摘要:
A blood line assembly which is capable of being handled relatively easily includes a first tube, a second tube having a second tube body and two branch tubes branching from the second tube body, and a connector having plugs on which the first and branch tubes are removably fit. In the blood line assembly, by removing the first tube and the branch tubes from the connector, the first tube and the branch tubes can be connected to respective catheters positioned in a patient.
摘要:
A display medium including a light-modulating layer containing charged mobile particles assuming a color at a lightness corresponding to the dispersion state of the charged mobile particles and first particles with lower mobility than the charged mobile particles. The first particles assume a color at a lightness that is outside a lightness range that the charged mobile particles can exhibit.
摘要:
An aluminum alloy contains at least 0.0001 mass % and not more than 0.03 mass % of copper, at least 0.0005 mass % and not more than 0.2 mass % of silicon, at least 0.5 mass % and not more than 4 mass % of manganese and at least 0.5 mass % and not more than 3 mass % of iron, and the rest contains aluminum and unavoidable impurities. The aluminum alloy further contains at least one of at least 0.01 mass % and not more than 0.5 mass % of chromium, at least 0.01 mass % and not more than 0.5 mass % of titanium and at least 0.01 mass % and not more than 0.5 mass % of zirconium. An aluminum alloy foil is prepared by heating up the aluminum alloy to a temperature of at leas 350° C. and not more than 580° C., holding the same immediately after the heating up or retaining an ingot of the aluminum alloy at a temperature of at least 350° C. and not more than 530° C. for not more than 15 hours, thereafter performing hot rolling at a starting temperature of at least 350° C. and not more than 530° C., thereafter performing cold rolling and thereafter performing softening.
摘要:
There is provided a ball-grid-array semiconductor device. The semiconductor device has a semiconductor element sealed with a resin material. In addition, a lead frame is connected to the semiconductor element in the resin material. The lead frame is provided with terminal portions that protrude through the surface of the resin material.
摘要:
An object recognizing device for recognizing an object by transmitting laser light from a laser light source and receiving reflected light from the object by a light sensor, wherein the laser light source and the light sensor are disposed at a relative vertical distance of not less than 20 cm therebetween with a divergence angle .theta..sub.1 of the laser radiation emitted from the laser light source being set at a value of not more than 5 mrad and being smaller than an angle .alpha. formed between an optical axis of the laser light and an optical axis of the reflected light entering into the light sensor, and which is, therefore, capable of effectively recognizing any object even in an atmosphere containing aerosol, e.g., fog or haze.
摘要:
The present invention provides a land comprising a recess formed in a packaging portion for receiving a solder ball. The land has a main part having a size which is slightly larger than a size of the solder ball for receiving the solder ball, wherein the land further has at least a flux-escape part extending outwardly from the main part so as to form a sufficient space for allowing any excess amount of a flux to escape into the flux-escape region.
摘要:
An electrostatic flocking apparatus has a flocking chamber, an air flow producing device for supplying and discharging air into and out of the flocking chamber, a filter for allowing the air out of the flocking chamber, but preventing the fibers from being discharged out of the chamber, an air box at the bottom of the flocking chamber and having a perforated board or wire mesh, electrodes, power sources electrically connected to the electrodes, a support for supporting the workpiece and a conveyor for conveying the work into and out of the flocking chamber.
摘要:
An integrated circuit device includes a high-speed I/F circuit block which transfers data through a serial bus, and a driver logic circuit block which generates a display control signal. A first-conductivity-type transistor included in the high-speed I/F circuit block is formed in a second-conductivity-type well, and a second-conductivity-type transistor included in the high-speed I/F circuit block is formed in a first-conductivity-type well formed in a second-conductivity-type substrate to enclose the second-conductivity-type well. A first-conductivity-type transistor and a second-conductivity-type transistor included in the driver logic circuit block are formed in a region other than a region of the first-conductivity-type well for the high-speed interface circuit block.
摘要:
A vehicular integrated mirror system is provided that is supported on a vehicle body that includes a door, and has an outside mirror disposed outside a vehicle compartment and an interior mirror disposed within the vehicle compartment at a position in the proximity of the outside mirror so that, in cooperation with the outside mirror, a vehicle rear field of vision is obtained, wherein a mirror holder retaining the outside mirror and the inside mirror is swingably supported on mirror support means mounted on the vehicle body in order to change the reflection angle of the two mirror relative to a vehicle driver, and the reflection angle of the outside mirror and the inside mirror is changed by remote drive means that makes the mirror holder swing by remote operation. This enables the reflection angle of the outside mirror and the inside mirror to be remotely controlled.
摘要:
An integrated circuit device includes a first circuit block that includes low-voltage transistors (LVTr) and operates using a first high-potential power supply voltage and a first low-potential power supply voltage, a second circuit block that includes low-voltage transistors (LVTr) and operates using a second high-potential power supply voltage and a second low-potential power supply voltage that differ in power supply system from the first circuit block, and an interface circuit (I/O buffer) provided between the first circuit block and the second circuit block. The interface circuit (I/O buffer) includes medium-voltage transistors (MVTr: transistors of which the thickness of the gate insulating film is larger than that of the low-voltage transistors (LVTr)). An electrostatic discharge protection circuit formed of bidirectional diodes is provided between a first and second low-potential power supply nodes.