公开(公告)号：US06358131B1

公开(公告)日：2002-03-19

申请号：US09625490

申请日：2000-07-25

申请人： Kunihiko Sakurai ,  Satoshi Wakabayashi ,  Tetsuji Togawa

发明人： Kunihiko Sakurai ,  Satoshi Wakabayashi ,  Tetsuji Togawa

IPC分类号： B24B500

CPC分类号： B24B37/345 ,  B24B41/061

摘要： The present invention provides a polishing apparatus comprising a polishing table having a polishing surface, a substrate carrier having an axis about which the substrate carrier is rotatable. The substrate carrier includes a plurality of substrate holders positioned around a circle about the axis of the substrate carrier and spaced apart from each other at equal angular distances, with each of the substrate holders being adapted to hold a substrate and bring it into contact with the polishing surface. The apparatus further comprises a substrate loading device laterally spaced apart from the polishing table, in which device a substrate is picked up by one of the substrate holders which is positioned at the substrate loading device, and a substrate unloading device laterally spaced apart from the polishing table, in which device one of the substrate holders which is positioned at the substrate unloading device releases a wafer onto the unloading device. The substrate carrier is indexably rotated about the stated axis in such a manner that one of the substrate holders is selectively positioned at the loading device, while another substrate holder is positioned at the unloading device and at least one of the other substrate holders is positioned over the polishing surface.

摘要翻译： 本发明提供了一种抛光装置，其包括具有抛光表面的抛光台，具有基板载体可旋转的轴线的基板载体。 衬底载体包括多个衬底保持器，其围绕衬底载体的轴线围绕圆周定位，并以相等的角距彼此间隔开，衬底保持器中的每一个适于保持衬底并使其与 抛光面。 该装置还包括与抛光台横向间隔开的衬底加载装置，其中衬底被位于衬底装载装置的衬底保持器中的一个拾取，以及与抛光件横向间隔开的衬底卸载装置 工作台，其中位于衬底卸载装置的衬底保持器之一的装置将晶片释放到卸载装置上。 衬底载体可以以所述轴线可转动地旋转，使得衬底保持器中的一个选择性地定位在加载装置处，而另一衬底保持器定位在卸载装置处，并且至少一个衬底保持器位于 抛光面。

公开(公告)号：US06354922B1

公开(公告)日：2002-03-12

申请号：US09476905

申请日：2000-01-03

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

IPC分类号： B24B722

CPC分类号： B24B37/345 ,  B24B37/042 ,  H01L21/30625

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The transfer structure comprises a plurality of robots and is capable of changing transfer routes between the three cleaning apparatuses.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有抛光表面的转台，用于保持工件的顶环，并将工件压靠抛光表面抛光工件，用于清洁抛光工件的至少三个清洁装置和用于传送抛光工件的转印结构 在至少三个清洁装置之间。 传送结构包括多个机器人，并且能够改变三个清洁设备之间的传送路线。

公开(公告)号：US5893794A

公开(公告)日：1999-04-13

申请号：US808690

申请日：1997-02-28

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Kunihiko Sakurai

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Kunihiko Sakurai

IPC分类号： B65G49/07 ,  H01L21/677 ,  H01L21/687 ,  B24B7/06

CPC分类号： H01L21/67766 ,  H01L21/68707 ,  Y10S451/914

摘要： A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided above the robot body and has an area not smaller than the workpiece holding section.

摘要翻译： 机器人运输装置能够在不使用机械密封的情况下提供工作部件的有效防水功能。 机器人运输装置包括机器人主体，可伸缩地附接到机器人主体的臂组件和附接到臂组件的工件保持部。 机器人主体的防水盘构件设置在机器人主体的上方，具有不小于工件保持部的面积。

公开(公告)号：US08228516B2

公开(公告)日：2012-07-24

申请号：US12243249

申请日：2008-10-01

申请人： Kunihiko Sakurai

发明人： Kunihiko Sakurai

IPC分类号： G06F3/12 ,  H04N1/393

CPC分类号： H04N1/00795 ,  H04N1/00801 ,  H04N1/00811 ,  H04N1/00824 ,  H04N1/2307 ,  H04N1/233 ,  H04N1/2338 ,  H04N1/2369 ,  H04N1/2376 ,  H04N1/2392

摘要： An image formation device capable of forming a plurality of reduced images on an output medium comprises an input data acquisition unit which acquires input data, a recognizability judgment unit which judges whether each reduced image to be formed corresponding to each piece of input data acquired by the input data acquisition unit is recognizable to a user or not based on the input data and size of the reduced image to be formed, and a reduced image formation unit which forms the reduced images that are judged to be recognizable by the recognizability judgment unit on the output medium while prohibiting the formation of the reduced images that are judged to be unrecognizable by the recognizability judgment unit.

摘要翻译： 能够在输出介质上形成多个缩小图像的图像形成装置包括：输入数据获取单元，其获取输入数据;识别判断单元，判断是否根据由所述输入数据获取的每条输入数据形成的每个缩小图像; 输入数据获取单元可以基于要形成的缩小图像的输入数据和大小来识别用户，以及缩小图像形成单元，其形成被可识别性判断单元判断为可识别的缩小图像 输出介质，同时禁止形成由可识别性判断单元判断为无法识别的缩小图像。

公开(公告)号：US20100056028A1

公开(公告)日：2010-03-04

申请号：US12613016

申请日：2009-11-05

申请人： Tetsuji TOGAWA ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

发明人： Tetsuji TOGAWA ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

IPC分类号： B24B41/06

CPC分类号： B24B37/30 ,  B24B41/061 ,  B24B49/105

摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

摘要翻译： 本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。 具有弹性膜的邻接构件附接到可垂直移动构件的下表面。 邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到 垂直活动件。 连接部由具有高于邻接部的材料的柔软性的材料制成。

公开(公告)号：US07632173B2

公开(公告)日：2009-12-15

申请号：US11987978

申请日：2007-12-06

申请人： Tetsuji Togawa ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

发明人： Tetsuji Togawa ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

IPC分类号： B24B1/00

CPC分类号： B24B37/30 ,  B24B41/061 ,  B24B49/105

摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

摘要翻译： 本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。 具有弹性膜的邻接构件附接到可垂直移动构件的下表面。 邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到 垂直活动件。 连接部由具有高于邻接部的材料的柔软性的材料制成。

公开(公告)号：US07326103B2

公开(公告)日：2008-02-05

申请号：US10700984

申请日：2003-11-04

申请人： Kunihiko Sakurai ,  Gerard Moloney ,  Huey-Ming Wang ,  Jun Liu ,  Peter Lao

发明人： Kunihiko Sakurai ,  Gerard Moloney ,  Huey-Ming Wang ,  Jun Liu ,  Peter Lao

IPC分类号： B24B49/00

CPC分类号： B24B37/30 ,  B24B47/22

摘要： The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof.

摘要翻译： 本发明提供了一种具有枢转机构和方法的可垂直调节的化学机械抛光头。

公开(公告)号：US07156725B2

公开(公告)日：2007-01-02

申请号：US10481591

申请日：2002-07-10

申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

IPC分类号： B24B29/00 ,  B24B5/00

CPC分类号： B24B37/30 ,  B24B37/32

摘要： There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface.

摘要翻译： 提供了一种衬底抛光机，其包括抛光表面和用于保持衬底并使其与抛光表面接触的衬底载体。 基板载体包括载体主体，用于保持待抛光基板的表面朝向抛光表面的基板的基板保持构件。 衬底保持构件以使得衬底保持构件能够朝向和远离抛光表面移动的方式安装在载体主体上。 基板研磨机还包括基板保持部件定位装置，该基板保持部件定位装置设置在基板保持部件的与保持基板相同的一侧。 衬底保持构件定位装置具有限定腔室的柔性构件，并且在引入不可压缩流体时沿朝向抛光表面的方向膨胀。

公开(公告)号：US07083507B2

公开(公告)日：2006-08-01

申请号：US11028629

申请日：2005-01-05

申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

IPC分类号： B24B7/22

CPC分类号： B24B37/30 ,  B24B41/061

摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

摘要翻译： 本发明涉及一种用于保持待抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于与基板接触的弹性垫，以及用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于与弹性垫接触的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

公开(公告)号：US06918814B2

公开(公告)日：2005-07-19

申请号：US10145698

申请日：2002-05-16

申请人： Seiji Katsuoka ,  Manabu Tsujimura ,  Kunihiko Sakurai ,  Hiroyuki Osawa

发明人： Seiji Katsuoka ,  Manabu Tsujimura ,  Kunihiko Sakurai ,  Hiroyuki Osawa

IPC分类号： B24B37/04 ,  B24B1/00 ,  B24B27/00 ,  B24B37/10 ,  B24B37/11 ,  B24B37/27 ,  B24B37/34 ,  B24B49/12 ,  B24B53/007 ,  B24B53/017 ,  B24B49/00

CPC分类号： B24B37/345 ,  B24B27/0023 ,  B24B37/10 ,  B24B37/11 ,  B24B49/12 ,  B24B53/017 ,  Y10T29/53961

摘要： This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.