconductor substrate, a gate dielectrics formed on the semiconductor substrate and including a silicon oxide film containing a metallic element, the silicon oxide film containing the metallic element including a first region near a lower surface thereof, a second region near an upper surface thereof, and a third region between the first and second regions, the metallic element contained in the silicon oxide film having a density distribution in a thickness direction of the silicon oxide film, a peak of the density distribution existing in the third region, and an electrode formed on the gate dielectrics.

摘要翻译： 一种半导体器件，包括半导体衬底，形成在所述半导体衬底上并包括含有金属元素的氧化硅膜的栅极电介质，所述氧化硅膜含有所述金属元素，所述金属元素包括在其下表面附近的第一区域， 上表面和第一和第二区域之间的第三区域，包含在氧化硅膜中的金属元素在氧化硅膜的厚度方向上具有密度分布，存在于第三区域中的密度分布的峰值， 以及形成在栅极电介质上的电极。

公开(公告)号：US07618876B2

公开(公告)日：2009-11-17

申请号：US11227252

申请日：2005-09-16

申请人： Osamu Arisumi ,  Masahiro Kiyotoshi ,  Katsuhiko Hieda ,  Yoshitaka Tsunashima

发明人： Osamu Arisumi ,  Masahiro Kiyotoshi ,  Katsuhiko Hieda ,  Yoshitaka Tsunashima

IPC分类号： H01L21/76 ,  H01L21/44

CPC分类号： H01L27/11521 ,  H01L27/11524

摘要： A method of manufacturing a semiconductor device comprises forming a trench in a semiconductor substrate, forming a first insulating film having a first recessed portion in the trench, forming a coating film so as to fill the first recessed portion therewith, transforming the coating film into a second insulating film, planarizing the second insulating film to expose the first insulating film and the second insulating film, removing at least the second insulating film from the first recessed portion to moderate an aspect ratio for the first recessed portion formed in the trench, thereby forming a second recessed portion therein, and forming a third insulating film on a surface of the semiconductor substrate so as to fill the second recessed portion therewith.

摘要翻译： 一种制造半导体器件的方法包括在半导体衬底中形成沟槽，在沟槽中形成具有第一凹陷部分的第一绝缘膜，形成涂膜以便将其涂覆在第一凹部中，将涂膜转变为 第二绝缘膜，平坦化第二绝缘膜以暴露第一绝缘膜和第二绝缘膜，至少从第一凹部去除第二绝缘膜，以调节形成在沟槽中的第一凹部的纵横比，由此形成 在其中形成第二凹部，在半导体衬底的表面上形成第三绝缘膜，以便填充第二凹部。

公开(公告)号：US20070218605A1

公开(公告)日：2007-09-20

申请号：US11790033

申请日：2007-04-23

申请人： Yoshio Ozawa ,  Yasumasa Suizu ,  Yoshitaka Tsunashima

发明人： Yoshio Ozawa ,  Yasumasa Suizu ,  Yoshitaka Tsunashima

IPC分类号： H01L21/765

CPC分类号： H01L29/7881 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02211 ,  H01L21/02233 ,  H01L21/02271 ,  H01L21/28044 ,  H01L21/28202 ,  H01L21/28247 ,  H01L21/28273 ,  H01L21/3144 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/518 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/66825 ,  H01L29/7833 ,  Y10S438/911 ,  Y10S438/942 ,  Y10S438/947 ,  Y10S438/966

摘要： A method of manufacturing a MOS transistor incorporating a silicon oxide film serving as a gate insulating film and containing nitrogen and a polycrystalline silicon film serving as a gate electrode and containing a dopant and arranged such that the gate electrode is formed on the gate electrode insulating film, and an oxidation process using ozone is performed to sufficiently round the shape of the lower edge of the gate electrode.

公开(公告)号：US20070200168A1

公开(公告)日：2007-08-30

申请号：US11706999

申请日：2007-02-16

申请人： Yoshio Ozawa ,  Yoshitaka Tsunashima

发明人： Yoshio Ozawa ,  Yoshitaka Tsunashima

IPC分类号： H01L29/792

CPC分类号： H01L29/792 ,  H01L27/115 ,  H01L27/11568 ,  H01L29/4234

摘要： A MONOS type nonvolatile memory cell is structured such that a laminated insulating film which is formed by sequentially laminating a tunnel insulating layer, a charge storage insulating layer, and a charge block insulating layer is provided on a convex curved surface portion of a semiconductor substrate, and a control gate electrode is further formed thereon. A thickness of the tunnel insulating layer is set to be 4 to 10 nm, and data writing/data erasing operations are carried out by making an F-N tunneling current flow in the tunnel insulating layer.

摘要翻译： 构造为在半导体衬底的凸曲面部分上设置通过依次层叠隧道绝缘层，电荷存储绝缘层和电荷块绝缘层而形成的叠层绝缘膜的MONOS型非易失性存储单元， 并且还在其上形成控制栅电极。 将隧道绝缘层的厚度设定为4〜10nm，通过在隧道绝缘层中形成F-N隧道电流来进行数据写入/数据擦除动作。

公开(公告)号：US20060270170A1

公开(公告)日：2006-11-30

申请号：US11227252

申请日：2005-09-16

申请人： Osamu Arisumi ,  Masahiro Kiyotoshi ,  Katsuhiko Hieda ,  Yoshitaka Tsunashima

发明人： Osamu Arisumi ,  Masahiro Kiyotoshi ,  Katsuhiko Hieda ,  Yoshitaka Tsunashima

IPC分类号： H01L21/336

CPC分类号： H01L27/11521 ,  H01L27/11524

摘要： A method of manufacturing a semiconductor device comprises forming a trench in a semiconductor substrate, forming a first insulating film having a first recessed portion in the trench, forming a coating film so as to fill the first recessed portion therewith, transforming the coating film into a second insulating film, planarizing the second insulating film to expose the first insulating film and the second insulating film, removing at least the second insulating film from the first recessed portion to moderate an aspect ratio for the first recessed portion formed in the trench, thereby forming a second recessed portion therein, and forming a third insulating film on a surface of the semiconductor substrate so as to fill the second recessed portion therewith.

摘要翻译： 一种制造半导体器件的方法包括在半导体衬底中形成沟槽，在沟槽中形成具有第一凹陷部分的第一绝缘膜，形成涂膜以便将其涂覆在第一凹部中，将涂膜转变为 第二绝缘膜，平坦化第二绝缘膜以暴露第一绝缘膜和第二绝缘膜，至少从第一凹部去除第二绝缘膜，以调节形成在沟槽中的第一凹部的纵横比，由此形成 在其中形成第二凹部，在半导体衬底的表面上形成第三绝缘膜，以便填充第二凹部。

公开(公告)号：US20060244083A1

公开(公告)日：2006-11-02

申请号：US11475879

申请日：2006-06-28

申请人： Kazuhiro Eguchi ,  Seiji Inumiya ,  Yoshitaka Tsunashima

发明人： Kazuhiro Eguchi ,  Seiji Inumiya ,  Yoshitaka Tsunashima

IPC分类号： H01L29/78

CPC分类号： H01L29/511 ,  C23C16/30 ,  C23C16/45523 ,  H01L21/28176 ,  H01L21/28185 ,  H01L21/28194 ,  H01L21/28202 ,  H01L21/28211 ,  H01L21/28229 ,  H01L21/31604 ,  H01L28/56 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L29/78

摘要： A semiconductor device comprising a semiconductor substrate, a gate dielectrics formed on the semiconductor substrate and including a silicon oxide film containing a metallic element, the silicon oxide film containing the metallic element including a first region near a lower surface thereof, a second region near an upper surface thereof, and a third region between the first and second regions, the metallic element contained in the silicon oxide film having a density distribution in a thickness direction of the silicon oxide film, a peak of the density distribution existing in the third region, and an electrode formed on the gate dielectrics.

公开(公告)号：US20050170666A1

公开(公告)日：2005-08-04

申请号：US10999937

申请日：2004-12-01

申请人： Katsuyuki Sekine ,  Yoshitaka Tsunashima ,  Seiji Inumiya ,  Akio Kaneko ,  Motoyuki Sato ,  Kazuhiro Eguchi

发明人： Katsuyuki Sekine ,  Yoshitaka Tsunashima ,  Seiji Inumiya ,  Akio Kaneko ,  Motoyuki Sato ,  Kazuhiro Eguchi

IPC分类号： H01L21/316 ,  H01L21/314 ,  H01L29/78 ,  H01L21/31 ,  H01L21/469 ,  H01L21/425 ,  H01L21/22

CPC分类号： H01L21/02321 ,  H01L21/02148 ,  H01L21/02159 ,  H01L21/022 ,  H01L21/28185 ,  H01L21/28194 ,  H01L21/3143 ,  H01L21/31645 ,  H01L29/518

摘要： A manufacturing method of a semiconductor device disclosed herein, comprises: forming a silicate film containing metal on a substrate; and introducing nitrogen and deuterium into the silicate film by using ND3 gas.

摘要翻译： 本文公开的半导体器件的制造方法包括：在基板上形成含有金属的硅酸盐膜; 并通过使用ND 3 N 3气体将氮和氘引入到硅酸盐膜中。

公开(公告)号：US06790723B2

公开(公告)日：2004-09-14

申请号：US09984404

申请日：2001-10-30

申请人： Masayuki Tanaka ,  Shigehiko Saida ,  Yoshitaka Tsunashima

发明人： Masayuki Tanaka ,  Shigehiko Saida ,  Yoshitaka Tsunashima

IPC分类号： H01L218242

CPC分类号： H01L21/0217 ,  H01L21/02208 ,  H01L21/02211 ,  H01L21/3185 ,  H01L21/76801 ,  H01L21/76802 ,  H01L21/76807 ,  H01L21/76826 ,  H01L21/76831 ,  H01L21/76834 ,  H01L21/76879 ,  H01L21/76897 ,  H01L23/485 ,  H01L27/10873 ,  H01L2924/0002 ,  H01L2924/00

摘要： Hexachlorodisilane (Si2Cl6) is used as a Si raw material for forming a silicon nitride film that can be widely different in the etching rate from a silicon oxide film. The silicon nitride film is formed by an LPCVD method.

公开(公告)号：US06538271B2

公开(公告)日：2003-03-25

申请号：US09874309

申请日：2001-06-06

申请人： Shigehiko Saida ,  Yoshitaka Tsunashima

发明人： Shigehiko Saida ,  Yoshitaka Tsunashima

IPC分类号： H01L2120

CPC分类号： H01L21/3185 ,  C23C16/0218 ,  C23C16/0272 ,  C23C16/345 ,  H01L27/10852 ,  H01L27/10861

摘要： A semiconductor device comprises a semiconductor substrate and a silicon nitride film formed on the semiconductor substrate. The silicon nitride film is substantially free from an Si—H bond and has an Si—H density per unit area of 1×1015 cm−2 or less.

摘要翻译： 半导体器件包括形成在半导体衬底上的半导体衬底和氮化硅膜。 氮化硅膜基本上不含Si-H键，并且每单位面积的Si-H密度为1×10 15 cm -2以下。

公开(公告)号：US06333547B1

公开(公告)日：2001-12-25

申请号：US09478369

申请日：2000-01-06

申请人： Masayuki Tanaka ,  Shigehiko Saida ,  Yoshitaka Tsunashima

发明人： Masayuki Tanaka ,  Shigehiko Saida ,  Yoshitaka Tsunashima

IPC分类号： H01L2358

CPC分类号： H01L21/0217 ,  H01L21/02208 ,  H01L21/02211 ,  H01L21/3185 ,  H01L21/76801 ,  H01L21/76802 ,  H01L21/76807 ,  H01L21/76826 ,  H01L21/76831 ,  H01L21/76834 ,  H01L21/76879 ,  H01L21/76897 ,  H01L23/485 ,  H01L27/10873 ,  H01L2924/0002 ,  H01L2924/00

摘要： Hexachlorodisilane (Si2Cl6) is used as a Si raw material for forming a silicon nitride film that can be widely different in the etching rate from a silicon oxide film. The silicon nitride film is formed by an LPCVD method.

摘要翻译： 使用六氯二硅烷（Si 2 Cl 6）作为用于形成可能与氧化硅膜的蚀刻速率差异很大的氮化硅膜的Si原料。 氮化硅膜通过LPCVD法形成。