Semiconductor device and method for manufacturing the same
    41.
    发明授权
    Semiconductor device and method for manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08815640B2

    公开(公告)日:2014-08-26

    申请号:US13652668

    申请日:2012-10-16

    IPC分类号: H01L29/26 H01L21/46

    摘要: A highly reliable semiconductor device and a method for manufacturing the semiconductor device are provided. In a semiconductor device including a bottom-gate transistor in which an insulating layer functioning as a channel protective film is provided over an oxide semiconductor film, elements contained in an etching gas can be prevented from remaining as impurities on a surface of the oxide semiconductor film by performing impurity-removing process after formation of an insulating layer provided over and in contact with the oxide semiconductor film and/or formation of source and drain electrode layers. The impurity concentration in the surface of the oxide semiconductor film is lower than or equal to 5×1018 atoms/cm3, preferably lower than or equal to 1×1018 atoms/cm3.

    摘要翻译: 提供了一种高度可靠的半导体器件和半导体器件的制造方法。 在包含作为沟道保护膜的绝缘层设置在氧化物半导体膜上的底栅晶体管的半导体器件中,可以防止包含在蚀刻气体中的元素作为杂质残留在氧化物半导体膜的表面上 通过在形成设置在氧化物半导体膜上并与氧化物半导体膜接触并且/或形成源极和漏极电极层的绝缘层之后进行杂质去除处理。 氧化物半导体膜表面的杂质浓度低于或等于5×1018原子/ cm3,优选为1×1018原子/ cm3以下。

    Semiconductor device
    42.
    发明授权

    公开(公告)号:US12100768B2

    公开(公告)日:2024-09-24

    申请号:US17606823

    申请日:2020-05-12

    IPC分类号: H01L29/786

    CPC分类号: H01L29/7869 H01L29/78651

    摘要: A semiconductor device with small variations in transistor characteristics is provided. The semiconductor device includes an oxide; a first conductor and a second conductor provided apart from each other over the oxide; an insulator in a region between the first conductor and the second conductor over the oxide; and a conductor over the insulator. A side surface of the oxide, a top surface of the first conductor, a side surface of the first conductor, a top surface of the second conductor, and a side surface of the second conductor include regions in contact with a nitride containing silicon.

    Semiconductor device and method for manufacturing the semiconductor device

    公开(公告)号:US11817507B2

    公开(公告)日:2023-11-14

    申请号:US17667655

    申请日:2022-02-09

    IPC分类号: H01L29/786

    CPC分类号: H01L29/7869

    摘要: A semiconductor device having a high on-state current is provided.
    The semiconductor device includes a first oxide; a first conductor and a second conductor provided over the first oxide to be separated from each other; and a second oxide provided over the first oxide and between the first conductor and the second conductor. Each of the first oxide and the second oxide has crystallinity, the first oxide includes a region where a c-axis is aligned substantially perpendicularly to a top surface of the first oxide, and the second oxide includes a region where the c-axis is aligned substantially perpendicularly to the top surface of the first oxide, a region where the c-axis is aligned substantially perpendicularly to a side surface of the first conductor, and a region where the c-axis is aligned substantially perpendicularly to a side surface of the second conductor.

    Semiconductor device and manufacturing method of semiconductor device

    公开(公告)号:US11031403B2

    公开(公告)日:2021-06-08

    申请号:US16605548

    申请日:2018-04-19

    摘要: A semiconductor device that can be highly integrated is provided. The semiconductor device includes a first transistor, a second transistor, a first capacitor, and a second capacitor. The first transistor includes an oxide over a first insulator, a second insulator over the oxide, a first conductor over the second insulator, a third insulator over the first conductor, a fourth insulator in contact with the second insulator, the first conductor, and the third insulator, and a fifth insulator in contact with the fourth insulator. The second transistor includes an oxide over the first insulator, a sixth insulator over the oxide, a second conductor over the sixth insulator, a seventh insulator over the second conductor, an eighth insulator in contact with the sixth insulator, the second conductor, and the seventh insulator, and a ninth insulator in contact with the eighth insulator. The first capacitor includes an oxide, a tenth insulator over the oxide, and a third conductor over the tenth insulator. The second capacitor includes an oxide, an eleventh insulator over the oxide, and a fourth conductor over the eleventh insulator.

    Semiconductor device and method for manufacturing semiconductor device

    公开(公告)号:US10978563B2

    公开(公告)日:2021-04-13

    申请号:US16698476

    申请日:2019-11-27

    IPC分类号: H01L29/26 H01L27/108

    摘要: A semiconductor device having favorable electrical characteristics is provided. The semiconductor device includes a first insulator; a first conductor over the first insulator; a second insulator over the first conductor; a first oxide over the second insulator; second and third conductors over the first oxide; a third insulator over the second and third conductors; a second oxide over the first oxide and between the second and third conductors; a fourth insulator over the second oxide; a fourth conductor over the fourth insulator; a fifth insulator in contact with the third insulator and the second oxide; a sixth insulator in contact with the first, second, third, and fifth insulators, and the second oxide; and a seventh insulator in contact with the fourth and sixth insulators, the second oxide, and the fourth conductor. The first, sixth, and seventh insulators each contain a silicon nitride. The fifth insulator contains an aluminum oxide.