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公开(公告)号：US11569574B2
公开(公告)日：2023-01-31
申请号：US16418231
申请日：2019-05-21
Applicant: RAYTHEON COMPANY
Inventor： James E. Benedict , John P. Haven , Peter J. Adams , Thomas V. Sikina
Abstract: A wave phased array is manufactured using additive manufacturing technology (AMT). The wave phased array includes a radiator, a radiator dilation layer supporting the radiator, a beamformer supporting the radiator dilation layer, a beamformer dilation layer supporting the beamformer, and a substrate support layer supporting the beamformer dilation layer. At least one of the radiator, the radiator dilation layer, the beamformer, the beamformer dilation layer and the substrate support layer is fabricated at least in part by an AMT process.
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公开(公告)号：US11497118B2
公开(公告)日：2022-11-08
申请号：US17174904
申请日：2021-02-12
Applicant: RAYTHEON COMPANY
Inventor： Channing Paige Favreau , James E. Benedict , Mikhail Pevzner , Thomas V. Sikina
Abstract: A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.
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公开(公告)号：US20220294123A1
公开(公告)日：2022-09-15
申请号：US17200155
申请日：2021-03-12
Applicant: RAYTHEON COMPANY
Inventor： Thomas V. Sikina , Channing P. Favreau , Erika Klek
Abstract: A dual-polarized PCB array antenna includes one or more PCBs and a radiating antenna array. Each PCB has a PCB mounting surface that extends from a first PCB end to an opposing second PCB end. The radiating antenna array includes one or more radiator substrates. Each radiator substrate has a patch mounting surface that extends from a first substrate end to an opposing second substrate end. The dual-polarized PCB array antenna further includes one or more orthogonal interfaces configured to arrange the patch mounting surface of a given radiator substrates in an orthogonal position with respect to the PCB mounting surface of a given PCB.
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公开(公告)号：US11375609B2
公开(公告)日：2022-06-28
申请号：US17091585
申请日：2020-11-06
Applicant: RAYTHEON COMPANY
Inventor： Thomas V. Sikina , James E. Benedict , John P. Haven , Andrew R. Southworth , Semira M. Azadzoi
Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
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45.发明授权公开(公告)号：US11122692B1
公开(公告)日：2021-09-14
申请号：US16898930
申请日：2020-06-11
Applicant: RAYTHEON COMPANY
Inventor： James E. Benedict , Gregory G. Beninati , Mikhail Pevzner , Thomas V. Sikina , Andrew R. Southworth
Abstract: A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.
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Patent Agency Ranking
公开(公告)号：US20210249771A1
公开(公告)日：2021-08-12
申请号：US16786881
申请日：2020-02-10
Applicant: RAYTHEON COMPANY
Inventor： Jack J. Schuss , Phillip W. Thiessen , Thomas V. Sikina
Abstract: A dual band frequency selective radiator array includes a high band radiator array disposed on a dielectric layer for transmitting and receiving high band radar signals; a low band radiator array disposed on a front side of the high band radiator array for transmitting and receiving low band radar signals; a frequency selective surface (FSS) tuned to the high band radar signals forming a surface of the low band radiator array and passes the high band radar signals to the high band radiator array; and a single aperture disposed in front of the low band radiator array, the high band radiator array and the FSS for both the low band radiator array and the high band radiator array for transmitting and receiving the radar signals.
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公开(公告)号：US11089673B2
公开(公告)日：2021-08-10
申请号：US16517043
申请日：2019-07-19
Applicant: RAYTHEON COMPANY
Inventor： Andrew Southworth , Kevin Wilder , James Benedict , Mary K. Herndon , Thomas V. Sikina , John P. Haven
IPC: H05K1/02 , H05K1/09 , H05K1/11 , H05K1/14 , H05K3/00 , H05K3/04 , H05K3/10 , H05K3/22 , H05K3/34 , H05K3/36 , H05K3/40 , H05K3/46 , H01L21/00 , H01L21/205 , H01L23/48 , H01L23/60 , H01L23/522 , H01L23/528 , H05K9/00 , H01Q1/38 , H01Q1/52 , H05K3/30
Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.
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公开(公告)号：US20210022238A1
公开(公告)日：2021-01-21
申请号：US16517043
申请日：2019-07-19
Applicant: RAYTHEON COMPANY
Inventor： Andrew Southworth , Kevin Wilder , James Benedict , Mary K. Herndon , Thomas V. Sikina , John P. Haven
Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.
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公开(公告)号：US10813210B2
公开(公告)日：2020-10-20
申请号：US16184571
申请日：2018-11-08
Applicant: RAYTHEON COMPANY
Inventor： Semira M. Azadzoi , James E. Benedict , John P. Haven , Thomas V. Sikina , Andrew R. Southworth
Abstract: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.
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公开(公告)号：US20190269021A1
公开(公告)日：2019-08-29
申请号：US16287260
申请日：2019-02-27
Applicant: RAYTHEON COMPANY
Inventor： Jonathan E. Nufio-Molina , Thomas V. Sikina , James E. Benedict , Andrew R. Southworth , Semira M. Azadzoi
Abstract: A method of manufacturing a power divider circuit includes milling a conductive material disposed upon a first substrate to form a signal trace. The signal trace includes a division from a single trace to two arm traces, with each of the two arm traces having a proximal end electrically connected to the single trace and a distal end electrically connected to each of two secondary traces. The method further includes depositing a resistive ink between the two distal ends to form a resistive electrical connection between the two arm traces, bonding a second substrate to the first substrate to substantially encapsulate the traces between the first substrate and the second substrate, and milling through at least one of the first substrate or the second substrate to provide access to at least one of the traces. A signal divider is further disclosed.
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