公开(公告)号：US20150284954A1

公开(公告)日：2015-10-08

申请号：US14680379

申请日：2015-04-07

申请人： Adam Cohen

发明人： Adam Cohen

IPC分类号： E04C2/296 ,  F16M13/02 ,  G06F3/0482 ,  G06Q10/08 ,  G06F3/0481 ,  G06F3/0486 ,  E02D27/01 ,  G06Q30/06

CPC分类号： E04C2/296 ,  E02D27/01 ,  F16M13/02 ,  G06Q10/083 ,  G06Q30/0635 ,  Y10T29/49629

摘要： Prefabricated exterior panels and slab foundation systems are disclosed for use in an integrated simple design procedure for use in low-energy use buildings. The panels include a frame formed from conventional framing methods, an inner layer of sheathing fastened to an outer side of the frame, a layer of insulation adhered to an outer surface of the inner layer of sheathing without using fasteners, and an outer layer of sheathing adhered to an outer surface said layer of insulation without using fasteners. Sets of panels are formed with openings for windows or doors. Jigs are used for constructing the panels including corner panels.

摘要翻译： 公开了预制的外板和板坯基础系统，用于在低能耗建筑物中使用的集成的简单设计程序。 面板包括由常规框架方法形成的框架，固定到框架的外侧的护套内层，不使用紧固件粘附到护套内层的外表面的绝缘层，以及护套外层 在不使用紧固件的情况下粘附在外表面上。 一组面板形成有用于窗户或门的开口。 夹具用于构造包括角板的面板。

公开(公告)号：US08856675B1

公开(公告)日：2014-10-07

申请号：US13298047

申请日：2011-11-16

申请人： Anand Agarawala ,  Adam Cohen ,  Alex Nicolaou ,  Ben Eidelson ,  Winson Chung ,  Michael Jurka ,  Patrick Dubroy

发明人： Anand Agarawala ,  Adam Cohen ,  Alex Nicolaou ,  Ben Eidelson ,  Winson Chung ,  Michael Jurka ,  Patrick Dubroy

IPC分类号： G06F3/048

CPC分类号： G06F3/0482 ,  G06F3/0488

摘要： Methods and apparatus for displaying display windows in a graphical user interface are disclosed. An example method includes opening, on a computing device, a first root browser window and spawning, from a first link in the first root browser window in response to a user toss-gesture associated with the first link, a first subordinate browser window. The example method further includes displaying, in a hierarchical display feature of the computing device, a hierarchical relationship between the first root browser window and the first subordinate browser window so as to visually indicate hierarchical subordinacy of the first subordinate browser window to the first root browser window.

摘要翻译： 公开了在图形用户界面中显示显示窗口的方法和装置。 一个示例性方法包括响应于与第一链接相关联的用户折腾手势，在第一根浏览器窗口中的第一链接，在计算设备上打开第一根浏览器窗口并产生第一下级浏览器窗口。 示例性方法还包括在计算设备的分层显示特征中显示第一根浏览器窗口和第一从属浏览器窗口之间的层次关系，以便将第一从属浏览器窗口的层次下级视觉指示到第一根浏览器 窗口。

公开(公告)号：US20120229277A1

公开(公告)日：2012-09-13

申请号：US13268292

申请日：2011-10-07

申请人： George S. Gabriel ,  Neil E. Campbell ,  Edward K. Eldreth ,  Rodney E. Gerringer ,  Josh C. Tang ,  Adam Cohen ,  Thomas R. Thibodeau

发明人： George S. Gabriel ,  Neil E. Campbell ,  Edward K. Eldreth ,  Rodney E. Gerringer ,  Josh C. Tang ,  Adam Cohen ,  Thomas R. Thibodeau

IPC分类号： G08B21/00

CPC分类号： G08B21/18

摘要： The present invention is directed to monitoring/alert systems, devices, and methods useable with animal housing units. Embodiments include a primary component, such as a system controller device, for monitoring maintenance and operational events in a housing unit and a secondary component, such as a environmental monitoring device for analyzing environmental conditions. For example, the system controller device monitors unit functions (e.g., relating to power, pre-filter(s), filter(s), fan(s), air pressure, air temperature, electrical connections, etc.) and causes alert(s) to be sent (e.g., via email or text message) if there is a malfunction or abnormal operational data. The environmental monitoring device collects environmental data (e.g., time, temperature, humidity, light, sound, carbon dioxide levels, or ammonia levels) and causes alert(s) to be sent if an abnormal environmental condition is detected. The primary and secondary components may function in connection with one another, other devices, a network, or as stand-alone devices.

摘要翻译： 本发明涉及可用于动物住房单元的监视/警报系统，装置和方法。 实施例包括用于监视壳体单元中的维护和操作事件的主要部件，例如系统控制器装置，以及用于分析环境条件的诸如环境监测装置的次要部件。 例如，系统控制器设备监视单元功能（例如，与功率，预滤波器，滤波器，风扇，空气压力，空气温度，电气连接等相关）的功能，并引起警报（ s）（如果发生故障或异常操作数据）（例如，通过电子邮件或短信）。 环境监测装置收集环境数据（例如，时间，温度，湿度，光，声音，二氧化碳水平或氨水平）并且如果检测到异常环境条件则导致发送警报。 主要和次要组件可以彼此连接起作用，其他设备，网络或独立设备。

公开(公告)号：US20120128998A1

公开(公告)日：2012-05-24

申请号：US13323995

申请日：2011-12-13

申请人： Michael S. Lockard ,  Adam Cohen ,  Vacit Arat ,  Dennis R. Smalley

发明人： Michael S. Lockard ,  Adam Cohen ,  Vacit Arat ,  Dennis R. Smalley

IPC分类号： B32B3/24 ,  B32B15/01

CPC分类号： C25D1/08 ,  B33Y70/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  Y10T137/86759 ,  Y10T428/12361 ,  Y10T428/12479 ,  Y10T428/19 ,  Y10T428/24975 ,  Y10T428/249981 ,  Y10T428/29

摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.

摘要翻译： 多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙） 用于形成结构。 在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或 第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于 最小特征尺寸。

公开(公告)号：US20080105646A1

公开(公告)日：2008-05-08

申请号：US11928061

申请日：2007-10-30

申请人： Adam Cohen ,  Michael Lockard ,  Dale McPherson

发明人： Adam Cohen ,  Michael Lockard ,  Dale McPherson

IPC分类号： C23F1/00 ,  C25D5/10

CPC分类号： C23C18/1689 ,  B33Y10/00 ,  B81C1/0019 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G03F7/00

摘要： Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching operations may be separated by intermediate post processing activities, they may be separated by cleaning operations, or barrier material removal operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.

摘要翻译： 多层结构由至少一种结构材料（例如镍）进行电化学制造，其被构造成限定期望的结构并且可以附着到基底上，并且由至少一种围绕期望的材料的牺牲材料（例如铜） 结构体。 在结构形成之后，通过多级蚀刻操作去除牺牲材料。 在一些实施例中，待移除的牺牲材料可以位于基底上或附加部件内的通道等内。 多级蚀刻操作可以通过中间后处理活动来分离，它们可以通过清洁操作或阻隔材料去除操作等分开。 障碍物可以通过与结构材料或基底接触而固定就位，或者它们可以通过牺牲材料单独固定在适当位置，并且因此在所有保留牺牲材料被蚀刻之后可以被自由地去除。

公开(公告)号：US20080105558A1

公开(公告)日：2008-05-08

申请号：US11927680

申请日：2007-10-30

申请人： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

发明人： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

IPC分类号： C25D5/10

CPC分类号： B81C1/00293 ,  B81B2201/042 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

摘要翻译： 在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。 在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。 周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。 密封材料位于开口附近。 在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。 此后，使密封材料流动，密封开口并重新固化。 在其他实施例中，添加了后层形成盖或其它外壳完成结构。

公开(公告)号：US20070045121A1

公开(公告)日：2007-03-01

申请号：US11435809

申请日：2006-05-16

申请人： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

发明人： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

IPC分类号： C25D5/02

CPC分类号： B81C1/00293 ,  B81B2201/042 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

摘要翻译： 在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。 在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。 周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。 密封材料位于开口附近。 在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。 此后，使密封材料流动，密封开口并重新固化。 在其他实施例中，添加了后层形成盖或其它外壳完成结构。

公开(公告)号：US20060283710A1

公开(公告)日：2006-12-21

申请号：US10272254

申请日：2002-10-15

申请人： Adam Cohen ,  Gang Zhang ,  Qui Le

发明人： Adam Cohen ,  Gang Zhang ,  Qui Le

IPC分类号： C25D5/02

CPC分类号： B81C1/0038 ,  B33Y10/00 ,  B81C1/00619 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D7/12 ,  C25D17/02 ,  C25D21/14 ,  H01L21/2885 ,  H01L21/76885 ,  H05K3/241

摘要： Various embodiments of the invention provide techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the electrochemical extrusion process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of a multi-layer electrochemical fabrication process.

摘要翻译： 本发明的各种实施例提供了通过电化学挤出方法形成结构（例如HARMS型结构）的技术。 优选的实施方案通过沉积通过无阳极适应的接触掩模进行挤出过程，其最初被压在基底上，然后随着沉积增厚逐渐拉开或分离。 沉积图案可以通过在掩模和衬底元件之间包括更复杂的相对运动而在沉积过程中变化。 这种复杂运动可以包括旋转分量或具有不与分离轴平行的分量的平移运动。 可以通过将电化学挤出工艺与多层电化学制造工艺的选择性沉积，覆盖沉积，平坦化，蚀刻和多层操作组合来形成更复杂的结构。

公开(公告)号：US20060282065A1

公开(公告)日：2006-12-14

申请号：US11444999

申请日：2006-05-31

申请人： Adam Cohen

发明人： Adam Cohen

IPC分类号： A61B17/29

CPC分类号： C25D1/00 ,  A61B2017/00345 ,  C25D1/003 ,  C25D5/02

摘要： Embodiments of the present invention provide mesoscale or microscale three-dimensional devices, structures, instruments, and the like. In particular, instruments that are useable in minimally invasive surgery are described that include multiple tools that are deployable from a distal end of one or more housings or retractable into a distal end of one or more housings via the applying of tension to either end of one or more chain or chain-like elements that extend from the proximal end of the one or more housings.

摘要翻译： 本发明的实施例提供中尺度或微尺寸的三维装置，结构，仪器等。 特别地，描述了可在微创手术中使用的器械，其包括可从一个或多个壳体的远端展开的多个工具，或者可以通过向一个或多个外壳的任一端施加张力而缩回到一个或多个外壳的远端 或更多的链条或链状元件，其从一个或多个外壳的近端延伸。

公开(公告)号：US20050199583A1

公开(公告)日：2005-09-15

申请号：US11029218

申请日：2005-01-03

申请人： Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

发明人： Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

IPC分类号： B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  C25D5/02 ,  C25D5/10 ,  H01L21/44 ,  H01L21/4763

CPC分类号： C25D1/003 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/1653 ,  C25D5/022 ,  C25D5/10

摘要： Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.