Semiconductor integrated circuit device and its manufacture
    41.
    发明授权
    Semiconductor integrated circuit device and its manufacture 失效
    半导体集成电路器件及其制造

    公开(公告)号:US06469325B1

    公开(公告)日:2002-10-22

    申请号:US09297513

    申请日:1999-05-03

    IPC分类号: H01L2900

    摘要: In order to eliminate a difference in ESD resistance caused by the polarities of excessive voltages applied to an external terminal and enhance the ESD resistance of a semiconductor integrated circuit device to both positive and negative overvoltages, a protection element having a thyristor structure, for protecting an internal circuit from the positive overvoltage and a protection element made up of a diode D1 for protecting the internal circuit from the negative overvoltage are provided between the external terminal and a ground potential.

    摘要翻译: 为了消除由施加到外部端子的过大电压的极性引起的ESD电阻的差异,并且提高半导体集成电路器件的正负过电压的ESD电阻,具有可控硅结构的保护元件,用于保护 在外部端子和地电位之间设置有来自正过电压的内部电路和由用于保护内部电路免于负过电压的二极管D1构成的保护元件。

    Semiconductor integrated circuit device and a method of producing the
same
    42.
    发明授权
    Semiconductor integrated circuit device and a method of producing the same 失效
    半导体集成电路器件及其制造方法

    公开(公告)号:US4898840A

    公开(公告)日:1990-02-06

    申请号:US269702

    申请日:1988-11-10

    申请人: Kousuke Okuyama

    发明人: Kousuke Okuyama

    IPC分类号: H01L21/8246 H01L27/112

    CPC分类号: H01L27/1126 H01L27/112

    摘要: A semiconductor integrated circuit device having a read-only memory which comprises a plurality of first gate electrodes arranged on a semiconductor substrate in a first direction maintaining a predetermined distance, a plurality of second gate electrodes that are arranged among said first gate electrodes and are partly overlapped on said first gate electrodes, and regions of data-writing impurities positioned under the first and second gate electrodes. The impurities for writing data are introduced through the first or second gate electrodes using the overlappings of the first and second gate electrodes as masks.

    Semiconductor memory device and a method of manufacturing the same
    45.
    发明授权
    Semiconductor memory device and a method of manufacturing the same 有权
    半导体存储器件及其制造方法

    公开(公告)号:US07279754B2

    公开(公告)日:2007-10-09

    申请号:US10465550

    申请日:2003-06-20

    摘要: A memory cell of a SRAM has two drive MISFETs and two vertical MISFETs. The p channel vertical MISFETs are formed above the n channel drive MISFETs. The vertical MISFETs respectively mainly consist of a square pole laminate formed of a lower semiconductor layer, intermediate semiconductor layer and upper semiconductor layer laminated in this sequence, a gate insulating film of silicon oxide formed on the surface of the side wall of the laminate, and a gate electrode formed so as to cover the side wall of the laminate. The vertical MISFETs are perfect depletion type MISFETs.

    摘要翻译: SRAM的存储单元具有两个驱动MISFET和两个垂直MISFET。 p沟道垂直MISFET形成在n沟道驱动MISFET的上方。 垂直MISFET分别主要由以下顺序层叠的下半导体层,中间半导体层和上半导体层形成的方形极板层叠,形成在层叠体的侧壁表面上的氧化硅栅极绝缘膜,以及 形成为覆盖层叠体的侧壁的栅电极。 垂直MISFET是完全耗尽型MISFET。

    Semiconductor memory device and a method of manufacturing the same
    50.
    发明授权
    Semiconductor memory device and a method of manufacturing the same 有权
    半导体存储器件及其制造方法

    公开(公告)号:US08652895B2

    公开(公告)日:2014-02-18

    申请号:US13176196

    申请日:2011-07-05

    摘要: A memory cell of an SRAM has two drive MISFETs and two vertical MISFETs. The p channel vertical MISFETs are formed above the n channel drive MISFETs. The vertical MISFETs respectively mainly include a laminate formed of a lower semiconductor layer, intermediate semiconductor layer and upper semiconductor layer laminated in this sequence, a gate insulating film of silicon oxide formed on the surface of the side wall of the laminate, and a gate electrode formed so as to cover the side wall of the laminate. The vertical MISFETs are perfect depletion type MISFETs.

    摘要翻译: SRAM的存储单元具有两个驱动MISFET和两个垂直MISFET。 p沟道垂直MISFET形成在n沟道驱动MISFET的上方。 垂直MISFET分别主要包括由下半导体层,中间半导体层和按此顺序层叠的上半导体层形成的层压体,形成在层叠体的侧壁表面上的氧化硅栅极绝缘膜和栅电极 形成为覆盖层压体的侧壁。 垂直MISFET是完全耗尽型MISFET。