公开(公告)号：US06264761B1

公开(公告)日：2001-07-24

申请号：US09214635

申请日：1999-01-06

申请人： Yasushi Hasegawa ,  Eiji Tsuru ,  Yuichi Sato ,  Shigekatsu Ozaki

发明人： Yasushi Hasegawa ,  Eiji Tsuru ,  Yuichi Sato ,  Shigekatsu Ozaki

IPC分类号： C22C1903

CPC分类号： B23K35/3033 ,  B23K35/0233 ,  Y10T428/12431

摘要： The present invention provides liquid phase diffusion bonding alloy foils capable of bonding in an oxidizing atmosphere, which can ensure joints with a homogeneous structure and adequate tensile strength in air in a short period of time using various alloys or Fe-based materials as materials to be bonded; specifically, they are Ni-based liquid phase diffusion bonding alloy foils with compositions comprising as essential components in terms of atomic percent, the diffusion elements B or P at 1.0-20.0% or B and P each at 1.0-20.0%, and Si at 0.5 to ≦15% or 0.5 to

摘要翻译： 本发明提供能够在氧化气氛中结合的液相扩散接合合金箔，其可以使用各种合金或Fe基材料作为材料在短时间内确保接头具有均匀的结构和足够的抗拉强度 保税 具体地说，它们是Ni基液相扩散接合合金箔，其组成包括原子百分数，扩散元素B或P为1.0-20.0％或B和P各自为1.0-20.0％的必要组分，Si为 0.5至<= 15％或0.5至<10％，V为0.1-20.0％，余量基本为Ni和不可避免的杂质，厚度为3-100μm。 如果需要，可酌情选择性地包括一种或多种Cr，Mn或Mo，Co和/或一种或多种W，Nb和Ti。 具有基本无定形晶体结构的组合物是最有效的。

公开(公告)号：US5759300A

公开(公告)日：1998-06-02

申请号：US716314

申请日：1996-09-27

申请人： Yasushi Hasegawa ,  Hisashi Naoi ,  Yuuichi Satoh ,  Hiroshi Ukeba

发明人： Yasushi Hasegawa ,  Hisashi Naoi ,  Yuuichi Satoh ,  Hiroshi Ukeba

IPC分类号： B23K20/00 ,  B23K35/02 ,  B23K35/30 ,  C22C19/05 ,  C22C45/04

CPC分类号： B23K35/0233 ,  B23K35/3033 ,  B23K35/304 ,  Y10T428/12431 ,  Y10T428/12937 ,  Y10T428/12944

摘要： Alloy foils for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere comprise 6.0 to 15.0 percent silicon, 0.1 to 2.0 percent manganese, 0.50 to 30.0 percent chromium, 0.10 to 5.0 percent molybdenum, 0.50 to 10.0 percent vanadium, 0.02 to 1.0 percent niobium, 0.10 to 5.0 percent tungsten, 0.01 to 0.5 percent nitrogen, 0.10 to 5.0 percent boron, plus 0.005 to 1.0 percent carbon, and/or either or both of 0.01 to 5.0 percent titanium and 0.01 to 5.0 percent zirconium, all by mass, with the balance comprising nickel and impurities, and have a thickness of 3.0 to 300 .mu.m. Alloy foils for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere are also available with substantially vitreous structures.

摘要翻译： PCT No.PCT / JP95 / 00594 Sec。 371日期1996年9月27日第 102（e）1996年9月27日PCT 1995年3月29日PCT PCT。 出版物WO95 / 26419 日期：1995年10月5日耐热金属在氧化性气氛中的液相扩散接合用合金箔包含6.0〜15.0％的硅，0.1〜2.0％的锰，0.50〜30.0％的铬，0.10〜5.0％的钼，0.50〜10.0 0.01-0.0％的铌，0.10〜5.0％的钨，0.01〜0.5％的氮，0.10〜5.0％的硼，0.005〜1.0％的碳，和/或0.01〜5.0％的钛和0.01〜5.0 百分比的锆，质量均匀，余量包括镍和杂质，并且具有3.0至300μm的厚度。 用于在氧化气氛中耐热金属的液相扩散接合的合金箔也可用于基本上玻璃质结构。

公开(公告)号：US5650024A

公开(公告)日：1997-07-22

申请号：US513999

申请日：1995-08-25

申请人： Yasushi Hasegawa ,  Masahiro Ohgami ,  Nobuo Mizuhashi ,  Hisashi Naoi ,  Toshio Fujita

发明人： Yasushi Hasegawa ,  Masahiro Ohgami ,  Nobuo Mizuhashi ,  Hisashi Naoi ,  Toshio Fujita

IPC分类号： C21D6/00 ,  C21D8/02 ,  C21D8/10 ,  C22C38/22 ,  C22C38/24 ,  C22C38/26 ,  C22C38/28 ,  C22C38/40 ,  C22C38/42 ,  C22C38/44 ,  C22C38/46 ,  C22C38/52 ,  C21D8/00

CPC分类号： C22C38/22 ,  C21D6/002 ,  C22C38/24 ,  C22C38/26 ,  C22C38/28 ,  C22C38/40 ,  C22C38/42 ,  C22C38/44 ,  C22C38/46 ,  C22C38/52 ,  C21D2211/008 ,  C21D8/0205 ,  C21D8/10

摘要： A martensitic heat-resisting steel comprises, in terms of % by mass, 0.01 to 0.30% of C, 0.02 of 0.80% of Si, 0.20 to 1.00% of Mn, 5.00 to 18.00% of Cr, 0.005 to 1.00% of Mo, 0.20 to 3.50% of W, 0.02 to 1.00% of V, 0.01 to 0.50% of Nb, 0.01 to 0.25% of N, and at least one element selected from the group consisting of Ti, Zr, Ta and Hf in an amount of 0.005 to 2.0% for each of the elements, the volume of (Ti %+Zr %+Ta %+Hf %) in the metal component M of M.sub.23 C.sub.6 type carbides therein being from 5 to 65%. The heat-resisting steel is produced by a process comprising the steps ofadding Ti, Zr, Ta and Hf to a molten steel having chemical components as mentioned above, during the period from 10 minutes before completion of refining to completion of refining, casting said molten steel, working the resulting casting, solution treating said worked product, subjecting said worked product to temporary cooling stop at a temperature from 950.degree. to 1,000.degree. C. in the course of cooling said hot worked product, and holding said worked product at the temperature for 5 to 60 minutes. The heat-resisting steel is excellent in HAZ-softening resistance, and exhibits a high creep strength at high temperature of at least 550.degree. C.

摘要翻译： PCT No.PCT / JP94 / 02302 Sec。 371日期1995年8月25日 102（e）日期1995年8月25日PCT 1994年12月28日PCT公布。 公开号WO95 / 18242 日期：1995年7月6日马氏体系耐热钢以质量％计，含有0.01〜0.30％的C，0.02为0.80％的Si，0.20〜1.00％的Mn，5.00〜18.00％的Cr，0.005〜 1.0％的Mo，0.20〜3.50％的W，0.02〜1.00％的V，0.01〜0.50％的Nb，0.01〜0.25％的N，以及选自Ti，Zr，Ta和 Hf的量为0.005〜2.0％，M23C6型碳化物的金属成分M中的（Ti％+ Zr％+ Ta％+ Hf％）的体积为5〜65％。 耐热钢通过包括以下步骤的方法制造，所述方法包括以下步骤：在完成精炼至完成精炼之前的10分钟期间，将Ti，Zr，Ta和Hf加入到具有上述化学成分的钢水中，将所述 对所得到的铸件进行加工，对所述加工产品进行溶液处理，在冷却所述热加工产品的过程中，使所述加工产品在950℃至1000℃的温度下暂时冷却停止，并将所述加工的产品保持在 温度5〜60分钟。 耐热钢耐HAZ耐软化性优异，高温蠕变强度至少为550℃。

公开(公告)号：US5254307A

公开(公告)日：1993-10-19

申请号：US875685

申请日：1992-04-28

申请人： Yasushi Hasegawa ,  Masahiro Ohgami ,  Hisashi Naoi ,  Fujimitsu Masuyama

发明人： Yasushi Hasegawa ,  Masahiro Ohgami ,  Hisashi Naoi ,  Fujimitsu Masuyama

IPC分类号： B22D23/00 ,  C21C7/00 ,  C22C38/00 ,  C22C38/26 ,  C22C38/22 ,  B22D1/00 ,  C22C38/24

CPC分类号： C22C38/26 ,  C22C38/00

摘要： A high-nitrogen ferritic heat-resisting steel with high niobium content comprises, in weight per cent, 0.01-0.30% C, 0.02-0.80% Si, 0.20-1.00% Mn, 8.00-13.00% Cr, 0.005-1.00% Mo, 0.20-1.50% W, 0.05-1.00% V, over 0.12 up to 2.00% Nb and 0.10-0.50%N, the balance being Fe and unavoidable impurities. A method of producing the steel comprises melting and equilibrating the steel components in an atmosphere of a mixed gas of a prescribed nitrogen partial pressure or nitrogen gas and thereafter casting or solidifying the resulting melt in an atmosphere controlled to have a total pressure of not less than 2.5 bar and a nitrogen partial pressure of not less than 1.0 bar, with the relationship between the nitrogen partial pressure p and the total pressure P beingP>2.5p.

公开(公告)号：US08955887B2

公开(公告)日：2015-02-17

申请号：US12737847

申请日：2009-08-19

申请人： Eiji Tsuru ,  Yasushi Hasegawa ,  Yasuhiro Shinohara ,  Yuichi Sato

发明人： Eiji Tsuru ,  Yasushi Hasegawa ,  Yasuhiro Shinohara ,  Yuichi Sato

IPC分类号： F16L13/14 ,  F16L13/00 ,  B23K20/02 ,  B23K20/00 ,  B23K33/00 ,  F16L13/02

CPC分类号： B23K20/023 ,  B23K20/002 ,  B23K33/006 ,  B23K2101/06 ,  F16L13/0227

摘要： A liquid phase diffusion bonded pipe joint comprised of metal pipes or a metal pipe and a joint pipe joined by liquid phase diffusion bonding, the liquid phase diffusion bonded pipe joint comprised of a metal joint provided with a tapered slanted part press-fit into an end of a metal pipe by a thrust in a pipe axial direction while expanding the metal pipe in inside diameter and tightly engaging with the end and a joining surface part continuing from the tapered slanted part and joined with an end face of the metal pipe by liquid phase diffusion bonding and a metal pipe tightly engaging with the tapered slanted part in the expanded state and with an end face joined with the joining surface part by liquid phase diffusion bonding.

摘要翻译： 由金属管或金属管构成的液相扩散接合管接头和通过液相扩散接合接合的接合管，液相扩散接合管接头由金属接头组成，金属接头设置有锥形倾斜部分， 的金属管，同时使金属管内径扩大并与端部紧密接合，以及接合面部分与锥形倾斜部分连续并且通过液相与金属管的端面接合 扩散接合和与扩张状态的锥形倾斜部紧密接合的金属管，并且通过液相扩散接合与接合表面部分接合的端面。

公开(公告)号：US08572839B2

公开(公告)日：2013-11-05

申请号：US12500041

申请日：2009-07-09

申请人： Yasushi Hasegawa

发明人： Yasushi Hasegawa

IPC分类号： H05K3/20

CPC分类号： H05K3/0097 ,  H05K1/0269 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/09918 ,  H05K2201/10598 ,  H05K2201/209 ,  H05K2203/0169 ,  H05K2203/1476 ,  H05K2203/162 ,  H05K2203/166 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49789 ,  Y10T29/49895

摘要： A fabrication method for a multi-piece board having a frame part and multi piece parts each having a printed wiring board includes producing the frame part having a first coupling portion, and the multi-piece parts including piece parts each having a second coupling portion coupled to the first coupling portion at a production panel with at least the frame part and the piece parts being separated from each other, separating the frame part and the multi-piece parts from the production panel, and coupling the first coupling portion to the second coupling portion to couple the frame part and the piece parts and combine the frame part and the multi piece parts so as to yield the multi-piece board.

摘要翻译： 一种具有框架部分和多片部分的多片板的制造方法，每个具有印刷线路板包括制造具有第一联接部分的框架部分，并且所述多片部件包括件部件，每个部件具有联接的第二联接部分 在至少框架部分和零件彼此分离的生产面板处的第一联接部分处，将框架部分和多件部件与生产面板分离，并将第一联接部分连接到第二联接器 联接框架部分和零件，并且组合框架部分和多件部件以产生多片板。

公开(公告)号：US08079014B2

公开(公告)日：2011-12-13

申请号：US11822728

申请日：2007-07-09

申请人： Manabu Watanabe ,  Yutaka Nakano ,  Kenji Ueda ,  Mitsuharu Kurashige ,  Yasushi Hasegawa ,  Hiroyuki Morozumi ,  Sueki Itoyama

发明人： Manabu Watanabe ,  Yutaka Nakano ,  Kenji Ueda ,  Mitsuharu Kurashige ,  Yasushi Hasegawa ,  Hiroyuki Morozumi ,  Sueki Itoyama

IPC分类号： G06F9/44

CPC分类号： G06F11/3664

摘要： A software development apparatus capable of mitigating troublesomeness involved in the development of software to be executed by a multi-core processor. A processor core identifier identifies one of processor cores with which software development information (project information, program development support information, debugging information, etc.) for developing software is associated. In accordance with the identification result, a display processor displays the association between the software development information and the corresponding processor core in a visually distinguishable manner.

摘要翻译： 一种软件开发装置，其能够减轻由多核处理器执行的软件开发涉及的麻烦。 处理器核心标识符识别用于开发软件的软件开发信息（项目信息，程序开发支持信息，调试信息等）相关联的处理器核心之一。 根据识别结果，显示处理器以视觉上可区别的方式显示软件开发信息和对应的处理器核心之间的关联。

公开(公告)号：US20110129381A1

公开(公告)日：2011-06-02

申请号：US11661054

申请日：2005-05-02

申请人： Yasushi Hasegawa ,  Naoki Saitoh ,  Youichi Tanaka

发明人： Yasushi Hasegawa ,  Naoki Saitoh ,  Youichi Tanaka

IPC分类号： C22C38/00 ,  C22C38/04 ,  C22C38/12 ,  C22C38/08 ,  C22C38/16 ,  C22C38/22 ,  B21B23/00

CPC分类号： C21D8/0247 ,  C21D8/00 ,  C21D8/021 ,  C21D2211/002 ,  C21D2211/004 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/12 ,  C22C38/14 ,  Y02P10/212

摘要： The present invention provides a high-tensile steel material having a tensile strength of the 550 MPa class or more which can simultaneously raise the strength and toughness of the heat affected zone of weld to equal those of the matrix and a method of production of the same, that is, a high-tensile steel material with excellent weldability and toughness and with tensile strength of the 550 MPa class or more containing, by mass %, C: 0.005 to 0.10%, W: 0.10 to 3.0%, Nb: 0.010 to 0.080%, and V: 0.010 to 0.50%, limiting the Ti to less than 0.005%, satisfying equation; EC=2[C]−[Nb]/9−[V]/12>0.020, having an amount of precipitation of W contained in the steel material, in terms of analytical value obtained by quantitative analysis of potential electrolysis extraction residue by fluorescent X-ray analysis, of 0.0050% or less, and having 60% or more of its structural composition in a cross-section of the steel as a bainite structure.

摘要翻译： 本发明提供一种拉伸强度为550MPa以上的高强度钢材料，其能够同时将焊接热影响区域的强度和韧性提高至与基体相同的强度和韧性，以及其制造方法 即，具有优异的焊接性和韧性，拉伸强度为550MPa以上的高强度钢材，以质量％计含有C：0.005〜0.10％，W：0.10〜3.0％，Nb：0.010〜 0.080％，V：0.010〜0.50％，将Ti限制在小于0.005％，满足公式; 对于钢材中含有的W的析出量的EC = 2 [C] - [Nb] / 9- [V] / 12> 0.020，以通过荧光的电位电解提取残留物的定量分析得到的分析值 X射线分析为0.0050％以下，在作为贝氏体组织的钢的截面中具有60％以上的结构组成。

公开(公告)号：US20110002808A1

公开(公告)日：2011-01-06

申请号：US12736153

申请日：2009-10-15

申请人： Masaki Mizoguchi ,  Yasushi Hasegawa ,  Yoshiyuki Watanabe

发明人： Masaki Mizoguchi ,  Yasushi Hasegawa ,  Yoshiyuki Watanabe

IPC分类号： C22C38/00 ,  C21D8/00 ,  C22C38/20 ,  C22C38/18 ,  C22C38/12 ,  C22C38/22 ,  C22C38/08 ,  C22C38/32 ,  B21B27/06

CPC分类号： C22C38/02 ,  C21D1/25 ,  C21D8/0226 ,  C21D9/50 ,  C21D2211/005 ,  C21D2211/008 ,  C22C38/001 ,  C22C38/04 ,  C22C38/06 ,  C22C38/26 ,  C22C38/28

摘要： The present invention provides a fire-resistant steel material superior in weld heat affected zone reheat embrittlement resistance and low temperature toughness when welded by large heat input and exposed to fire and a method of production of the same, that is, a material containing C: 0.012 to 0.050%, Mn: 0.80 to 2.00%, Cr: 0.80 to 1.90%, and Nb: 0.01 to less than 0.05%, restricting Cu to 0.10% or less, containing suitable quantities of Si, N, Ti, and Al, restricting the contents of Mo, B, P, S, and O, and having a balance of Fe and unavoidable impurities, having contents of C, Mn, Cr, Nb, and Cu satisfying −1200C−20Mn+30Cr−330Nb−120Cu≧−80, having a steel structure as observed by an optical microscope of an area fraction of 80% or more of a ferrite phase, and having a balance of the steel structure of a bainite phase, martensite phase, and mixed martensite-austenite structure.

摘要翻译： 本发明提供一种在大热输入焊接并暴露于火中时，焊接热影响区域再热脆化性和低温韧性优异的耐火钢材及其制造方法，即含有C： 0.012〜0.050％，Mn：0.80〜2.00％，Cr：0.80〜1.90％，Nb：0.01〜小于0.05％，限制Cu为0.10％以下，含有适量的Si，N，Ti，Al， 含有满足-1200C-20Mn + 30Cr-330Nb-120Cu≥C的含有C，Mn，Cr，Nb和Cu的Fe和不可避免的杂质的余量的Mo，B，P，S和O的含量。 -80，具有通过光学显微镜观察到的铁素体相的80％以上的面积分率的钢结构，并且具有贝氏体相，马氏体相和混合马氏体 - 奥氏体组织的钢结构的平衡。

公开(公告)号：US20070272881A1

公开(公告)日：2007-11-29

申请号：US11714115

申请日：2007-03-06

申请人： Yasushi Hasegawa

发明人： Yasushi Hasegawa

IPC分类号： G02B27/00

CPC分类号： H04B10/801 ,  H01L2224/0603 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/181 ,  H05K1/0203 ,  H05K3/3447 ,  H05K2201/10121 ,  H05K2201/10386 ,  H05K2201/10553 ,  H05K2201/1056 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012

摘要： In an embodiment of an optically coupled semiconductor device of the present invention, the optically coupled semiconductor device is provided with a resin sealing portion and lead drawing portions. The resin sealing portion integrally seals a power control semiconductor element chip, an firing light-receiving element chip for firing the power control semiconductor element chip, and a light-emitting element chip optically coupled with the firing light-receiving element, for converting an electric signal into an optical signal. The lead drawing portions are connected to the power control semiconductor element chip, the firing light-receiving element, and the light-emitting element chip, and are drawn out of the resin sealing portion. The optically coupled semiconductor device is further provided with a U-shaped radiator having extended portions that extend in an extending direction intersecting a drawing direction of the lead drawing portions and that are operable to hold the resin sealing portion therebetween.

摘要翻译： 在本发明的光耦合半导体器件的实施例中，光耦合半导体器件设置有树脂密封部分和引线引出部分。 树脂密封部分一体地密封功率控制半导体元件芯片，用于点燃功率控制半导体元件芯片的点火光接收元件芯片和与点火光接收元件光学耦合的发光元件芯片，用于转换电 信号变成光信号。 引线部分连接到功率控制半导体元件芯片，点火光接收元件和发光元件芯片，并从树脂密封部分拉出。 所述光耦合半导体器件还具有U形散热器，所述U形散热器具有延伸部分，所述延伸部分沿与所述引线引导部分的拉出方向相交的延伸方向延伸，并且可操作以将所述树脂密封部分保持在其间。