摘要:
It is an object to provide a semiconductor memory device that can conduct the equalizing operation of bit lines with a low current consumption while maintaining a normal accessing speed and the chip area, and a control method thereof. In a semiconductor memory device of the shared sense amplification system, in a predetermined number of times which is (k−1) times or less among k-times of continuous word line selections of a selected memory block, the bit line separation gate of the unselected memory block is rendered conductive in the active period of the equalizing unit after the word line selection. Also, a circuit that equalizes a wiring higher in the capacity component is driven by a higher voltage level according to the wiring capacity component of the sense amplification power supply line and the bit lines, to thereby equalize the power supply line and the bit line in the equal time, thereby being capable of preventing the short-circuiting within the sense amplifier.
摘要:
There is provided memory control device and memory control method, which can prevent wiring complication by many crossing wirings, and reduction of yield and quality. When a memory control device CC1 selects a memory chip CC2, an internal circuit of a select circuit 27 is changed by a switch signal SWS2. In this case, the changeover is made so that a select signal S2 outputted from an internal circuit 40 is inputted to a predetermined memory terminal of the memory chip CC2. The select signal S2 is inputted to the corresponding predetermined memory terminal of the memory chip CC2, and thereby, the memory chip CC2 is activated, and set to a state capable of inputting and outputting control signals 21 to 25. The control signals 21 to 25 are assigned to control terminals P21 to P27 after being hanged by the select circuit 27 in signal sequence corresponding to terminal array sequence of memory terminals 21a to 27a of the memory chip CC2.
摘要:
An object is to provide a semiconductor device in which it is possible to determine whether or not a minute delay time given by a delay circuit is within a specified value or not, and a method of testing the semiconductor device. In response to a data strobe signal TDQS for testing, the delay circuits DC0 and DC1 produce delay data strobe signals IDQS0 and IDQS1 delayed by delay times DT0 and DT1. Outputted as a reverse signal from the inverter INV0, is a reverse data strobe signal RIDQS0 in response to the delay data strobe signal IDQS0, and delayed by an allowable delay time IT. Inputted into the NAND gate ND0, are the reverse data strobe signal RIDQS0 and the delay data strobe signal IDQS1. When, in comparison with the phase of the delay data strobe signal IDQS0, the phase of the delay data strobe signal IDQS1 is delayed by the allowable delay time IT or more, a pulse signal PL0 is not outputted from the NAND gate ND0.
摘要:
It is intended to provide a memory control device and memory control method capable of reducing charge/discharge current consumed while various commands are inputted to a semiconductor memory device and reducing occurrence of power noises. During periods TT1, TT2, and TT3 which are parts of a period tCKE in which a clock enable signal CKE is in active state, supply of a control clock SD_CLK from a memory control device 1 to a synchronous-type semiconductor memory device 12 can be stopped. Furthermore, in case an input of a data input/output period of an external command and that of refresh operation period of a refresh command RCMD overlap and an access region of the external command and that of the refresh command RCMD do not coincide, those commands are converted to control command signal SD_CMD in parallel, whereby parallel conversion processing operation can be conducted.
摘要:
There is disclosed a liquid crystal display apparatus including a main body and a swivel mechanism, where the main body is capable of smoothly swiveling. A countersunk hole is formed in a bottom plate member as follows: When a through-hole for inserting a screw is formed in a metal sheet to be a bottom plate member, there is also concurrently formed an accommodating hole for accommodating flow of the material forming the metal sheet upon plastic forming or pressing which is performed subsequently for forming a countersink, and then the countersink is formed at an open end of the through-hole by pressing. It is preferable that a plurality of the accommodating holes are formed around the through-hole.
摘要:
The present invention relates to a semiconductor device having an MCP (Multi Chip Package) structure in which a plurality of semiconductor chips are mounted in the same package, a manufacturing method therefor and a semiconductor Substrate used therein. Atop a first semiconductor chip that is a memory chip is mounted a second Semiconductor chip that is a logic chip, with a first functional chip and a second functional chip that together form the first semiconductor chip being joined together via an unsliced scribe line. Additionally, a first functional chip and a second functional chip are given the same chip composition (32-bit memory) and respectively rotated 180 degrees relative to each other. These configurations are intended to improve performance, reduce costs and improve yield.
摘要:
The present invention relates to a semiconductor device having an MCP (Multi Chip Package) structure in which a plurality of semiconductor chips are mounted in the same package, a manufacturing method therefor and a semiconductor substrate used therein. Atop a first semiconductor chip that is a memory chip is mounted a second semiconductor chip that is a logic chip, with a first functional chip and a second functional chip that together form the first semiconductor chip being joined together via an unsliced scribe line. Additionally, a first functional chip and a second functional chip are given the same chip composition (32-bit memory) and respectively rotated 180 degrees relative to each other. These configurations are intended to improve performance, reduce costs and improve yield.
摘要:
There is provided memory control device and memory control method, which can prevent wiring complication by many crossing wirings, and reduction of yield and quality. When a memory control device CC1 selects a memory chip CC2, an internal circuit of a select circuit 27 is changed by a switch signal SWS2. In this case, the changeover is made so that a select signal S2 outputted from an internal circuit 40 is inputted to a predetermined memory terminal of the memory chip CC2. The select signal S2 is inputted to the corresponding predetermined memory terminal of the memory chip CC2, and thereby, the memory chip CC2 is activated, and set to a state capable of inputting and outputting control signals 21 to 25. The control signals 21 to 25 are assigned to control terminals P21 to P27 after being hanged by the select circuit 27 in signal sequence corresponding to terminal array sequence of memory terminals 21a to 27a of the memory chip CC2.
摘要:
A semiconductor device has a normal operation mode and a test mode. A decision circuit determines whether the device has entered the test mode. A control circuit changes information related to the normal operation mode when a test mode has been entered. If the test mode is accidentally entered, then because the information related to normal operation has been changed, a user can readily determine that the device has entered the test mode.
摘要:
A drive power supply method for a semiconductor device is provided. The semiconductor device has an internal supply voltage generating circuit. First and second internal circuits are connected to the internal supply voltage generating circuit. Drive power is supplied to the first and second internal circuits from the internal supply voltage generating circuit. The second internal circuit operates in standby mode, power-down mode and active mode, so that the internal supply voltage is stably retained in the standby mode or power-down mode, and the consumed current is reduced.