摘要:
In order to eliminate a difference in ESD resistance caused by the polarities of excessive voltages applied to an external terminal and enhance the ESD resistance of a semiconductor integrated circuit device to both positive and negative overvoltages, a protection element having a thyristor structure, for protecting an internal circuit from the positive overvoltage and a protection element made up of a diode D1 for protecting the internal circuit from the negative overvoltage are provided between the external terminal and a ground potential.
摘要:
A semiconductor integrated circuit device having a read-only memory which comprises a plurality of first gate electrodes arranged on a semiconductor substrate in a first direction maintaining a predetermined distance, a plurality of second gate electrodes that are arranged among said first gate electrodes and are partly overlapped on said first gate electrodes, and regions of data-writing impurities positioned under the first and second gate electrodes. The impurities for writing data are introduced through the first or second gate electrodes using the overlappings of the first and second gate electrodes as masks.
摘要:
Vertical MISFETs are formed over drive MISFETs and transfer MISFETs. The vertical MISFETs comprise rectangular pillar laminated bodies each formed by laminating a lower semiconductor layer (drain), an intermediate semiconductor layer, and an upper semiconductor layer (source), and gate electrodes formed on corresponding side walls of the laminated bodies with gate insulating films interposed therebetween. In each vertical MISFET, the lower semiconductor layer constitutes a drain, the intermediate semiconductor layer constitutes a substrate (channel region), and the upper semiconductor layer constitutes a source. The lower semiconductor layer, the intermediate semiconductor layer and the upper semiconductor layer are each comprised of a silicon film. The lower semiconductor layer and the upper semiconductor layer are doped with a p type and constituted of a p type silicon film.
摘要:
The degree of integration and the number of rewriting of a semiconductor device having a nonvolatile memory element are improved. A first MONOS nonvolatile-memory-element and a second MONOS nonvolatile-memory-element having a large gate width compared with the first MONOS nonvolatile-memory-element are mounted together on the same substrate, and the first MONOS nonvolatile-memory-element is used for storing program data which is scarcely rewritten, and the second MONOS nonvolatile-memory-element is used for storing processed data which is frequently rewritten.
摘要:
A memory cell of a SRAM has two drive MISFETs and two vertical MISFETs. The p channel vertical MISFETs are formed above the n channel drive MISFETs. The vertical MISFETs respectively mainly consist of a square pole laminate formed of a lower semiconductor layer, intermediate semiconductor layer and upper semiconductor layer laminated in this sequence, a gate insulating film of silicon oxide formed on the surface of the side wall of the laminate, and a gate electrode formed so as to cover the side wall of the laminate. The vertical MISFETs are perfect depletion type MISFETs.
摘要:
Semiconductor regions for the suppression of short channel effects are not provided for a pMIS and an nMIS that constitute an inverter circuit of an input first stage of an I/O buffer circuit, whereas semiconductor regions for the suppression of short channel effects are provided for pMIS and nMIS of inverter circuits of the next stage of an I/O buffer circuit.
摘要:
A SRAM having its memory cell constructed to include transfer MISFETs to be controlled by word lines and a flip-flop circuit having driver MISFETs and load MISFETs. Plate electrodes of large area fixed on predetermined power source lines are arranged over the load MISFETs such that the plate electrodes over the offset region of the load MISFETs are formed with an opening. A silicon nitride film having a thickness permeable to hydrogen but not to humidity is formed over the transfer MISFETs and the driver MISFETs formed over the main surface of a semiconductor substrate and the load MISFETs formed of a polycrystalline silicon film deposited on the driver MISFETs.
摘要:
A SRAM having its memory cell constructed to include transfer MISFETs to be controlled by word lines and a flip-flop circuit having driver MISFETs and load MISFETs. Plate electrodes of large area fixed on predetermined power source lines are arranged over the load MISFETs such that the plate electrodes over the offset region of the load MISFETs are formed with an opening. A silicon nitride film having a thickness permeable to hydrogen but not to humidity is formed over the transfer MISFETs and the driver MISFETs formed over the main surface of a semiconductor substrate and the load MISFETs formed of a polycrystalline silicon film deposited on the driver MISFETs.
摘要:
Herein disclosed is a process for fabricating a semiconductor integrated circuit device which is provided with N-channel and P-channel MISFETs each having a pair of side wall spacers formed simultaneously at both the sides of a gate electrode thereof. The P-channel MISFET has its source and drain regions formed by a boron ion implantation using the gate electrode and the paired side wall spacers as a mask. The boron having a high diffusion velocity is suppressed from diffusing below the gate electrode.
摘要:
A memory cell of an SRAM has two drive MISFETs and two vertical MISFETs. The p channel vertical MISFETs are formed above the n channel drive MISFETs. The vertical MISFETs respectively mainly include a laminate formed of a lower semiconductor layer, intermediate semiconductor layer and upper semiconductor layer laminated in this sequence, a gate insulating film of silicon oxide formed on the surface of the side wall of the laminate, and a gate electrode formed so as to cover the side wall of the laminate. The vertical MISFETs are perfect depletion type MISFETs.