E-beam inspection apparatus and method of using the same on various integrated circuit chips
    47.
    发明授权
    E-beam inspection apparatus and method of using the same on various integrated circuit chips 有权
    电子束检查装置及其在各种集成电路芯片上的使用方法

    公开(公告)号:US09496119B1

    公开(公告)日:2016-11-15

    申请号:US14989743

    申请日:2016-01-06

    Abstract: The present invention discloses an e-beam inspection tool, and an apparatus for detecting defects. In one aspect is described an apparatus for detecting defects that includes a dual-deflection system that moves the e-beam over the integrated circuit to each of the plurality of predetermined locations, the dual deflection system including a magnetic deflection component that provides by magnetic deflection for movement of the e-beam through a plurality of areas on the integrated circuit and an electrostatic deflection component that provides by electrostatic deflection for movement of the e-beam within each of the plurality of areas.

    Abstract translation: 本发明公开了一种电子束检查工具和用于检测缺陷的装置。 在一个方面中描述了一种用于检测缺陷的装置,其包括将集成电路上的电子束移动到多个预定位置中的每一个的双偏转系统,双偏转系统包括通过磁偏转提供的磁偏转部件 用于电子束通过集成电路上的多个区域的移动;以及静电偏转部件,静电偏转部件通过静电偏转来提供电子束在多个区域的每一个内的移动。

Patent Agency Ranking