公开(公告)号：US20190304818A1

公开(公告)日：2019-10-03

申请号：US16370810

申请日：2019-03-29

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L21/67 ,  B65G47/91

Abstract: The present invention relates to a system for transferring a micro LED, the system not only releasing a grip force of a transfer head when transferring a micro LED to a substrate but also applying an additional force to the micro LED from below the substrate to attract the micro LED onto the substrate.

公开(公告)号：US20190064094A1

公开(公告)日：2019-02-28

申请号：US16112554

申请日：2018-08-24

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01N27/12 ,  G01N27/30 ,  G01N27/406

Abstract: The present invention relates to a gas sensor that measures the concentration of gas through a sensing membrane and a gas sensor package having the same and, more particularly, to a gas sensor and a gas sensor package having the same that can ensure high thermal efficiency and uniform heat transfer to make it possible to be sufficiently heated with low power consumption and to precisely measure gas concentration.

公开(公告)号：US20170338383A1

公开(公告)日：2017-11-23

申请号：US15468717

申请日：2017-03-24

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L33/48 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L21/481 ,  H01L21/4846 ,  H01L23/00 ,  H01L23/498 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/81385 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/85439 ,  H01L2933/0033 ,  H01L2933/0066

Abstract: A method for manufacturing a chip-mounting substrate includes a pre-coating step of forming a precoat on a substrate including a plurality of conductive portions and an insulating portion interposed between the conductive portions, an etching step of etching at least a portion of the precoat through a laser to form a pattern, and a step of forming a metal layer on the substrate. The pattern is disposed on at least one of the conductive portions, and the metal layer is formed in the pattern.

公开(公告)号：US20250020690A1

公开(公告)日：2025-01-16

申请号：US18764351

申请日：2024-07-04

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/067

Abstract: A guide member, an inspection device, and an electro-conductive contact pin for improving inspection reliability with respect to an inspection object are proposed.

公开(公告)号：US20240426872A1

公开(公告)日：2024-12-26

申请号：US18747458

申请日：2024-06-19

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/067

Abstract: Proposed are a metal product, a method of manufacturing the same, and a test device having the same. More particularly, proposed are a metal product that has a high degree of freedom of shape and reliability and improves test reliability for a test object, a method of manufacturing the same, and a test device having the same.

公开(公告)号：US20240417856A1

公开(公告)日：2024-12-19

申请号：US18704378

申请日：2022-10-19

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Young Heum EOM ,  Jun Young CHOI

IPC: C23C16/458

Abstract: The present invention relates to a susceptor which seats a substrate on the upper surface thereof during a deposition process for the substrate, the susceptor comprising: a first plate; a second plate provided under the first plate; and a planar heater provided between the first and second plates, wherein the planar heater is in the form of a plane, and a heating pattern formed to have a large area corresponding to the area of the plane is provided inside the planar heater. Accordingly, the present invention provides a susceptor in which a uniform temperature is formed over the entire area thereof without the risk of disconnection.

公开(公告)号：US20240390971A1

公开(公告)日：2024-11-28

申请号：US18674384

申请日：2024-05-24

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: B22C9/06 ,  B22C3/00

Abstract: Proposed are a method of manufacturing a metal product that uses an anodic aluminum oxide film and a patternable material together, in which a space where the metal product is manufactured is formed by the patternable material and the anodic aluminum oxide film provides structural support to the patternable material; and a mold using an anodic aluminum oxide film used therefor.

公开(公告)号：US20240186533A1

公开(公告)日：2024-06-06

申请号：US18285852

申请日：2022-04-07

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Young Heum EOM ,  Sin Seok HAN

IPC: H01M4/90 ,  H01M4/86 ,  H01M8/10 ,  H01M8/1004

CPC classification number: H01M4/9016 ,  H01M4/8605 ,  H01M4/8657 ,  H01M8/1004 ,  H01M2008/1095

Abstract: The present invention provides a membrane-electrode assembly for a fuel cell, and a fuel cell comprising same, wherein the cross-sectional area for reaction activation can be increased compared to the prior art, and the reaction area can be made uniform for each product compared to the prior art by making reaction gases (H2 and O2) undergo an ionization process while reacting with catalyst material, provided on the inner walls of regularly arranged pores, while moving through channels following the pores.

公开(公告)号：US20240186116A1

公开(公告)日：2024-06-06

申请号：US18373279

申请日：2023-09-27

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Young Heum EOM ,  Tae Hwan SONG

IPC: H01J37/32 ,  C23C16/455 ,  C25D11/18

CPC classification number: H01J37/3244 ,  C23C16/45563 ,  C25D11/18 ,  H01J2237/3321 ,  H01J2237/3323

Abstract: Proposed are a metal part used in a display or semiconductor manufacturing process and a process chamber having the part. More particularly, proposed are a metal part that enables a film of uniform thickness to be formed on a surface of a substrate to be processed due to high emissivity thereof, and a process chamber having the same.

公开(公告)号：US20240118337A1

公开(公告)日：2024-04-11

申请号：US18485262

申请日：2023-10-11

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R31/28 ,  G01R1/073

CPC classification number: G01R31/2887 ,  G01R1/07371

Abstract: Proposed are a guide plate and a test device including the guide plate capable of being insulated from electrically conductive contact pins and capable of blocking signal interference between the electrically conductive contact pins.